View source for Flash memory

{{Short description|Electronic non-volatile computer storage device}}
[[File:USB flash drive.JPG|thumb|A disassembled USB flash drive in 2005. The chip on the left is flash memory. The [[Flash memory controller|controller]] is on the right.]]
{{Memory types}}

'''Flash memory''' is an [[Engineering:Integrated circuit|electronic]] [[Non-volatile memory|non-volatile]] [[Computer memory|computer memory]] storage medium that can be electrically erased and reprogrammed. The two main types of flash memory, '''NOR flash''' and '''NAND flash''', are named for the [[Engineering:NOR gate|NOR]] and [[Engineering:NAND gate|NAND]] [[Engineering:Logic gate|logic gate]]s. Both use the same cell design, consisting of [[Engineering:Floating-gate MOSFET|floating gate]] [[Engineering:MOSFET|MOSFET]]s. They differ at the circuit level depending on whether the state of the bit line or word lines is pulled high or low: in NAND flash, the relationship between the bit line and the word lines resembles a NAND gate; in NOR flash, it resembles a NOR gate.

Flash memory, a type of floating-gate memory, was invented at [[Company:Toshiba|Toshiba]] in 1980 and is based on [[EEPROM]] technology. Toshiba began marketing flash memory in 1987.<ref name=":0" /> [[Engineering:EPROM|EPROM]]s<!-- Not a spelling mistake: older technology EPROMs were chip erased--> had to be erased completely before they could be rewritten. NAND flash memory, however, may be erased, written, and read in blocks (or pages), which generally are much smaller than the entire device. NOR flash memory allows a single machine word to be written{{snd}} to an erased location{{snd}} or read independently. A flash memory device typically consists of one or more flash memory chips (each holding many flash memory cells), along with a separate [[Flash memory controller|flash memory controller]] chip.

The NAND type is found mainly in [[Memory card|memory card]]s, [[Engineering:USB flash drive|USB flash drive]]s, [[Solid-state drive|solid-state drive]]s (those produced since 2009), [[Engineering:Feature phone|feature phone]]s, [[Engineering:Smartphone|smartphone]]s, and similar products, for general storage and transfer of data. NAND or NOR flash memory is also often used to store configuration data in digital products, a task previously made possible by EEPROM or battery-powered static RAM. A key disadvantage of flash memory is that it can endure only a relatively small number of write cycles in a specific block.<ref name="flashstorage-2015">{{Cite news |date=30 March 2015 |title=A Flash Storage Technical and Economic Primer |work=FlashStorage.com |url=http://www.flashstorage.com/flash-storage-technical-economic-primer/ |url-status=dead |archive-url=https://web.archive.org/web/20150720220844/http://www.flashstorage.com/flash-storage-technical-economic-primer/ |archive-date=20 July 2015 }}</ref>

NOR Flash is known for its direct random access capabilities, making it apt for executing code directly. Its architecture allows for individual byte access, facilitating faster read speeds compared to NAND Flash. NAND Flash memory operates with a different architecture, relying on a serial access approach. This makes NAND suitable for high-density data storage but less efficient for random access tasks. NAND Flash is often employed in scenarios where cost-effective, high-capacity storage is crucial, such as in USB drives, memory cards, and solid-state drives (SSDs).

The primary differentiator lies in their use cases and internal structures. NOR Flash is optimal for applications requiring quick access to individual bytes, like in embedded systems for program execution. NAND Flash, on the other hand, shines in scenarios demanding cost-effective, high-capacity storage with sequential data access.

Flash memory<ref name="kingston-flash-ref">{{Cite web |year=2012 |title=Flash Memory Guide |url=https://media.kingston.com/pdfs/FlashMemGuide.pdf |url-status=live |archive-url=https://web.archive.org/web/20231019045415/https://media.kingston.com/pdfs/FlashMemGuide.pdf |archive-date=19 October 2023 |access-date=4 December 2023 |publisher=Kingston Technology |id=MKF-283US }}</ref> is used in computers, [[Social:Personal digital assistant|PDA]]s, digital audio players, [[Engineering:Digital camera|digital camera]]s, mobile phones, synthesizers, video games, [[Engineering:Scientific instrument|scientific instrument]]ation, industrial robotics, and medical electronics. Flash memory has a fast read [[Access time|access time]] but it is not as fast as static RAM or ROM. In portable devices, it is preferred to use flash memory because of its mechanical shock resistance since mechanical drives are more prone to mechanical damage.<ref name="backblaze-20180306">{{Cite web |last=Bauer |first=Roderick |date=6 March 2018 |title=HDD vs SSD: What Does the Future for Storage Hold? |url=https://www.backblaze.com/blog/ssd-vs-hdd-future-of-storage/ |url-status=live |archive-url=https://web.archive.org/web/20221222025652/https://www.backblaze.com/blog/ssd-vs-hdd-future-of-storage/ |archive-date=22 December 2022 |publisher=[[Company:Backblaze|Backblaze]] }}</ref>

Because erase cycles are slow, the large block sizes used in flash memory erasing give it a significant speed advantage over non-flash EEPROM when writing large amounts of data. {{As of|2019|post=,}} flash memory costs greatly less than byte-programmable EEPROM and had become the dominant memory type wherever a system required a significant amount of non-volatile [[Engineering:Solid-state storage|solid-state storage]]. EEPROMs, however, are still used in applications that require only small amounts of storage, as in [[Serial presence detect|serial presence detect]].<ref name="micron-tn-04-42">{{Cite web |title=Memory Module Serial Presence-Detect Introduction |url=https://www.micron.com/-/media/client/global/documents/products/technical-note/dram-modules/tn_04_42.pdf?rev=e5a1537ce3214de5b695f17c340fd023 |url-status=live |archive-url=https://web.archive.org/web/20220726125258/https://www.micron.com/-/media/client/global/documents/products/technical-note/dram-modules/tn_04_42.pdf |archive-date=26 July 2022 |access-date=1 June 2022 |publisher=[[Company:Micron Technology|Micron Technology]] |id=TN-04-42 }}</ref><ref name="ti-spd-ref">{{Cite web |date=January 1998 |title=Serial Presence Detect - Technical Reference |url=https://www.ti.com/lit/ug/smmu001/smmu001.pdf |url-status=live |archive-url=https://web.archive.org/web/20231204093906/https://www.ti.com/lit/ug/smmu001/smmu001.pdf |archive-date=4 December 2023 |publisher=[[Company:Texas Instruments|Texas Instruments]] |id=SMMU001 }}</ref>

Flash memory packages can use [[Engineering:Three-dimensional integrated circuit|die stacking]] with [[Engineering:Through-silicon via|through-silicon via]]s and several dozen layers of 3D TLC NAND cells (per die) simultaneously to achieve capacities of up to 1 [[Tebibyte|tebibyte]] per package using 16 stacked dies and an integrated flash controller as a separate die inside the package.<ref name="anandtech-20190130">{{Cite news |last=Shilov |first=Anton |date=30 January 2019 |title=Samsung Starts Production of 1 TB eUFS 2.1 Storage for Smartphones |work=[[AnandTech]] |url=https://www.anandtech.com/show/13918/samsung-starts-production-of-1-tb-eufs-21-storage-for-smartphones |url-status=live |archive-url=https://web.archive.org/web/20231102131015/https://www.anandtech.com/show/13918/samsung-starts-production-of-1-tb-eufs-21-storage-for-smartphones |archive-date=2 November 2023 }}</ref><ref name="anandtech-20171205">{{Cite news |last=Shilov |first=Anton |date=5 December 2017 |title=Samsung Starts Production of 512 GB UFS NAND Flash Memory: 64-Layer V-NAND, 860 MB/s Reads |work=[[AnandTech]] |url=https://www.anandtech.com/show/12120/samsung-starts-production-of-512-gb-ufs-chips |url-status=live |archive-url=https://web.archive.org/web/20231103145651/https://www.anandtech.com/show/12120/samsung-starts-production-of-512-gb-ufs-chips |archive-date=3 November 2023 }}</ref><ref name="isscc-2017-3d-vnand">{{Cite conference |last1=Kim |first1=Chulbum |last2=Cho |first2=Ji-Ho |last3=Jeong |first3=Woopyo |last4=Park |first4=Il-han |last5=Park |first5=Hyun-Wook |last6=Kim |first6=Doo-Hyun |last7=Kang |first7=Daewoon |last8=Lee |first8=Sunghoon |last9=Lee |first9=Ji-Sang |last10=Kim |first10=Wontae |first11=Jiyoon |last11=Park |last12=Ahn |first12=Yang-lo |last13=Lee |first13=Jiyoung |last14=Lee |first14=Jong-Hoon |last15=Kim |first15=Seungbum |last16=Yoon |first16=Hyun-Jun |first17=Jaedoeg |last17=Yu |first18=Nayoung |last18=Choi |last19=Kwon |first19=Yelim |last20=Kim |first20=Nahyun |first21=Hwajun |last21=Jang |last22=Park |first22=Jonghoon |last23=Song |first23=Seunghwan |first24=Yongha |last24=Park |last25=Bang |first25=Jinbae |last26=Hong |first26=Sangki |last27=Jeong |first27=Byunghoon |last28=Kim |first28=Hyun-Jin |first29=Chunan |last29=Lee |first30=Young-Sun |last30=Min |display-authors=29 |year=2017 |title=11.4 a 512Gb 3b/Cell 64-stacked WL 3D V-NAND flash memory |conference=International Solid-State Circuits Conference |location=San Francisco |publisher=[[Organization:Institute of Electrical and Electronics Engineers|IEEE]] |pages=202–203 |doi=10.1109/ISSCC.2017.7870331 |isbn=978-1-5090-3758-2 |issn=2376-8606 |s2cid=206998691 }}</ref><ref name="hexus-20190131">{{Cite news |last=Tyson |first=Mark |title=Samsung enables 1TB eUFS 2.1 smartphones |work=Hexus |url=https://hexus.net/tech/news/storage/127010-samsung-enables-1tb-eufs-21-smartphones/ |url-status=live |archive-url=https://web.archive.org/web/20230423114928/https://hexus.net/tech/news/storage/127010-samsung-enables-1tb-eufs-21-smartphones/ |archive-date=23 April 2023 }}</ref>

==History==
===Background===
The origins of flash memory can be traced back to the development of the [[Engineering:Floating-gate MOSFET|floating-gate MOSFET (FGMOS)]], also known as the floating-gate transistor.<ref name="economist">{{Cite news |date=11 March 2006 |title=Not just a flash in the pan |agency={{wipe|Reuters}} |url=https://www.economist.com/technology-quarterly/2006/03/11/not-just-a-flash-in-the-pan |url-status=live |url-access=limited |access-date=10 September 2019 |archive-url=https://web.archive.org/web/20231121163825/https://www.economist.com/technology-quarterly/2006/03/11/not-just-a-flash-in-the-pan |archive-date=21 November 2023 |newspaper=[[Finance:The Economist|The Economist]] }}</ref><ref name="Bez">{{cite book |last1=Bez |first1=R. |last2=Pirovano |first2=A. |title=Advances in Non-Volatile Memory and Storage Technology |date=2019 |publisher=[[Company:Woodhead Publishing|Woodhead Publishing]] |isbn=9780081025857}}</ref> The original [[Engineering:MOSFET|MOSFET]] (metal–oxide–semiconductor field-effect transistor), also known as the MOS transistor, was invented by Egyptian engineer Mohamed M. Atalla and Korean engineer [[Biography:Dawon Kahng|Dawon Kahng]] at [[Organization:Bell Labs|Bell Labs]] in 1959.<ref name="computerhistory">{{Cite web |title=1960 – Metal Oxide Semiconductor (MOS) Transistor Demonstrated |url=https://www.computerhistory.org/siliconengine/metal-oxide-semiconductor-mos-transistor-demonstrated/ |url-status=live |archive-url=https://web.archive.org/web/20230410105822/https://www.computerhistory.org/siliconengine/metal-oxide-semiconductor-mos-transistor-demonstrated/ |archive-date=10 April 2023 |website=The Silicon Engine |publisher=Computer History Museum }}</ref> Kahng went on to develop a variation, the floating-gate MOSFET, with Taiwanese-American engineer Simon Min Sze at Bell Labs in 1967.<ref name="computerhistory1971">{{Cite web |date=11 June 2018 |title=1971: Reusable semiconductor ROM introduced |url=https://www.computerhistory.org/storageengine/reusable-semiconductor-rom-introduced/ |url-status=live |archive-url=https://web.archive.org/web/20230810204956/https://www.computerhistory.org/storageengine/reusable-semiconductor-rom-introduced/ |archive-date=10 August 2023 |access-date=19 June 2019 |website=The Storage Engine |publisher=Computer History Museum }}</ref> They proposed that it could be used as floating-gate [[Memory cell (computing)|memory cells]] for storing a form of programmable [[Read-only memory|read-only memory]] ([[Programmable read-only memory|PROM]]) that is both non-volatile and re-programmable.<ref name="computerhistory1971"/>

Early types of floating-gate memory included EPROM (erasable PROM) and EEPROM (electrically erasable PROM) in the 1970s.<ref name="computerhistory1971" /> However, early floating-gate memory required engineers to build a memory cell for each [[Bit|bit]] of data, which proved to be cumbersome,<ref name="forbes">{{cite web |last=Fulford |first=Adel |title=Unsung hero |work=Forbes |date=24 June 2002 |access-date=18 March 2008 |url=https://www.forbes.com/global/2002/0624/030.html |url-status=live |archive-url=https://web.archive.org/web/20080303205125/http://www.forbes.com/global/2002/0624/030.html |archive-date=3 March 2008}}</ref> slow,<ref name="howstuffworks-rom">{{Cite web |last=Tyson |first=Jeff |date=29 August 2000 |title=How ROM Works |url=https://computer.howstuffworks.com/rom.htm#pt5 |url-status=live |archive-url=https://web.archive.org/web/20231202082951/https://computer.howstuffworks.com/rom.htm#pt5 |archive-date=2 December 2023 |access-date=10 September 2019 |website=HowStuffWorks }}</ref> and expensive, restricting floating-gate memory to niche applications in the 1970s, such as [[Engineering:Military equipment|military equipment]] and the earliest experimental mobile phones.<ref name="economist" />

===Invention and commercialization===
Fujio Masuoka, while working for [[Company:Toshiba|Toshiba]], proposed a new type of floating-gate memory that allowed entire sections of memory to be erased quickly and easily, by applying a voltage to a single wire connected to a group of cells.<ref name="economist"/> This led to Masuoka's invention of flash memory at Toshiba in 1980.<ref name="forbes"/><ref>{{patent|US|4531203|Fujio Masuoka}}</ref><ref>{{US patent|4531203|Semiconductor memory device and method for manufacturing the same}}</ref> According to Toshiba, the name "flash" was suggested by Masuoka's colleague, Shōji Ariizumi, because the erasure process of the memory contents reminded him of the [[Physics:Flash (photography)|flash of a camera]].<ref>{{cite web |url=http://www.eweek.com/c/a/Data-Storage/NAND-Flash-Memory-25-Years-of-Invention-Development-684048/ |archive-url=https://perma-archives.org/warc/20170428010420/http://www.eweek.com/c/a/Data-Storage/NAND-Flash-Memory-25-Years-of-Invention-Development-684048 |url-status=dead |archive-date=28 April 2017 |title=NAND Flash Memory: 25 Years of Invention, Development – Data Storage – News & Reviews  |work=eWeek.com |access-date=18 August 2014 }}</ref> Masuoka and colleagues presented the invention of NOR flash in 1984,<ref name="auto1">{{Cite web |title=Toshiba: Inventor of Flash Memory |url=http://www.flash25.toshiba.com |url-status=dead |archive-url=https://web.archive.org/web/20190620160642/http://www.flash25.toshiba.com/ |archive-date=20 June 2019 |access-date=20 June 2019 |website=[[Company:Toshiba|Toshiba]] }}</ref><ref name="ieee-1984">{{Cite conference |last2=Asano |first2=M. |last3=Iwahashi |first3=H. |last4=Komuro |first4=T. |last5=Tanaka |first5=S. |date=December 1984 |title=A new flash E<sup>2</sup>PROM cell using triple polysilicon technology |conference=1984 International Electron Devices Meeting |location=San Francisco|pages=464–467 |doi=10.1109/IEDM.1984.190752 |s2cid=25967023 |first1=F. |last1=Masuoka }}</ref> and then NAND flash at the ''[[Organization:Institute of Electrical and Electronics Engineers|IEEE]] 1987 International Electron Devices Meeting'' (IEDM) held in San Francisco.<ref>{{cite conference |title=New ultra high density EPROM and flash EEPROM with NAND structure cell |last1=Masuoka |first1=F. |last2=Momodomi |first2=M. |last3=Iwata |first3=Y. |last4=Shirota |first4=R. |year=1987 |pages=552–555 |conference=IEDM 1987 |book-title=Electron Devices Meeting, 1987 International |publisher=IEEE|doi=10.1109/IEDM.1987.191485}}</ref>

Toshiba commercially launched NAND flash memory in 1987.<ref name=":0">{{cite web |title=1987: Toshiba Launches NAND Flash |url=https://www.eweek.com/storage/1987-toshiba-launches-nand-flash |website=eWeek |date=11 April 2012 |access-date=20 June 2019}}</ref><ref name="computerhistory1971"/> Intel Corporation introduced the first commercial NOR type flash chip in 1988.<ref>{{cite web |url=http://www2.electronicproducts.com/NAND_vs_NOR_flash_technology-article-FEBMSY1-FEB2002.aspx |title=NAND vs. NOR flash technology: The designer should weigh the options when using flash memory |last=Tal |first=Arie |date=February 2002 |access-date=31 July 2010 |url-status=dead |archive-url=https://web.archive.org/web/20100728210327/http://www2.electronicproducts.com/NAND_vs_NOR_flash_technology-article-FEBMSY1-FEB2002.aspx |archive-date=28 July 2010}}</ref> NOR-based flash has long erase and write times, but provides full address and data buses, allowing [[Random access|random access]] to any memory location. This makes it a suitable replacement for older [[Read-only memory|read-only memory]] (ROM) chips, which are used to store program code that rarely needs to be updated, such as a computer's [[BIOS]] or the [[Firmware|firmware]] of [[Engineering:Set-top box|set-top box]]es. Its endurance may be from as little as 100 erase cycles for an on-chip flash memory,<ref name="rej09b0138_h8s2357.pdf">{{Cite web |date=October 2004 |title=H8S/2357 Group, H8S/2357F-ZTATTM, H8S/2398F-ZTATTM Hardware Manual |url=https://www.renesas.com/us/en/document/mas/h8s2357-group-h8s2357f-ztattm-h8s2398f-ztattm-hardware-manual |url-status=live |archive-url=https://web.archive.org/web/20230109212444/https://www.renesas.com/us/en/document/mas/h8s2357-group-h8s2357f-ztattm-h8s2398f-ztattm-hardware-manual |archive-date=9 January 2023 |access-date=23 January 2012 |publisher=Renesas |page=574 |quote=The flash memory can be reprogrammed up to 100 times. }}</ref> to a more typical 10,000 or 100,000 erase cycles, up to 1,000,000 erase cycles.<ref name="amd-22271A">{{Cite web |date=July 2003 |title=AMD DL160 and DL320 Series Flash: New Densities, New Features |url=http://www.spansion.com/Support/Application%20Notes/AMD%20DL160%20and%20DL320%20Series%20Flash-%20New%20Densities,%20New%20Features.pdf |url-status=dead |archive-url=https://web.archive.org/web/20150924104223/http://www.spansion.com/Support/Application%20Notes/AMD%20DL160%20and%20DL320%20Series%20Flash-%20New%20Densities,%20New%20Features.pdf |archive-date=24 September 2015 |access-date=13 November 2014 |publisher=[[Engineering:AMD|AMD]] |id=22271A |quote=The devices offer single-power-supply operation (2.7 V to 3.6 V), sector architecture, Embedded Algorithms, high performance, and a 1,000,000 program/erase cycle endurance guarantee. }}</ref> NOR-based flash was the basis of early flash-based removable media; [[CompactFlash]] was originally based on it, though later cards moved to less expensive NAND&nbsp;flash.

NAND flash has reduced erase and write times, and requires less chip area per cell, thus allowing greater storage density and lower cost per bit than NOR&nbsp;flash. However, the I/O interface of NAND&nbsp;flash does not provide a random-access external address bus. Rather, data must be read on a block-wise basis, with typical block sizes of hundreds to thousands of bits. This makes NAND&nbsp;flash unsuitable as a drop-in replacement for program ROM, since most microprocessors and microcontrollers require byte-level random access. In this regard, NAND&nbsp;flash is similar to other secondary [[Engineering:Data storage device|data storage device]]s, such as hard disks and optical media, and is thus highly suitable for use in mass-storage devices, such as [[Memory card|memory card]]s and [[Solid-state drive|solid-state drive]]s (SSD). For example, SSDs store data using multiple NAND flash memory chips.

The first NAND-based removable memory card format was [[SmartMedia]], released in 1995. Many others followed, including MultiMediaCard, [[Secure Digital]], [[Memory Stick]], and [[XD-Picture Card|xD-Picture Card]].

===Later developments===
A new generation of memory card formats, including RS-MMC, miniSD and [[Engineering:MicroSD|microSD]], feature extremely small form factors. For example, the microSD card has an area of just over 1.5&nbsp;cm<sup>2</sup>, with a thickness of less than 1&nbsp;mm.

NAND flash has achieved significant levels of memory density as a result of several major technologies that were commercialized during the late 2000s to early 2010s.<ref name="James">{{Cite conference |date=May 2014 |title=3D ICs in the real world |url=https://www.researchgate.net/publication/271453642 |conference=25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) |location=Saratoga Springs, NY |pages=113–119 |doi=10.1109/ASMC.2014.6846988 |isbn=978-1-4799-3944-2 |issn=2376-6697 |doi-access= |last1=James |first1=Dick |s2cid=42565898 |url-access=subscription }}</ref>

[[Multi-level cell]] (MLC) technology stores more than one [[Bit|bit]] in each [[Memory cell (computing)|memory cell]]. [[Company:NEC|NEC]] demonstrated [[Multi-level cell|multi-level cell]] (MLC) technology in 1998, with an 80{{nbsp}}[[Mebibit|Mb]] flash memory chip storing 2 bits per cell.<ref name="nec-97-10-28-01">{{Cite press release |last=Bridgman |first=Aston |date=28 October 1997 |title=NEC and SanDisk Develop 80Mb Flash Memory |url=http://www.nec.co.jp/press/en/9710/2801.html |url-status=dead |archive-url=https://web.archive.org/web/20201018114043/http://www.nec.co.jp/press/en/9710/2801.html |archive-date=18 October 2020 |publisher=[[Company:NEC|NEC]] |id=97/10/28-01 }}</ref> [[Company:STMicroelectronics|STMicroelectronics]] also demonstrated MLC in 2000, with a 64{{nbsp}}MB NOR flash memory chip.<ref name="stol"/> In 2009, Toshiba and [[Company:SanDisk|SanDisk]] introduced NAND flash chips with QLC technology storing 4 bits per cell and holding a capacity of 64{{nbsp}}Gbit.<ref name="toshiba2009"/><ref name="toshiba-sd-2009"/> [[Company:Samsung Electronics|Samsung Electronics]] introduced triple-level cell (TLC) technology storing 3-bits per cell, and began mass-producing NAND chips with TLC technology in 2010.<ref name="samsung-history"/>

====Charge trap flash====
{{Main|Charge trap flash}}

[[Charge trap flash]] (CTF) technology replaces the polysilicon floating gate, which is sandwiched between a blocking gate oxide above and a tunneling oxide below it, with an electrically insulating silicon nitride layer; the silicon nitride layer traps electrons. In theory, CTF is less prone to electron leakage, providing improved data retention.<ref name="electronicdesign-20130415">{{Cite news |last=Wong |first=Bill |date=15 April 2013 |title=Interview: Spansion's CTO Talks About Embedded Charge Trap NOR Flash Technology |work=Electronic Design |url=https://www.electronicdesign.com/technologies/memory/article/21796009/interview-spansions-cto-talks-about-embedded-charge-trap-nor-flash-technology |url-status=live |archive-url=https://web.archive.org/web/20231204125719/https://www.electronicdesign.com/technologies/embedded/digital-ics/memory/article/21796009/interview-spansions-cto-talks-about-embedded-charge-trap-nor-flash-technology |archive-date=4 December 2023 }}</ref><ref name="ito-taito-2017">{{Cite book |last1=Ito |first1=Takashi |title=Embedded Flash Memory for Embedded Systems: Technology, Design for Sub-systems, and Innovations  |last2=Taito |first2=Yasuhiko |date=9 September 2017 |publisher=[[Company:Springer Publishing|Springer Publishing]] |isbn=978-3-319-55306-1 |editor-last=Hidaka |editor-first=Hideto |series=Integrated Circuits and Systems |pages=209–244 |chapter=SONOS Split-Gate eFlash Memory |doi=10.1007/978-3-319-55306-1_7 }}</ref><ref name="ieee-91-4">{{Cite journal |last1=Bez |first1=Roberto |last2=Camerlenghi |first2=E. |last3=Modelli |first3=Alberto |last4=Visconti |first4=Angelo |date=April 2003 |title=Introduction to flash memory |journal=[[Proceedings of the IEEE]] |publisher=[[Organization:Institute of Electrical and Electronics Engineers|Institute of Electrical and Electronics Engineers]] |volume=91 |issue=4 |pages=498–502 |doi=10.1109/JPROC.2003.811702 }}</ref><ref name="lee-2011">{{Cite journal |last=Lee |first=Jang-Sik |date=18 October 2011 |title=Review paper: Nano-floating gate memory devices |journal=Electronic Materials Letters |publisher=Korean Institute of Metals and Materials |volume=7 |issue=3 |pages=175–183 |doi=10.1007/s13391-011-0901-5 |bibcode=2011EML.....7..175L |s2cid=110503864 }}</ref><ref name="auto5">{{Cite web |last=Aravindan |first=Avinash |date=13 November 2018 |title=Flash 101: Types of NAND Flash |url=https://www.embedded.com/flash-101-types-of-nand-flash/ |url-status=live |archive-url=https://web.archive.org/web/20231106101540/https://www.embedded.com/flash-101-types-of-nand-flash/ |archive-date=6 November 2023 |website=embedded.com }}</ref><ref name="nanoscale-9-1-526">{{Cite journal |last1=Meena |first1=Jagan Singh |last2=Sze |first2=Simon Min |last3=Chand |first3=Umesh |last4=Tseng |first4=Tseung-Yuen |date=25 September 2014 |title=Overview of emerging nonvolatile memory technologies |journal=Nanoscale Research Letters |volume=9 |issue=1 |doi=10.1186/1556-276x-9-526 |issn=1556-276X |id=526 |doi-access=free |pmc=4182445 }}</ref>

Because CTF replaces the polysilicon with an electrically insulating nitride, it allows for smaller cells and higher endurance (lower degradation or wear). However, electrons can become trapped and accumulate in the nitride, leading to degradation. Leakage is exacerbated at high temperatures since electrons become more excited with increasing temperatures. CTF technology however still uses a tunneling oxide and blocking layer which are the weak points of the technology, since they can still be damaged in the usual ways (the tunnel oxide can be degraded due to extremely high electric fields and the blocking layer due to Anode Hot Hole Injection (AHHI).<ref name="techtarget-20230619">{{Cite web |last=Sheldon |first=Robert |date=19 June 2023 |title=Charge trap technology advantages for 3D NAND flash drives |url=https://www.techtarget.com/searchstorage/tip/Charge-trap-technology-advantages-for-3D-NAND-flash-drives |url-status=live |archive-url=https://web.archive.org/web/20230809223937/https://www.techtarget.com/searchstorage/tip/Charge-trap-technology-advantages-for-3D-NAND-flash-drives |archive-date=9 August 2023 |website=SearchStorage }}</ref><ref name="grossi-zambelli-olivo-2016">{{Cite book |last1=Grossi |first1=A. |title=3D Flash Memories |last2=Zambelli |first2=C. |last3=Olivo |first3=P. |date=7 June 2016 |publisher=[[Company:Springer Science+Business Media|Springer Science+Business Media]] |isbn=978-94-017-7512-0 |editor-last=Micheloni |editor-first=Rino |location=Dordrecht |pages=29–62 |chapter=Reliability of 3D NAND Flash Memories |doi=10.1007/978-94-017-7512-0_2 }}</ref>

Degradation or wear of the oxides is the reason why flash memory has limited endurance, and data retention goes down (the potential for data loss increases) with increasing degradation, since the oxides lose their electrically insulating characteristics as they degrade. The oxides must insulate against electrons to prevent them from leaking which would cause data loss.

In 1991, [[Company:NEC|NEC]] researchers including N. Kodama, K. Oyama and Hiroki Shirai described a type of flash memory with a charge trap method.<ref name="iedm-1991-symmetrical">{{Cite conference |last1=Kodama |first1=N. |last2=Oyama |first2=K. |last3=Shirai |first3=H. |last4=Saitoh |first4=K. |last5=Okazawa |first5=T. |last6=Hokari |first6=Y. |date=December 1991 |title=A symmetrical side wall (SSW)-DSA cell for a 64 Mbit flash memory |conference=International Electron Devices Meeting |location=Washington, DC  |publisher=[[Organization:Institute of Electrical and Electronics Engineers|IEEE]] |pages=303–306 |doi=10.1109/IEDM.1991.235443 |isbn=0-7803-0243-5 |issn=0163-1918 |s2cid=111203629 }}</ref> In 1998, Boaz Eitan of Saifun Semiconductors (later acquired by [[Company:Spansion|Spansion]]) patented a flash memory technology named NROM that took advantage of a charge trapping layer to replace the conventional floating gate used in conventional flash memory designs.<ref>{{cite web|last=Eitan|first=Boaz|title=US Patent 5,768,192: Non-volatile semiconductor memory cell utilizing asymmetrical charge trapping|url=http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=5,768,192.PN.&OS=PN/5,768,192&RS=PN/5,768,192|publisher=US Patent & Trademark Office|access-date=22 May 2012|archive-date=22 February 2020|archive-url=https://web.archive.org/web/20200222215754/http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=5%2C768%2C192.PN.&OS=PN%2F5%2C768%2C192&RS=PN%2F5%2C768%2C192|url-status=dead}}</ref> In 2000, an [[Company:Advanced Micro Devices|Advanced Micro Devices]] (AMD) research team led by Richard M. Fastow, Egyptian engineer Khaled Z. Ahmed and Jordanian engineer Sameer Haddad (who later joined Spansion) demonstrated a charge-trapping mechanism for NOR flash memory cells.<ref name="ieee-letters-21-4">{{Cite journal |last1=Fastow |first1=Richard M. |last2=Ahmed |first2=Khaled Z. |last3=Haddad |first3=Sameer |last4=Randolph |first4=Mark |last5=Huster |first5=C. |last6=Hom |first6=P. |date=April 2000 |title=Bake induced charge gain in NOR flash cells |url=https://www.researchgate.net/publication/3253902 |journal=IEEE Electron Device Letters |volume=21 |issue=4 |pages=184–186 |bibcode=2000IEDL...21..184F |doi=10.1109/55.830976 |issn=1558-0563 |s2cid=24724751 }}</ref> CTF was later commercialized by AMD and [[Company:Fujitsu|Fujitsu]] in 2002.<ref name="auto3">{{Cite news |last=Hruska |first=Joel |date=6 August 2013 |title=Samsung produces first 3D NAND, aims to boost densities, drive lower cost per GB |work=[[ExtremeTech]] |url=https://www.extremetech.com/computing/163221-samsung-produces-first-3d-nand-aims-to-boost-densities-drive-lower-cost-per-gb |url-status=live |access-date=4 July 2019 |archive-url=https://web.archive.org/web/20231102133725/https://www.extremetech.com/computing/163221-samsung-produces-first-3d-nand-aims-to-boost-densities-drive-lower-cost-per-gb |archive-date=2 November 2023 }}</ref> 3D V-NAND (vertical NAND) technology stacks NAND flash memory cells vertically within a chip using 3D charge trap flash (CTP) technology. 3D V-NAND technology was first announced by Toshiba in 2007,<ref name="toshiba-3d"/> and the first device, with 24 layers, was first commercialized by [[Company:Samsung Electronics|Samsung Electronics]] in 2013.<ref name="samsung-3d"/><ref name="samsung-3d-ee"/>

====3D integrated circuit technology====

3D integrated circuit (3D IC) technology stacks [[Engineering:Integrated circuit|integrated circuit]] (IC) chips vertically into a single 3D IC chip package.<ref name="James"/> Toshiba introduced 3D IC technology to NAND flash memory in April 2007, when they debuted a 16{{nbsp}}[[Gibibyte|GB]] eMMC compliant (product number THGAM0G7D8DBAI6, often abbreviated THGAM on consumer websites) embedded NAND flash memory chip, which was manufactured with eight stacked 2{{nbsp}}GB NAND flash chips.<ref name="toshiba2007"/> In September 2007, Hynix Semiconductor (now [[Company:SK Hynix|SK Hynix]]) introduced 24-layer 3D IC technology, with a 16{{nbsp}}GB flash memory chip that was manufactured with 24 stacked NAND flash chips using a wafer bonding process.<ref name="hynix2007"/> Toshiba also used an eight-layer 3D IC for their 32{{nbsp}}GB THGBM flash chip in 2008.<ref name="toshiba2008"/> In 2010, Toshiba used a 16-layer 3D IC for their 128{{nbsp}}GB THGBM2 flash chip, which was manufactured with 16 stacked 8{{nbsp}}GB chips.<ref name="toshiba2010"/> In the 2010s, 3D ICs came into widespread commercial use for NAND flash memory in mobile devices.<ref name="James"/>

As of August 2017, microSD cards with a capacity up to 400 [[Gigabyte|GB]] (400 billion bytes) are available.<ref name="sandisk-20170831">{{Cite press release |date=31 August 2017 |title=Western Digital Breaks Boundaries with World's Highest-Capacity microSD Card |url=https://www.sandisk.com/about/media-center/press-releases/2017/western-digital-breaks-boundaries-with-worlds-highest-capacity-microsd-card |url-status=dead |archive-url=https://web.archive.org/web/20170901035345/https://www.sandisk.com/about/media-center/press-releases/2017/western-digital-breaks-boundaries-with-worlds-highest-capacity-microsd-card |archive-date=1 September 2017 |access-date=2 September 2017 |publisher=[[Company:SanDisk|SanDisk]] |place=Berlin }}</ref><ref name="forbes-20170831">{{Cite magazine |last=Bradley |first=Tony |date=31 August 2017 |title=Expand Your Mobile Storage With New 400GB microSD Card From SanDisk |url=https://www.forbes.com/sites/tonybradley/2017/08/31/expand-your-mobile-storage-with-new-400gb-microsd-card-from-sandisk |url-status=live |magazine={{wipe|Forbes}} |archive-url=https://web.archive.org/web/20170901064146/https://www.forbes.com/sites/tonybradley/2017/08/31/expand-your-mobile-storage-with-new-400gb-microsd-card-from-sandisk/ |archive-date=1 September 2017 |access-date=2 September 2017 }}</ref> The same year, Samsung combined 3D IC chip stacking with its 3D V-NAND and TLC technologies to manufacture its 512{{nbsp}}GB KLUFG8R1EM flash memory chip with eight stacked 64-layer V-NAND chips.<ref name="anandtech-20171205" /> In 2019, Samsung produced a 1024{{nbsp}}[[Gigabyte|GB]] flash chip, with eight stacked 96-layer V-NAND chips and with QLC technology.<ref name="electronicsweekly-samsung"/><ref name="anandtech-samsung-2018"/>

==Principles of operation==
[[File:Flash cell structure.svg|thumb|350px|right|A flash memory cell]]

Flash memory stores information in an array of memory cells made from floating-gate transistors. In single-level cell (SLC) devices, each cell stores only one bit of information. [[Multi-level cell]] (MLC) devices, including triple-level cell (TLC) devices, can store more than one bit per cell.

The floating gate may be conductive (typically [[Earth:Polycrystalline silicon|polysilicon]] in most kinds of flash memory) or non-conductive (as in [[SONOS]] flash memory).<ref>{{Citation |first=Matt |last=Basinger |title=PSoC Designer Device Selection Guide |date=18 January 2007 |id=AN2209 |url=http://www.psocdeveloper.com/uploads/tx_piapappnote/an2209_03.pdf |quote=The PSoC ... utilizes a unique Flash process: [[SONOS]] |url-status=dead |archive-url=https://web.archive.org/web/20091031121330/http://www.psocdeveloper.com/uploads/tx_piapappnote/an2209_03.pdf |archive-date=31 October 2009}}</ref>

===Floating-gate MOSFET===
{{Main| Engineering:Floating-gate MOSFET}}

In flash memory, each memory cell resembles a standard metal–oxide–semiconductor field-effect transistor (MOSFET) except that the transistor has two gates instead of one. The cells can be seen as an electrical switch in which current flows between two terminals (source and drain) and is controlled by a floating gate (FG) and a control gate (CG). The CG is similar to the gate in other MOS transistors, but below this, there is the FG insulated all around by an oxide layer. The FG is interposed between the CG and the MOSFET channel. Because the FG is electrically isolated by its insulating layer, electrons placed on it are trapped. When the FG is charged with electrons, this charge screens the [[Physics:Electric field|electric field]] from the CG, thus, increasing the [[Physics:Threshold voltage|threshold voltage]] (V<sub>T</sub>) of the cell. This means that the V<sub>T</sub> of the cell can be changed between the ''uncharged FG threshold voltage'' (V<sub>T1</sub>) and the higher ''charged FG threshold voltage'' (V<sub>T2</sub>) by changing the FG charge. In order to read a value from the cell, an intermediate voltage (V<sub>I</sub>) between V<sub>T1</sub> and V<sub>T2</sub> is applied to the CG. If the channel conducts at V<sub>I</sub>, the FG must be uncharged (if it were charged, there would not be conduction because V<sub>I</sub> is less than V<sub>T2</sub>). If the channel does not conduct at the V<sub>I</sub>, it indicates that the FG is charged. The binary value of the cell is sensed by determining whether there is current flowing through the transistor when V<sub>I</sub> is asserted on the CG. In a multi-level cell device, which stores more than one [[Bit|bit]] per cell, the amount of current flow is sensed (rather than simply its presence or absence), in order to determine more precisely the level of charge on the FG.

Floating gate MOSFETs are so named because there is an electrically insulating tunnel oxide layer between the floating gate and the silicon, so the gate "floats" above the silicon. The oxide keeps the electrons confined to the floating gate. Degradation or wear (and the limited endurance of floating gate Flash memory) occurs due to the extremely high [[Physics:Electric field|electric field]] (10 million volts per centimeter) experienced by the oxide. Such high voltage densities can break atomic bonds over time in the relatively thin oxide, gradually degrading its electrically insulating properties and allowing electrons to be trapped in and pass through freely (leak) from the floating gate into the oxide, increasing the likelihood of data loss since the electrons (the quantity of which is used to represent different charge levels, each assigned to a different combination of bits in MLC Flash) are normally in the floating gate. This is why data retention goes down and the risk of data loss increases with increasing degradation.<ref name="windbacher-211">{{Cite web |last=Windbacher |first=T. |title=2.1.1 Flash Memory |url=https://www.iue.tuwien.ac.at/phd/windbacher/node14.html |url-status=live |archive-url=https://web.archive.org/web/20231109113308/https://www.iue.tuwien.ac.at/phd/windbacher/node14.html |archive-date=9 November 2023 |website=Engineering Gate Stacks for Field-Effect Transistors }}</ref><ref name="minnesota-floating-gate-mos">{{Cite web |title=Floating Gate MOS Memory |url=http://www.princeton.edu/~chouweb/newproject/research/SEM/FloatMOSMem.html |url-status=dead |archive-url=https://web.archive.org/web/20220808223834/http://www.princeton.edu/~chouweb/newproject/research/SEM/FloatMOSMem.html |archive-date=8 August 2022 |publisher=[[Organization:University of Minnesota|University of Minnesota]] }}</ref><ref name="auto5"/><ref name="anandtech"/><ref name="electronics-notes-wear-levelling">{{Cite web |title=Flash Memory Reliability, Life & Wear |url=https://www.electronics-notes.com/articles/electronic_components/semiconductor-ic-memory/flash-wear-levelling-reliability-lifetime.php |url-status=live |archive-url=https://web.archive.org/web/20231102133652/https://www.electronics-notes.com/articles/electronic_components/semiconductor-ic-memory/flash-wear-levelling-reliability-lifetime.php |archive-date=2 November 2023 |website=Electronics Notes }}</ref> The silicon oxide in a cell degrades with every erase operation. The degradation increases the amount of negative charge in the cell over time due to trapped electrons in the oxide and negates some of the control gate voltage, this over time also makes erasing the cell slower, so to maintain the performance and reliability of the NAND chip, the cell must be retired from use.  Endurance also decreases with the number of bits in a cell. With more bits in a cell, the number of possible states (each represented by a different voltage level) in a cell increases and is more sensitive to the voltages used for programming. Voltages may be adjusted to compensate for degradation of the silicon oxide, and as the number of bits increases, the number of possible states also increases and thus the cell is less tolerant of adjustments to programming voltages, because there is less space between the voltage levels that define each state in a cell.<ref name="auto6">{{Cite news |last=Vättö |first=Kristian |date=23 February 2012 |title=Understanding TLC NAND |work=[[AnandTech]] |url=https://www.anandtech.com/show/5067/understanding-tlc-nand/2 |url-status=live |archive-url=https://web.archive.org/web/20231102131132/https://www.anandtech.com/show/5067/understanding-tlc-nand/2 |archive-date=2 November 2023 }}</ref>

===Fowler–Nordheim tunneling===

The process of moving electrons from the control gate and into the floating gate is called Fowler–Nordheim tunneling, and it fundamentally changes the characteristics of the cell by increasing the MOSFET's threshold voltage. This, in turn, changes the drain-source current that flows through the transistor for a given gate voltage, which is ultimately used to encode a binary value. The Fowler-Nordheim tunneling effect is reversible, so electrons can be added to or removed from the floating gate, processes traditionally known as writing and erasing.<ref name="hyperstone-20180417">{{Cite web |date=17 April 2018 |title=Solid State bit density, and the Flash Memory Controller |url=https://www.hyperstone.com/en/Solid-State-bit-density-and-the-Flash-Memory-Controller-1235,12728.html |url-status=live |archive-url=https://web.archive.org/web/20230609075731/https://www.hyperstone.com/en/Solid-State-bit-density-and-the-Flash-Memory-Controller-1235,12728.html |archive-date=9 June 2023 |access-date=29 May 2018 |website=hyperstone.com }}</ref>

===Internal charge pumps===
Despite the need for relatively high programming and erasing voltages, virtually all flash chips today require only a single supply voltage and produce the high voltages that are required using on-chip [[Engineering:Charge pump|charge pump]]s.

Over half the energy used by a 1.8&nbsp;V NAND flash chip is lost in the charge pump itself. Since [[Engineering:Boost converter|boost converter]]s are inherently more efficient than charge pumps, researchers developing [[Physics:Low-power electronics|low-power]] SSDs have proposed returning to the dual Vcc/Vpp supply voltages used on all early flash chips, driving the high Vpp voltage for all flash chips in an SSD with a single shared external boost converter.<ref>{{Citation |first1=Tadashi |title=Proceedings of the 14th ACM/IEEE international symposium on Low power electronics and design - ISLPED '09 |last1=Yasufuku |first2=Koichi |last2=Ishida |first3=Shinji |last3=Miyamoto |first4=Hiroto |last4=Nakai |first5=Makoto |last5=Takamiya |first6=Takayasu |last6=Sakurai |first7=Ken |last7=Takeuchi |url=http://www.computer.org/csdl/proceedings/islped/2009/8684/00/86840087-abs.html |pages=87–92 |year=2009 |url-status=live |archive-url=https://web.archive.org/web/20160305135918/https://www.computer.org/csdl/proceedings/islped/2009/8684/00/86840087-abs.html |archive-date=5 March 2016|doi=10.1145/1594233.1594253 |isbn=9781605586847 |s2cid=6055676 |url-access=subscription }} [http://adsabs.harvard.edu/abs/2010IEITE..93..317Y (abstract)].</ref><ref>{{citation |first1=Rino |last1=Micheloni |first2=Alessia |last2=Marelli |first3=Kam |last3=Eshghi |url=https://books.google.com/books?id=8LS3egzcBG4C&pg=PA188 |title=Inside Solid State Drives (SSDs) |year=2012 |publisher=Springer |url-status=live |archive-url=https://web.archive.org/web/20170209234319/https://books.google.com/books?id=8LS3egzcBG4C&pg=PA188&lpg=PA188 |archive-date=9 February 2017|isbn=9789400751460 |bibcode=2013issd.book.....M }}</ref><ref>{{citation |first1=Rino |last1=Micheloni |first2=Luca |last2=Crippa |url=https://books.google.com/books?id=vaq11vKwo_kC&pg=PA530 |title=Inside NAND Flash Memories |year=2010 |publisher=Springer |url-status=live |archive-url=https://web.archive.org/web/20170209164808/https://books.google.com/books?id=vaq11vKwo_kC&pg=PA530&lpg=PA530 |archive-date=9 February 2017|isbn=9789048194315 }} In particular, pp 515-536: K. Takeuchi. [https://link.springer.com/content/pdf/10.1007%2F978-90-481-9431-5_18.pdf "Low power 3D-integrated SSD"]</ref><ref>{{citation |first1=Tracey |last1=Mozel |url=https://books.google.com/books?id=XlbOf-m8fdYC&pg=RA5-PA3 |title=CMOSET Fall 2009 Circuits and Memories Track Presentation Slides |year=2009 |publisher=CMOS Emerging Technologies |url-status=live |archive-url=https://web.archive.org/web/20170209213305/https://books.google.com/books?id=XlbOf-m8fdYC&pg=RA5-PA3&lpg=RA5-PA3 |archive-date=9 February 2017|isbn=9781927500217 }}</ref><ref name="ieice-transactions-2010">{{Cite journal |last1=Yasufuku |first1=Tadashi |last2=Ishida |first2=Koichi |last3=Miyamoto |first3=Shinji |last4=Nakai |first4=Hiroto |last5=Takamiya |first5=Makoto |last6=Sakurai |first6=Takayasu |last7=Takeuchi |first7=Ken |date=March 2010 |title=Inductor and TSV Design of 20-V Boost Converter for Low Power 3D Solid State Drive with NAND Flash Memories |pages=317–323 |url=https://www.researchgate.net/publication/220240029  |url-status=live |journal=IEICE Transactions on Electronics |publisher=[[Organization:Institute of Electronics, Information and Communication Engineers|IEICE]] |volume=E93-C |issue=3 |doi=10.1587/transele.E93.C.317 |archive-url=https://web.archive.org/web/20160204025034/https://www.researchgate.net/publication/220240029_Inductor_and_TSV_Design_of_20-V_Boost_Converter_for_Low_Power_3D_Solid_State_Drive_with_NAND_Flash_Memories |archive-date=4 February 2016 |doi-access= |bibcode=2010IEITE..93..317Y |url-access=subscription }}</ref><ref>Hatanaka, T. and Takeuchi, K.
[https://ieeexplore.ieee.org/document/5986104 "4-times faster rising VPASS (10V), 15% lower power VPGM (20V), wide output voltage range voltage generator system for 4-times faster 3D-integrated solid-state drives"]. 2011.</ref><ref name="takeuchi-2010">{{Cite conference |last=Takeuchi |first=Ken |date=May 2010 |title=Low power 3D-integrated Solid-State Drive (SSD) with adaptive voltage generator |conference=IEEE International Memory Workshop (IMW)  |location=Seoul, Korea |doi=10.1109/IMW.2010.5488397 |isbn=978-1-4244-6721-1 |issn=2159-4864 }}</ref><ref name="ieee-3d-integrated-2011">{{Cite journal |last1=Ishida |first1=Koichi |last2=Yasufuku |first2=Tadashi |last3=Miyamoto |first3=Shinji |last4=Nakai |first4=Hiroto |last5=Takamiya |first5=Makoto |last6=Sakurai |first6=Takayasu |last7=Takeuchi |first7=Ken |date=May 2011 |title=1.8 V Low-Transient-Energy Adaptive Program-Voltage Generator Based on Boost Converter for 3D-Integrated NAND Flash SSD |journal=IEEE Journal of Solid-State Circuits |publisher=[[Organization:Institute of Electrical and Electronics Engineers|Institute of Electrical and Electronics Engineers]] |volume=46 |issue=6 |pages=1478–1487 |doi=10.1109/JSSC.2011.2131810 |bibcode=2011IJSSC..46.1478I |s2cid=13701601 |issn=1558-173X }}</ref>

In spacecraft and other high-radiation environments, the on-chip charge pump is the first part of the flash chip to fail, although flash memories will continue to work{{snd}} in read-only mode{{snd}} at much higher radiation levels.<ref>A. H. Johnston, [http://trs-new.jpl.nasa.gov/dspace/bitstream/2014/13431/1/01-2369.pdf "Space Radiation Effects in Advanced Flash Memories"] {{webarchive|url=https://web.archive.org/web/20160304220536/http://trs-new.jpl.nasa.gov/dspace/bitstream/2014/13431/1/01-2369.pdf |date=4 March 2016 }}.
NASA Electronic Parts and Packaging Program (NEPP). 2001. "... internal transistors used for the charge pump and erase/write control have much thicker oxides because of the requirement for high voltage. This causes flash devices to be considerably more sensitive to total dose damage compared to other ULSI technologies. It also implies that write and erase functions will be the first parameters to fail from total dose. ... Flash memories will work at much higher radiation levels in the read mode. ... The charge pumps that are required to generate the high voltage for erasing and writing are usually the most sensitive circuit functions, usually failing below 10 krad(SI)."</ref>

===NOR flash===
[[File:NOR flash layout.svg|thumb|350px|right| NOR flash memory wiring and structure on silicon]]

In NOR flash, each cell has one end connected directly to ground, and the other end connected directly to a bit line. This arrangement is called "NOR flash" because it acts like a [[Engineering:NOR gate|NOR&nbsp;gate:]] when one of the word lines (connected to the cell's CG) is brought high, the corresponding storage transistor acts to pull the output bit line low. NOR flash continues to be the technology of choice for embedded applications requiring a discrete non-volatile memory device.{{citation needed|date=May 2022}} The low read latencies characteristic of NOR&nbsp;devices allow for both direct code execution and data storage in a single memory product.<ref name="eetimes-20110502">{{Cite news |last=Zitlaw |first=Cliff |date=2 May 2011 |title=The Future of NOR Flash Memory |work=Memory Designline |publisher=UBM Media |url=https://www.eetimes.com/the-future-of-nor-flash-memory/ |url-status=live |access-date=3 May 2011 |archive-url=https://web.archive.org/web/20230601001439/https://www.eetimes.com/the-future-of-nor-flash-memory/ |archive-date=1 June 2023 }}</ref>

====Programming====
[[Image:Flash-Programming.svg|thumb|left|Programming a NOR memory cell (setting it to logical 0), via hot-electron injection]]
[[File:Flash erase.svg|thumb|right|Erasing a NOR memory cell (setting it to logical 1), via quantum tunneling]]

A single-level NOR flash cell in its default state is logically equivalent to a binary "1" value, because current will flow through the channel under application of an appropriate voltage to the control gate, so that the bitline voltage is pulled down. A NOR&nbsp;flash cell can be programmed, or set to a binary "0" value, by the following procedure:

* an elevated on-voltage (typically >5&nbsp;V) is applied to the CG
* the channel is now turned on, so electrons can flow from the source to the drain (assuming an NMOS&nbsp;transistor)
* the source-drain current is sufficiently high to cause some high energy electrons to jump through the insulating layer onto the FG, via a process called hot-electron injection.

====Erasing====
To erase a NOR flash cell (resetting it to the "1" state), a large voltage ''of the opposite polarity'' is applied between the CG and source terminal, pulling the electrons off the FG through quantum tunneling. Modern NOR&nbsp;flash memory chips are divided into erase segments (often called blocks or sectors). The erase operation can be performed only on a block-wise basis; all the cells in an erase segment must be erased together. Programming of NOR cells, however, generally can be performed one byte or word at a time.

{{clear}}
[[File:Nand flash structure.svg|thumb|350px|right|NAND flash memory wiring and structure on silicon]]

===NAND flash===
NAND flash also uses [[Engineering:Floating-gate MOSFET|floating-gate transistor]]s, but they are connected in a way that resembles a NAND&nbsp;gate: several transistors are connected in series, and the bit line is pulled low only if all the word lines are pulled high (above the transistors' V<sub>T</sub>). These groups are then connected via some additional transistors to a NOR-style bit line array in the same way that single transistors are linked in NOR&nbsp;flash.

Compared to NOR flash, replacing single transistors with serial-linked groups adds an extra level of addressing. Whereas NOR&nbsp;flash might address memory by page then word, NAND&nbsp;flash might address it by page, word and bit. Bit-level addressing suits bit-serial applications (such as hard disk emulation), which access only one bit at a time. {{nowrap|Execute-in-place}} applications, on the other hand, require every bit in a word to be accessed simultaneously. This requires word-level addressing. In any case, both bit and word addressing modes are possible with either NOR or NAND&nbsp;flash.

To read data, first the desired group is selected (in the same way that a single transistor is selected from a NOR array). Next, most of the word lines are pulled up above V<sub>T2</sub>, while one of them is pulled up to V<sub>I</sub>. The series group will conduct (and pull the bit line low) if the selected bit has not been programmed.

Despite the additional transistors, the reduction in ground wires and bit lines allows a denser layout and greater storage capacity per chip. (The ground wires and bit lines are actually much wider than the lines in the diagrams.) In addition, NAND&nbsp;flash is typically permitted to contain a certain number of faults (NOR&nbsp;flash, as is used for a [[BIOS]]&nbsp;ROM, is expected to be fault-free). Manufacturers try to maximize the amount of usable storage by shrinking the size of the transistors or cells, however the industry can avoid this and achieve higher storage densities per die by using 3D NAND, which stacks cells on top of each other.

NAND Flash cells are read by analysing their response to various voltages.<ref name="anandtech">{{Cite news |last=Shimpi |first=Anand Lal |date=30 September 2011 |title=The Intel SSD 710 (200GB) Review |work=[[AnandTech]] |url=https://www.anandtech.com/show/4902/intel-ssd-710-200gb-review |url-status=live |archive-url=https://web.archive.org/web/20231102131301/https://www.anandtech.com/show/4902/intel-ssd-710-200gb-review |archive-date=2 November 2023 }}</ref>

====Writing and erasing====
NAND flash uses [[Physics:Tunnel injection|tunnel injection]] for writing and tunnel release for erasing. NAND&nbsp;flash memory forms the core of the removable USB storage devices known as [[Engineering:USB flash drive|USB flash drive]]s, as well as most [[Memory card|memory card]] formats and [[Solid-state drive|solid-state drive]]s available today.

The hierarchical structure of NAND flash starts at a cell level which establishes strings, then pages, blocks, planes and ultimately a die. A string is a series of connected NAND cells in which the source of one cell is connected to the drain of the next one. Depending on the NAND technology, a string typically consists of 32 to 128 NAND cells. Strings are organised into pages which are then organised into blocks in which each string is connected to a separate line called a bitline. All cells with the same position in the string are connected through the control gates by a wordline. A plane contains a certain number of blocks that are connected through the same bitline. A flash die consists of one or more planes, and the peripheral circuitry that is needed to perform all the read, write, and erase operations.

The architecture of NAND flash means that data can be read and programmed (written) in pages, typically between 4 KiB and 16 KiB in size, but can only be erased at the level of entire blocks consisting of multiple pages. When a block is erased, all the cells are logically set to 1. Data can only be programmed in one pass to a page in a block that was erased. Any cells that have been set to 0 by programming can only be reset to 1 by erasing the entire block. This means that before new data can be programmed into a page that already contains data, the current contents of the page plus the new data must be copied to a new, erased page. If a suitable erased page is available, the data can be written to it immediately. If no erased page is available, a block must be erased before copying the data to a page in that block. The old page is then marked as invalid and is available for erasing and reuse.<ref name="hyperstone-20180607">{{Cite web |date=7 June 2018 |title=NAND Flash Controllers - The key to endurance and reliability |url=https://www.hyperstone.com/en/NAND-Flash-controllers-The-key-to-endurance-and-reliability-1256,12728.html |url-status=live |archive-url=https://web.archive.org/web/20230605095907/https://www.hyperstone.com/en/NAND-Flash-controllers-The-key-to-endurance-and-reliability-1256,12728.html |archive-date=5 June 2023 |access-date=1 June 2022 |work=hyperstone.com }}</ref>

===Vertical NAND===
[[File:NAND_Flash_Bit_Cost_from_2D_to_3D.png|thumb|right|300px|3D NAND continues scaling beyond 2D.]]
Vertical NAND (V-NAND) or 3D NAND memory stacks memory cells vertically and uses a [[Charge trap flash|charge trap flash]] architecture. The vertical layers allow larger areal bit densities without requiring smaller individual cells.<ref name="vnand">{{cite web |url=http://www.gizmag.com/samsung-v-nand-flash-chip-ssd/28655 |title=Samsung moves into mass production of 3D flash memory |publisher=Gizmag.com |access-date=2013-08-27 |url-status=live |archive-url=https://web.archive.org/web/20130827091835/http://www.gizmag.com/samsung-v-nand-flash-chip-ssd/28655/ |archive-date=27 August 2013|date=27 August 2013 }}</ref> It is also sold under the trademark ''BiCS Flash'', which is a trademark of Kioxia Corporation (formerly Toshiba Memory Corporation). 3D NAND was first announced by [[Company:Toshiba|Toshiba]] in 2007.<ref name="toshiba-3d">{{Cite news |last=Melanson |first=Donald |date=12 June 2007 |title=Toshiba announces new "3D" NAND flash technology |work=[[Software:Engadget|Engadget]] |url=https://www.engadget.com/2007/06/12/toshiba-announces-new-3d-nand-flash-technology/ |url-status=live |access-date=10 July 2019 |archive-url=https://web.archive.org/web/20221217224115/https://www.engadget.com/2007-06-12-toshiba-announces-new-3d-nand-flash-technology.html |archive-date=17 December 2022 }}</ref> V-NAND was first commercially manufactured by [[Company:Samsung Electronics|Samsung Electronics]] in 2013.<ref name="samsung-3d">{{Cite press release |date=13 August 2013 |title=Samsung Introduces World's First 3D V-NAND Based SSD for Enterprise Applications |url=https://www.samsung.com/semiconductor/insights/news-events/samsung-introduces-worlds-first-3d-v-nand-based-ssd-for-enterprise-applications/ |url-status=dead |archive-url=https://web.archive.org/web/20190414192036/https://www.samsung.com/semiconductor/insights/news-events/samsung-introduces-worlds-first-3d-v-nand-based-ssd-for-enterprise-applications/ |archive-date=14 April 2019 |publisher=[[Company:Samsung|Samsung]] }}</ref><ref name="samsung-3d-ee">{{Cite news |last=Clarke |first=Peter |date=8 August 2013 |title=Samsung Confirms 24 Layers in 3D NAND |work=EE Times |url=https://www.eetimes.com/samsung-confirms-24-layers-in-3d-nand/ |url-status=live |archive-url=https://web.archive.org/web/20200219151255/https://www.eetimes.com/samsung-confirms-24-layers-in-3d-nand/ |archive-date=19 February 2020 }}</ref><ref name="samsung-20141009">{{Cite press release |date=9 October 2014 |title=Samsung Electronics Starts Mass Production of Industry First 3-bit 3D V-NAND Flash Memory |url=https://news.samsung.com/global/samsung-electronics-starts-mass-production-of-industry-first-3-bit-3d-v-nand-flash-memory |url-status=live |archive-url=https://web.archive.org/web/20230330135736/https://news.samsung.com/global/samsung-electronics-starts-mass-production-of-industry-first-3-bit-3d-v-nand-flash-memory |archive-date=30 March 2023 |publisher=[[Company:Samsung|Samsung]] }}</ref><ref name="samsung-vnand-2014">{{Cite web |date=September 2014 |title=Samsung V-NAND technology |url=http://www.samsung.com/us/business/oem-solutions/pdfs/V-NAND_technology_WP.pdf |url-status=dead |archive-url=https://web.archive.org/web/20160327194431/http://www.samsung.com/us/business/oem-solutions/pdfs/V-NAND_technology_WP.pdf |archive-date=27 March 2016 |access-date=27 March 2016 |publisher=[[Company:Samsung|Samsung]] }}</ref>

====Structure====
V-NAND uses a [[Charge trap flash|charge trap flash]] geometry (which was commercially introduced in 2002 by [[Engineering:AMD|AMD]] and [[Company:Fujitsu|Fujitsu]])<ref name="auto3"/> that stores charge on an embedded [[Chemistry:Silicon nitride|silicon nitride]] film. Such a film is more robust against point defects and can be made thicker to hold larger numbers of electrons. V-NAND wraps a planar charge trap cell into a cylindrical form.<ref name="vnand" /> As of 2020, 3D NAND Flash memories by Micron and Intel instead use floating gates, however, Micron 128 layer and above 3D NAND memories use a conventional charge trap structure, due to the dissolution of the partnership between Micron and Intel. Charge trap 3D NAND Flash is thinner than floating gate 3D NAND. In floating gate 3D NAND, the memory cells are completely separated from one another, whereas in charge trap 3D NAND, vertical groups of memory cells share the same silicon nitride material.<ref name="anandtech-20201109">{{Cite news |last=Tallis |first=Billy |date=9 November 2020 |title=Micron Announces 176-layer 3D NAND |work=[[AnandTech]] |url=https://www.anandtech.com/show/16230/micron-announces-176layer-3d-nand |url-status=live |archive-url=https://web.archive.org/web/20231102133017/https://www.anandtech.com/show/16230/micron-announces-176layer-3d-nand |archive-date=2 November 2023 }}</ref> <!--the exact details of the V-NAND structure vary by manufacturer.-->

An individual memory cell is made up of one planar polysilicon layer containing a hole filled by multiple concentric vertical cylinders. The hole's polysilicon surface acts as the gate electrode. The outermost silicon dioxide cylinder acts as the gate dielectric, enclosing a silicon nitride cylinder that stores charge, in turn enclosing a silicon dioxide cylinder as the tunnel dielectric that surrounds a central rod of conducting polysilicon which acts as the conducting channel.<ref name="vnand" />

Memory cells in different vertical layers do not interfere with each other, as the charges cannot move vertically through the silicon nitride storage medium, and the electric fields associated with the gates are closely confined within each layer. The vertical collection is electrically identical to the serial-linked groups in which conventional NAND&nbsp;flash memory is configured.<ref name="vnand" />

====Construction====
Growth of a group of V-NAND cells begins with an alternating stack of conducting (doped) polysilicon layers and insulating silicon dioxide layers.<ref name="vnand" />

The next step is to form a cylindrical hole through these layers. In practice, a 128&nbsp;Gbit V-NAND chip with 24 layers of memory cells requires about 2.9 billion such holes. Next, the hole's inner surface receives multiple coatings, first silicon dioxide, then silicon nitride, then a second layer of silicon dioxide. Finally, the hole is filled with conducting (doped) polysilicon.<ref name="vnand" />

====Performance====
{{As of|2013|post=,}} V-NAND flash architecture allows read and write operations twice as fast as conventional NAND and can last up to 10 times as long, while consuming 50 percent less power. They offer comparable physical bit density using 10-nm lithography but may be able to increase bit density by up to two orders of magnitude, given V-NAND's use of up to several hundred layers.<ref name="vnand" /> As of 2020, V-NAND chips with 160 layers are under development by Samsung.<ref name="techspot-20200420">{{Cite news |last=Potoroaca |first=Adrian |date=20 April 2020 |title=Samsung said to be developing industry's first 160-layer NAND flash memory chip |work=TechSpot |url=https://www.techspot.com/news/84905-samsung-developing-industry-first-160-layer-nand-flash.html |url-status=live |archive-url=https://web.archive.org/web/20231102130037/https://www.techspot.com/news/84905-samsung-developing-industry-first-160-layer-nand-flash.html |archive-date=2 November 2023 }}</ref>

====Cost====
[[File:3D NAND minimum cost example.png|thumb|right|300px|'''Minimum bit cost of 3D NAND from non-vertical sidewall.''' The top opening widens with more layers, counteracting the increase in bit density.]]
The wafer cost of a 3D NAND is comparable with scaled down (32&nbsp;nm or less) planar NAND Flash.<ref>{{cite web|url=https://www.linkedin.com/pulse/toshibas-cost-model-3d-nand-frederick-chen|title=Toshiba's Cost Model for 3D NAND|website=www.linkedin.com}}</ref> However, with planar NAND scaling stopping at 16&nbsp;nm, the cost per bit reduction can continue by 3D NAND starting with 16 layers. However, due to the non-vertical sidewall of the hole etched through the layers; even a slight deviation leads to a minimum bit cost, i.e., minimum equivalent design rule (or maximum density), for a given number of layers; this minimum bit cost layer number decreases for smaller hole diameter.<ref>{{cite web |title=Calculating the Maximum Density and Equivalent 2D Design Rule of 3D NAND Flash |url=https://www.linkedin.com/pulse/calculating-maximum-density-equivalent-2d-design-rule-frederick-chen |website=linkedin.com |access-date=1 June 2022}}; {{cite web |url=https://semiwiki.com/lithography/296121-calculating-the-maximum-density-and-equivalent-2d-design-rule-of-3d-nand-flash/ |title=Calculating the Maximum Density and Equivalent 2D Design Rule of 3D NAND Flash |website=semwiki.com |access-date=1 June 2022}}</ref>

==Limitations==

===Block erasure===
One limitation of flash memory is that it can be erased only a block at a time. This generally sets all bits in the block to 1. Starting with a freshly erased block, any location within that block can be programmed. However, once a bit has been set to 0, only by erasing the entire block can it be changed back to 1. In other words, flash memory (specifically NOR&nbsp;flash) offers random-access read and programming operations but does not offer arbitrary random-access rewrite or erase operations. A location can, however, be rewritten as long as the new value's 0 bits are a superset of the over-written values. For example, a [[Nibble|nibble]] value may be erased to 1111, then written as 1110. Successive writes to that nibble can change it to 1010, then 0010, and finally 0000. Essentially, erasure sets all bits to 1, and programming can only clear bits to 0.<ref>
[http://ww1.microchip.com/downloads/en/AppNotes/doc2546.pdf "AVR105: Power Efficient High Endurance Parameter Storage in Flash Memory"].
p. 3
</ref>
Some file systems designed for flash devices make use of this rewrite capability, for example Yaffs1, to represent sector metadata.
Other flash file systems, such as YAFFS2, never make use of this "rewrite" capability—they do a lot of extra work to meet a "write once rule".

Although data structures in flash memory cannot be updated in completely general ways, this allows members to be "removed" by marking them as invalid. This technique may need to be modified for [[Multi-level cell|multi-level cell]] devices, where one memory cell holds more than one bit.

Common flash devices such as USB&nbsp;flash drives and memory cards provide only a block-level interface, or [[Software:Flash translation layer|flash translation layer]] (FTL), which writes to a different cell each time to wear-level the device. This prevents incremental writing within a block; however, it does help the device from being prematurely worn out by intensive write patterns.

===Data retention===
[[File:Micron_45_nm_NOR_Flash_Data_Retention.png|thumb|right|300px|45nm NOR flash memory example of data retention varying with temperatures]]
Data stored on flash cells is steadily lost due to electron detrapping{{Definition needed|data detrapping is not a familiar concept to the average wikipedia reader.|date=December 2022}}. The rate of loss increases exponentially as the [[Physics:Absolute temperature|absolute temperature]] increases. For example: For a 45&nbsp;nm NOR Flash, at 1000 hours, the threshold voltage (Vt) loss at 25 deg Celsius is about half that at 90 deg Celsius.<ref>{{cite book
| last1 = Calabrese |first1 =Marcello|title =Proceedings of 2013 International Conference on IC Design & Technology (ICICDT)|chapter =Accelerated reliability testing of flash memory: Accuracy and issues on a 45nm NOR technology| date = May 2013 | chapter-url = https://ieeexplore.ieee.org/document/6563298 |pages =37–40| doi = 10.1109/ICICDT.2013.6563298 |isbn =978-1-4673-4743-3|s2cid =37127243| access-date = June 22, 2022}}</ref>

===Memory wear===
Another limitation is that flash memory has a finite number of program{{snd}} erase cycles (typically written as P/E&nbsp;cycles).<ref name="snia-2009-04">{{Cite tech report |url=https://www.snia.org/sites/default/files/SSSI_NAND_Reliability_White_Paper_0.pdf |title=NAND Flash Solid State Storage for the Enterprise, An In-depth Look at Reliability |last=Thatcher |first=Jonathan |last2=Coughlin |first2=Tom |date=April 2009 |publisher=Solid State Storage Initiative (SSSI) of the Storage Network Industry Association (SNIA) |last3=Handy |first3=Jim |last4=Ekker |first4=Neal |access-date=6 December 2011 |archive-url=https://web.archive.org/web/20111014033413/http://snia.org/sites/default/files/SSSI_NAND_Reliability_White_Paper_0.pdf |archive-date=14 October 2011 |url-status=live }}</ref><ref name="kingston-slc-mlc-tlc">{{Cite web |date=February 2022 |title=Difference between SLC, MLC, TLC and 3D NAND in USB flash drives, SSDs and memory cards |url=https://www.kingston.com/en/blog/pc-performance/difference-between-slc-mlc-tlc-3d-nand |url-status=live |archive-url=https://web.archive.org/web/20231128154805/https://www.kingston.com/en/blog/pc-performance/difference-between-slc-mlc-tlc-3d-nand |archive-date=28 November 2023 |publisher=Kingston Technology }}</ref> [[Company:Micron Technology|Micron Technology]] and [[Company:Sun Microsystems|Sun Microsystems]] announced an SLC&nbsp;NAND flash memory chip rated for 1,000,000&nbsp;P/E&nbsp;cycles on 17 December 2008.<ref name="micron-20081217">{{Cite press release |last=Bordner |first=Kirstin |date=17 December 2008 |title=Micron Collaborates with Sun Microsystems to Extend Lifespan of Flash-Based Storage, Achieves One Million Write Cycles |url=https://investors.micron.com/news-releases/news-release-details/micron-collaborates-sun-microsystems-extend-lifespan-flash-based |url-status=live |archive-url=https://web.archive.org/web/20220320082948/https://investors.micron.com/news-releases/news-release-details/micron-collaborates-sun-microsystems-extend-lifespan-flash-based |archive-date=20 March 2022 |publisher=[[Company:Micron Technology|Micron Technology]] |place=Boise, Idaho }}</ref> Longer P/E cycles of Industrial SSDs speak for their endurance level and make them more reliable for Industrial usage.

The guaranteed cycle count may apply only to block zero (as is the case with TSOP&nbsp;NAND devices), or to all blocks (as in NOR). This effect is mitigated in some chip firmware or file system drivers by counting the writes and dynamically remapping blocks in order to spread write operations between sectors; this technique is called [[Wear leveling|wear leveling]]. Another approach is to perform write verification and remapping to spare sectors in case of write failure, a technique called [[Engineering:Bad sector|bad block]] management (BBM). For portable consumer devices, these wear out management techniques typically extend the life of the flash memory beyond the life of the device itself, and some data loss may be acceptable in these applications. For high-reliability data storage, however, it is not advisable to use flash memory that would have to go through a large number of programming cycles. This limitation is meaningless for 'read-only' applications such as [[Thin client|thin client]]s and [[Engineering:Router (computing)|routers]], which are programmed only once or at most a few times during their lifetimes.

In December 2012, Taiwanese engineers from Macronix revealed their intention to announce at the 2012 IEEE International Electron Devices Meeting that they had figured out how to improve NAND&nbsp;flash storage read/write cycles from 10,000 to 100 million cycles using a "self-healing" process that used a flash chip with "onboard heaters that could anneal small groups of memory cells."<ref name="phys-20121202">{{Cite news |last=Owano |first=Nancy |date=2 December 2012 |title=Taiwan engineers defeat limits of flash memory |work=phys.org |url=https://phys.org/news/2012-12-taiwan-defeat-limits-memory.html |url-status=live |archive-url=https://web.archive.org/web/20160209010327/http://phys.org/news/2012-12-taiwan-defeat-limits-memory.html |archive-date=9 February 2016 }}</ref> The built-in thermal annealing was to replace the usual erase cycle with a local high temperature process that not only erased the stored charge, but also repaired the electron-induced stress in the chip, giving write cycles of at least 100 million.<ref name="register-20121203">{{Cite news |last=Sharwood |first=Simon |date=3 December 2012 |title=Flash memory made immortal by fiery heat |work=The Register |url=https://www.theregister.co.uk/2012/12/03/macronix_thermal_annealing_extends_life_of_flash_memory/ |url-status=live |archive-url=https://web.archive.org/web/20170913183926/https://www.theregister.co.uk/2012/12/03/macronix_thermal_annealing_extends_life_of_flash_memory/ |archive-date=13 September 2017 }}</ref> The result was to be a chip that could be erased and rewritten over and over, even when it should theoretically break down. As promising as Macronix's breakthrough might have been for the mobile industry, however, there were no plans for a commercial product featuring this capability to be released any time in the near future.<ref name="yahoo1">{{Cite news |last=Wong |first=Raymond |date=4 December 2012 |title=Flash memory breakthrough could lead to even more reliable data storage |work=[[Software:Yahoo! News|Yahoo! News]] |url=https://news.yahoo.com/flash-memory-breakthrough-could-lead-even-more-reliable-124049340.html |url-status=live |archive-url=https://web.archive.org/web/20231102140438/https://news.yahoo.com/flash-memory-breakthrough-could-lead-even-more-reliable-124049340.html |archive-date=2 November 2023 }}</ref>

===Read disturb===
The method used to read NAND&nbsp;flash memory can cause nearby cells in the same memory block to change over time (become programmed). This is known as read disturb. The threshold number of reads is generally in the hundreds of thousands of reads between intervening erase operations. If reading continually from one cell, that cell will not fail but rather one of the surrounding cells will on a subsequent read. To avoid the read disturb problem the flash controller will typically count the total number of reads to a block since the last erase. When the count exceeds a target limit, the affected block is copied over to a new block, erased, then released to the block pool. The original block is as good as new after the erase. If the flash controller does not intervene in time, however, a '''read disturb''' error will occur with possible data loss if the errors are too numerous to correct with an error-correcting code.<ref name="micron-tn-29-17">{{Cite web |date=April 2010 |title=NAND Flash Design and Use Considerations Introduction |url=https://media-www.micron.com/-/media/client/global/documents/products/technical-note/nand-flash/tn2917.pdf |url-status=live |archive-url=https://web.archive.org/web/20220303140013/https://media-www.micron.com/-/media/client/global/documents/products/technical-note/nand-flash/tn2917.pdf |archive-date=3 March 2022 |access-date=29 July 2011 |publisher=[[Company:Micron Technology|Micron Technology]] |id=TN-29-17 }}</ref><ref name=NEA>{{cite web |title=Technology For Managing NAND Flash |last=Kawamatus |first=Tatsuya |publisher=Hagiwara sys-com co., LTD |access-date=15 May 2018 |url=http://read.pudn.com/downloads151/ebook/654250/0808002.pdf |archive-url=https://web.archive.org/web/20180515164812/http://read.pudn.com/downloads151/ebook/654250/0808002.pdf |archive-date=2018-05-15 |url-status=dead }}</ref><ref name="flash-memory-summit">{{Cite conference |date=August 2007 |title=The Inconvenient Truths of NAND Flash Memory |url=https://www.dslreports.com/r0/download/1507743~59e7b9dda2c0e0a0f7ff119a7611c641/flash_mem_summit_jcooke_inconvenient_truths_nand.pdf |conference=Flash Memory Summit 2007 |publisher=[[Company:Micron Technology|Micron Technology]] |archive-url=https://web.archive.org/web/20180215023326/http://www.dslreports.com/r0/download/1507743~59e7b9dda2c0e0a0f7ff119a7611c641/flash_mem_summit_jcooke_inconvenient_truths_nand.pdf |archive-date=15 February 2018 |last1=Cooke |url-status=live |first1=Jim }}</ref>

=== X-ray effects ===
Most flash ICs come in [[Engineering:Ball grid array|ball grid array]] (BGA) packages, and even the ones that do not are often mounted on a PCB next to other BGA packages. After PCB Assembly, boards with BGA packages are often X-rayed to see if the balls are making proper connections to the proper pad, or if the BGA needs [[Engineering:Rework (electronics)|rework]]. These X-rays can erase programmed bits in a flash chip (convert programmed "0" bits into erased "1" bits). Erased bits ("1" bits) are not affected by X-rays.<ref>
Richard Blish.
[http://www.spansion.com/Support/Application%20Notes/Dose_Minimization_Xray_Inspect_AN.pdf "Dose Minimization During X-ray Inspection of Surface-Mounted Flash ICs"] {{webarchive|url=https://web.archive.org/web/20160220204227/http://www.spansion.com/Support/Application%20Notes/Dose_Minimization_Xray_Inspect_AN.pdf |date=20 February 2016 }}.
p. 1.
</ref><ref>
Richard Blish.
[http://www.spansion.com/Support/Application%20Notes/X-ray_inspection_on_flash_AN.pdf "Impact of X-Ray Inspection on Spansion Flash Memory"] {{webarchive|url=https://web.archive.org/web/20160304044211/http://www.spansion.com/Support/Application%20Notes/X-ray_inspection_on_flash_AN.pdf |date=4 March 2016 }}
</ref>

Some manufacturers are now making X-ray proof SD<ref>{{cite web |url= https://www.sandisk.com/home/memory-cards/sd-cards/extremepro-sd-uhs-i |title= SanDisk Extreme PRO SDHC/SDXC UHS-I Memory Card |access-date= 2016-02-03 |url-status= live |archive-url= https://web.archive.org/web/20160127214859/https://www.sandisk.com/home/memory-cards/sd-cards/extremepro-sd-uhs-i |archive-date= 27 January 2016}}</ref> and USB<ref>{{cite web |url= http://www.samsung.com/us/computer/memory-storage-accessories/MUF-32BB/AM |title= Samsung 32GB USB 3.0 Flash Drive FIT MUF-32BB/AM |access-date= 2016-02-03 |url-status= live |archive-url= https://web.archive.org/web/20160203145010/http://www.samsung.com/us/computer/memory-storage-accessories/MUF-32BB/AM |archive-date= 3 February 2016}}</ref> memory devices.

==Low-level access==
The low-level interface to flash memory chips differs from those of other memory types such as DRAM, [[Read-only memory|ROM]], and [[EEPROM]], which support bit-alterability (both zero to one and one to zero) and [[Random access|random access]] via externally accessible [[Engineering:Address bus|address bus]]es.

NOR memory has an external address bus for reading and programming. For NOR memory, reading and programming are random-access, and unlocking and erasing are block-wise. For NAND memory, reading and programming are page-wise, and unlocking and erasing are block-wise.

===NOR memories===
[[File:IPhone 3G teardown - Intel 3050M0Y0CE -3303.jpg|thumb|NOR flash by Intel]]
Reading from NOR flash is similar to reading from random-access memory, provided the address and data bus are mapped correctly. Because of this, most microprocessors can use NOR&nbsp;flash memory as [[Execute in place|execute in place]] (XIP) memory, meaning that programs stored in NOR&nbsp;flash can be executed directly from the NOR&nbsp;flash without needing to be copied into RAM first. NOR&nbsp;flash may be programmed in a random-access manner similar to reading. Programming changes bits from a logical one to a zero. Bits that are already zero are left unchanged. Erasure must happen a block at a time, and resets all the bits in the erased block back to one. Typical block sizes are 64, 128, or 256&nbsp;KiB.

Bad block management is a relatively new feature in NOR&nbsp;chips. In older NOR devices not supporting bad block management, the software or [[Device driver|device driver]] controlling the memory chip must correct for blocks that wear out, or the device will cease to work reliably.

The specific commands used to lock, unlock, program, or erase NOR memories differ for each manufacturer. To avoid needing unique driver software for every device made, special [[Common Flash Memory Interface]] (CFI) commands allow the device to identify itself and its critical operating parameters.

Besides its use as random-access ROM, NOR&nbsp;flash can also be used as a storage device, by taking advantage of random-access programming. Some devices offer read-while-write functionality so that code continues to execute even while a program or erase operation is occurring in the background. For sequential data writes, NOR&nbsp;flash chips typically have slow write speeds, compared with NAND&nbsp;flash.

Typical NOR flash does not need an error correcting code.<ref name="types_of_ecc">
Spansion.
[http://www.spansion.com/Support/Application%20Notes/Types_of_ECC_Used_on_Flash_AN.pdf "What Types of ECC Should Be Used on Flash Memory?"] {{webarchive|url=https://web.archive.org/web/20160304044226/http://www.spansion.com/Support/Application%20Notes/Types_of_ECC_Used_on_Flash_AN.pdf |date=4 March 2016 }}.
2011.
</ref>

===NAND memories===<!-- This section is linked from [[Engineering:Centrino|Centrino]] -->
NAND flash architecture was introduced by Toshiba in 1989.<ref name="toshiba-20020909b" /> These memories are accessed much like block devices, such as hard disks. Each block consists of a number of pages. The pages are typically 512,<ref name="ieee_cf">
{{Cite news |last1=Kim |first1=Jesung |last2=Kim |first2=John Min |last3=Noh |first3=Sam H. |last4=Min |first4=Sang Lyul |last5=Cho |first5=Yookun |date=May 2002 |title=A Space-Efficient Flash Translation Layer for CompactFlash Systems |periodical=Proceedings of the IEEE |volume=48 |issue=2 |pages=366–375 |doi=10.1109/TCE.2002.1010143 }}</ref> 2,048 or 4,096 bytes in size. Associated with each page are a few bytes (typically 1/32 of the data size) that can be used for storage of an error correcting code (ECC) [[Checksum|checksum]].

Typical block sizes include:

* 32 pages of 512+16 bytes each for a block size (effective) of 16&nbsp;[[Kibibyte|KiB]]
* 64 pages of 2,048+64 bytes each for a block size of 128&nbsp;KiB<ref name="micron-tn-29-07">{{Cite web |title=Small-Block vs. Large-Block NAND flash Devices |url=https://www.micron.com/support/~/media/74C3F8B1250D4935898DB7FE79EB56E7.ashx |url-status=live |archive-url=https://web.archive.org/web/20231029033047/http://www.micron.com/support/~/media/74C3F8B1250D4935898DB7FE79EB56E7.ashx |archive-date=29 October 2023 |type=PDF |id=TN-29-07 }}</ref>
* 64 pages of 4,096+128 bytes each for a block size of 256&nbsp;KiB<ref name="nxp-an10860">{{Cite web |date=11 August 2009 |title=LPC313x NAND flash data and bad block management |url=https://www.nxp.com/docs/en/application-note/AN10860.pdf |url-status=live |archive-url=https://web.archive.org/web/20231208071652/https://www.nxp.com/docs/en/application-note/AN10860.pdf |archive-date=8 December 2023 |publisher=NXP Semiconductors |id=AN10860 }}</ref>
* 128 pages of 4,096+128 bytes each for a block size of 512&nbsp;KiB.

Modern NAND flash may have erase block size between 1 MiB to 128 MiB. While reading and programming is performed on a page basis, erasure can only be performed on a block basis.<ref name="L Smith">{{cite web |url=https://www.snia.org/sites/default/education/tutorials/2009/spring/solid/JonathanThatcher_NandFlash_SSS_PerformanceV10-nc.pdf |title=NAND Flash Solid State Storage Performance and Capability – an In-depth Look |last=Thatcher |first=Jonathan |date=18 August 2009 |publisher=SNIA |access-date=2012-08-28 |url-status=live |archive-url=https://web.archive.org/web/20120907062956/http://www.snia.org/sites/default/education/tutorials/2009/spring/solid/JonathanThatcher_NandFlash_SSS_PerformanceV10-nc.pdf |archive-date=7 September 2012}}</ref>

NAND devices also require bad block management by the device driver software or by a separate [[Flash memory controller|controller]] chip. Some SD&nbsp;cards, for example, include controller circuitry to perform bad block management and [[Wear leveling|wear leveling]]. When a logical block is accessed by high-level software, it is mapped to a physical block by the device driver or controller. A number of blocks on the flash chip may be set aside for storing mapping tables to deal with bad blocks, or the system may simply check each block at power-up to create a bad block map in RAM. The overall memory capacity gradually shrinks as more blocks are marked as bad.

NAND relies on ECC to compensate for bits that may spontaneously fail during normal device operation. A typical ECC will correct a one-bit error in each 2048&nbsp;bits (256&nbsp;bytes) using 22&nbsp;bits of ECC, or a one-bit error in each 4096&nbsp;bits (512&nbsp;bytes) using 24&nbsp;bits of ECC.<ref name="samsung_ecc">{{cite web |url=http://www.elnec.com/sw/samsung_ecc_algorithm_for_256b.pdf |title=Samsung ECC algorithm |access-date=15 August 2008 |publisher=Samsung |date=June 2008 |url-status=live |archive-url=https://web.archive.org/web/20081012043739/http://www.elnec.com/sw/samsung_ecc_algorithm_for_256b.pdf |archive-date=12 October 2008}}</ref> If the ECC cannot correct the error during read, it may still detect the error. When doing erase or program operations, the device can detect blocks that fail to program or erase and mark them bad. The data is then written to a different, good block, and the bad block map is updated.

[[Hamming code]]s are the most commonly used ECC for SLC&nbsp;NAND flash. [[Reed–Solomon error correction|Reed-Solomon codes]] and BCH codes (Bose-Chaudhuri-Hocquenghem codes) are commonly used ECC for MLC&nbsp;NAND flash. Some MLC&nbsp;NAND flash chips internally generate the appropriate BCH&nbsp;error correction codes.<ref name="types_of_ecc" />

Most NAND devices are shipped from the factory with some bad blocks. These are typically marked according to a specified bad block marking strategy. By allowing some bad blocks, manufacturers achieve far higher [[Engineering:Semiconductor device fabrication#Device test|yields]] than would be possible if all blocks had to be verified to be good. This significantly reduces NAND&nbsp;flash costs and only slightly decreases the storage capacity of the parts.

When executing software from NAND memories, [[Virtual memory|virtual memory]] strategies are often used: memory contents must first be [[Paging|paged]] or copied into memory-mapped RAM and executed there (leading to the common combination of NAND + RAM). A [[Memory management unit|memory management unit]] (MMU) in the system is helpful, but this can also be accomplished with [[Overlay (programming)|overlays]]. For this reason, some systems will use a combination of NOR and NAND memories, where a smaller NOR memory is used as software ROM and a larger NAND memory is partitioned with a file system for use as a non-volatile data storage area.

NAND sacrifices the random-access and execute-in-place advantages of NOR. NAND is best suited to systems requiring high capacity data storage. It offers higher densities, larger capacities, and lower cost. It has faster erases, sequential writes, and sequential reads.

===Standardization===
A group called the [[Organization:Open NAND Flash Interface Working Group|Open NAND Flash Interface Working Group]] (ONFI) has developed a standardized low-level interface for NAND&nbsp;flash chips. This allows interoperability between conforming NAND devices from different vendors. The ONFI specification version 1.0<ref>{{cite web |url=http://onfi.org/wp-content/uploads/2009/02/onfi_1_0_gold.pdf |title=Open NAND Flash Interface Specification |publisher=Open NAND Flash Interface |date=28 December 2006 |access-date=31 July 2010 |url-status=dead |archive-url=https://web.archive.org/web/20110727145313/http://onfi.org/wp-content/uploads/2009/02/onfi_1_0_gold.pdf |archive-date=27 July 2011}}</ref> was released on 28 December 2006. It specifies:

* A standard physical interface ([[Engineering:Pinout|pinout]]) for NAND flash in TSOP-48, WSOP-48, [[Engineering:Land grid array|LGA]]-52, and [[Engineering:Ball grid array|BGA]]-63 packages
* A standard command set for reading, writing, and erasing NAND flash chips
* A mechanism for self-identification (comparable to the [[Serial presence detect|serial presence detect]]ion feature of SDRAM memory modules)

The ONFI group is supported by major NAND flash manufacturers, including Hynix, [[Company:Intel|Intel]], [[Company:Micron Technology|Micron Technology]], and Numonyx, as well as by major manufacturers of devices incorporating NAND&nbsp;flash chips.<ref>A list of ONFi members is available at {{cite web |url=http://onfi.org/membership/ |title=Membership - ONFi |access-date=2009-09-21 |url-status=live |archive-url=https://web.archive.org/web/20090829141114/http://onfi.org/membership/ |archive-date=29 August 2009}}</ref>

Two major flash device manufacturers, [[Company:Toshiba|Toshiba]] and [[Company:Samsung|Samsung]], have chosen to use an interface of their own design known as Toggle Mode (and now Toggle). This interface isn't [[Engineering:Pin compatibility#Pin-to-pin compatibility|pin-to-pin compatible]] with the ONFI specification. The result is that a product designed for one vendor's devices may not be able to use another vendor's devices.<ref name="toshiba-20100811">{{Cite press release |date=11 August 2010 |title=Toshiba Introduces Double Data Rate Toggle Mode NAND in MLC And SLC Configurations |url=http://www.toshiba.com/taec/news/press_releases/2010/memy_10_599.jsp |url-status=dead |archive-url=https://web.archive.org/web/20151225111800/http://www.toshiba.com/taec/news/press_releases/2010/memy_10_599.jsp |archive-date=25 December 2015 |publisher=[[Company:Toshiba|Toshiba]] |place=Irvine, Calif. }}</ref>

A group of vendors, including [[Company:Intel|Intel]], [[Company:Dell|Dell]], and [[Company:Microsoft|Microsoft]], formed a [[Engineering:NVM Express|Non-Volatile Memory Host Controller Interface]] (NVMHCI) Working Group.<ref name="microsoft-20070530">{{Cite press release |date=30 May 2007 |title=Dell, Intel And Microsoft Join Forces To Increase Adoption of NAND-Based Flash Memory in PC Platforms |url=https://news.microsoft.com/2007/05/30/dell-intel-and-microsoft-join-forces-to-increase-adoption-of-nand-based-flash-memory-in-pc-platforms/ |url-status=live |archive-url=https://web.archive.org/web/20230603210924/https://news.microsoft.com/2007/05/30/dell-intel-and-microsoft-join-forces-to-increase-adoption-of-nand-based-flash-memory-in-pc-platforms/ |archive-date=3 June 2023 |access-date=12 August 2014 |publisher=[[Company:Microsoft|Microsoft]] |location=Redmond, Wash }}</ref> The goal of the group is to provide standard software and hardware programming interfaces for nonvolatile memory subsystems, including the "flash cache" device connected to the [[Engineering:PCI Express|PCI Express]] bus.

==Distinction between NOR and NAND flash==
NOR and NAND flash differ in two important ways:
* The connections of the individual memory cells are different.<ref>{{Cite book|url=https://books.google.com/books?id=vaq11vKwo_kC&dq=nor+flash+nand+flash&pg=PA3|title=Inside NAND Flash Memories|first1=Rino|last1=Micheloni|first2=Luca|last2=Crippa|first3=Alessia|last3=Marelli|date=27 July 2010|publisher=Springer Science & Business Media|isbn=9789048194315 |via=Google Books}}</ref>
* The interface provided for reading and writing the memory is different; NOR allows [[Random access|random access]] as it can be either byte-addressable or word-addressable, with words being for example 32 bits long,<ref name="factsonfile">{{Cite book |last1=Daintith |first1=John |last2=Wright |first2=Edmund |url=https://books.google.com/books?id=9Q9XNh716ikC&dq=nor+byte+addressable&pg=PA123 |title=The Facts on File Dictionary of Computer Science |date=14 May 2014 |publisher=Infobase Publishing |isbn=9781438109398 |via=Google Books }}</ref><ref>{{Cite book|url=https://books.google.com/books?id=VDkPEAAAQBAJ&dq=nor+byte+addressable&pg=PR22|title=Silicon Based Unified Memory Devices and Technology|first=Arup|last=Bhattacharyya|date=6 July 2017|publisher=CRC Press|isbn=9781351798327 |via=Google Books}}</ref><ref>{{Cite book|url=https://books.google.com/books?id=rGjkBQAAQBAJ&dq=nor+random+access+byte+addressable&pg=PA59|title=FUNDAMENTALS OF COMPUTERS|first1=V.|last1=RAJARAMAN|first2=NEEHARIKA|last2=ADABALA|date=15 December 2014|publisher=PHI Learning Pvt. Ltd.|isbn=9788120350670 |via=Google Books}}</ref> while NAND allows only page access.<ref>{{cite web|last=Aravindan|first=Avinash|date=2018-07-23|title=Flash 101: NAND Flash vs NOR Flash|url=https://www.embedded.com/flash-101-nand-flash-vs-nor-flash/|access-date=2020-12-23|website=Embedded.com|language=en-US}}</ref>

NOR and NAND flash get their names from the structure of the interconnections between memory cells.{{Citation needed|date=September 2020}} In NOR&nbsp;flash, cells are connected in parallel to the bit lines, allowing cells to be read and programmed individually.<ref name="auto7">{{Cite book|url=https://books.google.com/books?id=vaq11vKwo_kC&dq=nand+flash+xip&pg=PA12|title=Inside NAND Flash Memories|first1=Rino|last1=Micheloni|first2=Luca|last2=Crippa|first3=Alessia|last3=Marelli|date=27 July 2010|publisher=Springer Science & Business Media|isbn=9789048194315 |via=Google Books}}</ref> The parallel connection of cells resembles the parallel connection of transistors in a CMOS NOR gate.<ref>{{Cite book|url=https://books.google.com/books?id=44mbEAAAQBAJ&dq=nor+flash+nor+gate&pg=PA55|title=Springer Handbook of Semiconductor Devices|first1=Massimo|last1=Rudan|first2=Rossella|last2=Brunetti|first3=Susanna|last3=Reggiani|date=10 November 2022|publisher=Springer Nature|isbn=9783030798277 |via=Google Books}}</ref> In NAND&nbsp;flash, cells are connected in series,<ref name="auto7"/>  resembling a CMOS NAND gate. The series connections consume less space than parallel ones, reducing the cost of NAND&nbsp;flash.<ref name="auto7"/>  It does not, by itself, prevent NAND cells from being read and programmed individually.{{Citation needed|date=September 2020}}

Each NOR flash cell is larger than a NAND&nbsp;flash cell{{snd}} 10&nbsp;F<sup>2</sup> vs 4&nbsp;F<sup>2</sup>{{snd}} even when using exactly the same [[Engineering:Semiconductor device fabrication|semiconductor device fabrication]] and so each transistor, contact, etc. is exactly the same size{{snd}} because NOR&nbsp;flash cells require a separate metal contact for each cell.<ref>{{Citation |publisher=Micron |url=http://www.micron.com/~/media/Documents/Products/Technical%20Note/NAND%20Flash/tn2919_nand_101.pdf |id=TN-29-19 |title=NAND Flash 101: An Introduction to NAND Flash and How to Design It in to Your Next Product |pages=2–3 |url-status=dead |archive-url=https://web.archive.org/web/20160604054353/https://www.micron.com/~/media/Documents/Products/Technical%20Note/NAND%20Flash/tn2919_nand_101.pdf |archive-date=4 June 2016}}</ref>

Because of the series connection and removal of wordline contacts, a large grid of NAND&nbsp;flash memory cells will occupy perhaps only 60% of the area of equivalent NOR cells<ref name="flash_overview">{{Cite news |last1=Pavan |first1=Paolo |last2=Bez |first2=Roberto |last3=Olivo |first3=Piero |last4=Zanoni |first4=Enrico |publication-date=August 1997 |title=Flash Memory Cells – An Overview |periodical=Proceedings of the IEEE |volume=85 |issue=8 |pages=1248–1271 |url= https://ieeexplore.ieee.org/document/622505 |access-date=15 August 2008 |doi=10.1109/5.622505 |year=1997}}</ref> (assuming the same [[Engineering:CMOS|CMOS]] process resolution, for example, 130&nbsp;nm, 90&nbsp;nm, or 65&nbsp;nm). NAND&nbsp;flash's designers realized that the area of a NAND chip, and thus the cost, could be further reduced by removing the external address and data bus circuitry. Instead, external devices could communicate with NAND&nbsp;flash via sequential-accessed command and data registers, which would internally retrieve and output the necessary data. This design choice made random-access of NAND&nbsp;flash memory impossible, but the goal of NAND&nbsp;flash was to replace mechanical hard disks, not to replace ROMs.

{| class="wikitable"
|-
! Attribute !! NAND !! NOR
|-
| Main application || File storage || Code execution
|-
| Storage capacity || High || Low
|-
| Cost per bit || Low || 
|-
| Active power || Low || 
|-
| Standby power ||  || Low
|-
| Write speed || Fast || 
|-
| Read speed || || Fast
|-
| [[Execute in place]] (XIP) || No || Yes
|-
| Reliability || || High
|}

===Write endurance===
The write endurance of SLC floating-gate NOR flash is typically equal to or greater than that of NAND&nbsp;flash, while MLC&nbsp;NOR and NAND&nbsp;flash have similar endurance capabilities. Examples of endurance cycle ratings listed in datasheets for NAND and NOR&nbsp;flash, as well as in storage devices using flash memory, are provided.<ref>{{cite web |url=http://electronicdesign.com/memory/fundamentals-flash-memory-storage |title=The Fundamentals of Flash Memory Storage |access-date=2017-01-03 |url-status=live |archive-url=https://web.archive.org/web/20170104163357/http://electronicdesign.com/memory/fundamentals-flash-memory-storage |archive-date=4 January 2017|date=2012-03-20 }}</ref>

{| class="wikitable"
|-
! Type of flash<br>memory !! Endurance rating<br>(erases per [[Block (data storage)|block]]) !! Example(s) of flash memory or storage device
|-
| SLC NAND || 50,000–100,000 || Samsung OneNAND KFW4G16Q2M, Toshiba SLC NAND Flash chips,<ref name="auto">{{cite web|url=https://business.toshiba-memory.com/en-emea/product/memory/slc-nand/slc.html|title=SLC NAND Flash Memory &#124; TOSHIBA MEMORY &#124; Europe(EMEA)|website=business.toshiba-memory.com|access-date=1 January 2019|archive-date=1 January 2019|archive-url=https://web.archive.org/web/20190101193808/https://business.toshiba-memory.com/en-emea/product/memory/slc-nand/slc.html|url-status=dead}}</ref><ref>{{cite web|url=https://www.toshiba.com/tma/technologymoves/slc-nand.jsp|title=SLC NAND |website=Toshiba.com |archive-url=https://web.archive.org/web/20180901074546/https://www.toshiba.com/tma/technologymoves/slc-nand.jsp |archive-date=1 September 2018 |url-status=dead }}</ref><ref>{{cite web|url=https://business.toshiba-memory.com/en-emea/product/memory/slc-nand/serial.html|title=Serial Interface NAND &#124; TOSHIBA MEMORY &#124; Europe(EMEA)|website=business.toshiba-memory.com|access-date=1 January 2019|archive-date=1 January 2019|archive-url=https://web.archive.org/web/20190101145411/https://business.toshiba-memory.com/en-emea/product/memory/slc-nand/serial.html|url-status=dead}}</ref><ref>{{cite web|url=https://business.toshiba-memory.com/en-emea/product/memory/slc-nand/benand.html|title=BENAND &#124; TOSHIBA MEMORY &#124; Europe(EMEA)|website=business.toshiba-memory.com|access-date=1 January 2019|archive-date=1 January 2019|archive-url=https://web.archive.org/web/20190101145413/https://business.toshiba-memory.com/en-emea/product/memory/slc-nand/benand.html|url-status=dead}}</ref><ref>{{cite web|url=https://business.toshiba-memory.com/en-emea/product/memory/slc-nand.html|title=SLC NAND Flash Memory &#124; TOSHIBA MEMORY &#124; Europe(EMEA)|website=business.toshiba-memory.com|access-date=1 January 2019|archive-date=1 January 2019|archive-url=https://web.archive.org/web/20190101145415/https://business.toshiba-memory.com/en-emea/product/memory/slc-nand.html|url-status=dead}}</ref> Transcend SD500, Fujitsu S26361-F3298
|-
| [[Multi-level cell|MLC]] NAND || 5,000–10,000 for<br>medium-capacity;<br />1,000 to 3,000 for<br>high-capacity<ref name="auto4">{{cite web|url=https://arstechnica.com/gadgets/2019/09/new-intel-toshiba-ssd-technologies-squeeze-more-bits-into-each-cell/|title=SSDs are on track to get bigger and cheaper thanks to PLC technology|first=Jim|last=Salter|date=28 September 2019|website=Ars Technica}}</ref> || Samsung K9G8G08U0M (Example for medium-capacity applications), Memblaze PBlaze4,<ref>{{cite web|url=http://memblaze.com/en/index.php?c=article&a=type&tid=54|title=PBlaze4_Memblaze|website=memblaze.com|access-date=2019-03-28}}</ref> ADATA SU900, Mushkin Reactor
|-
| TLC NAND || 1,000 || Samsung SSD 840
|-
| QLC NAND || unknown || SanDisk X4 NAND flash SD cards<ref>{{cite web|url=https://www.cnet.com/news/sandisk-to-begin-making-x4-flash-chips/|title=SanDisk to begin making 'X4' flash chips|first=Brooke|last=Crothers|website=CNET}}</ref><ref>{{cite web|url=https://www.cnet.com/news/sandisk-ships-x4-flash-chips/|title=SanDisk ships 'X4' flash chips|first=Brooke|last=Crothers|website=CNET}}</ref><ref>{{cite web|url=https://phys.org/news/2009-10-sandisk-ships-memory-cards-gigabit.html|title=SanDisk Ships Flash Memory Cards With 64 Gigabit X4 NAND Technology|website=phys.org}}</ref><ref>{{cite web|url=https://www.photoreview.com.au/news/sandisk-begins-mass-production-of-x4-flash-memory-chips/|title=SanDisk Begins Mass Production of X4 Flash Memory Chips|date=17 February 2012}}</ref>
|-
| 3D SLC NAND || >100,000 || Samsung Z-NAND<ref name="auto2">{{cite web|url=https://www.anandtech.com/show/13951/the-samsung-983-zet-znand-ssd-review|title=The Samsung 983 ZET (Z-NAND) SSD Review: How Fast Can Flash Memory Get?|first=Billy|last=Tallis|website=AnandTech.com}}</ref>
|-
| {{nowrap|3D MLC NAND}} || 6,000–40,000 || Samsung SSD 850 PRO, Samsung SSD 845DC PRO,<ref name="AnandTech-SSD850PROEndurance">{{cite web|last1=Vättö|first1=Kristian|title=Testing Samsung 850 Pro Endurance & Measuring V-NAND Die Size|url=http://www.anandtech.com/show/8239/update-on-samsung-850-pro-endurance-vnand-die-size|website=[[AnandTech]]|access-date=11 June 2017|url-status=live|archive-url=https://web.archive.org/web/20170626155736/http://www.anandtech.com/show/8239/update-on-samsung-850-pro-endurance-vnand-die-size|archive-date=26 June 2017}}</ref><ref name="AnandTech-SamsungSSD845DCPreview-p3">{{cite web|last1=Vättö|first1=Kristian|title=Samsung SSD 845DC EVO/PRO Performance Preview & Exploring IOPS Consistency|url=http://www.anandtech.com/show/8319/samsung-ssd-845dc-evopro-preview-exploring-worstcase-iops/3|website=[[AnandTech]]|access-date=11 June 2017|page=3|url-status=live|archive-url=https://web.archive.org/web/20161022231209/http://www.anandtech.com/show/8319/samsung-ssd-845dc-evopro-preview-exploring-worstcase-iops/3|archive-date=22 October 2016}}</ref> Samsung 860 PRO
|-
| 3D TLC NAND || 1,500–5,000 || Samsung SSD 850 EVO, Samsung SSD 845DC EVO, Crucial MX300<ref name="AnandTech-SamsungSSD850EVOReview-p4">{{cite web|last1=Vättö|first1=Kristian|title=Samsung SSD 850 EVO (120GB, 250GB, 500GB & 1TB) Review|url=http://www.anandtech.com/show/8747/samsung-ssd-850-evo-review/4|website=[[AnandTech]]|access-date=11 June 2017|page=4|url-status=live|archive-url=https://web.archive.org/web/20170531043312/http://www.anandtech.com/show/8747/samsung-ssd-850-evo-review/4|archive-date=31 May 2017}}</ref><ref name="AnandTech-SamsungSSD845DCPreview-p2">{{cite web|last1=Vättö|first1=Kristian|title=Samsung SSD 845DC EVO/PRO Performance Preview & Exploring IOPS Consistency|url=http://www.anandtech.com/show/8319/samsung-ssd-845dc-evopro-preview-exploring-worstcase-iops/3|website=[[AnandTech]]|access-date=11 June 2017|page=2|url-status=live|archive-url=https://web.archive.org/web/20161022231209/http://www.anandtech.com/show/8319/samsung-ssd-845dc-evopro-preview-exploring-worstcase-iops/3|archive-date=22 October 2016}}</ref><ref name="Toms-FlashIndustryTrends">{{Cite news |date=9 June 2017 |title=Flash Industry Trends Could Lead Users Back to Spinning Disks |work=[[Tom's Hardware]] |url=https://www.tomshardware.com/news/consumer-optane-enterprise-ssd-market,34631.html |url-status=live |access-date=11 June 2017 |archive-url=https://web.archive.org/web/20231106202840/https://www.tomshardware.com/news/consumer-optane-enterprise-ssd-market,34631.html |archive-date=6 November 2023 |last1=Ramseyer |first1=Chris }}</ref>，Memblaze PBlaze5 900, Memblaze PBlaze5 700, Memblaze PBlaze5 910/916, Memblaze PBlaze5 510/516,<ref name="memblaze-pblaze5-700">{{Cite web |title=PBlaze5 700 |url=http://memblaze.com/en/index.php?c=article&a=type&tid=100 |url-status=dead |archive-url=https://web.archive.org/web/20190328104601/http://memblaze.com/en/index.php?c=article&a=type&tid=100 |archive-date=28 March 2019 |access-date=28 March 2019 |website=memblaze.com }}</ref><ref name="memblaze-pblaze5-900">{{Cite web |title=PBlaze5 900 |url=http://memblaze.com/en/index.php?c=article&a=type&tid=101 |url-status=dead |archive-url=https://web.archive.org/web/20190328104342/http://memblaze.com/en/index.php?c=article&a=type&tid=101 |archive-date=28 March 2019 |access-date=28 March 2019 |website=memblaze.com }}</ref><ref name="memblaze-pblaze5-910">{{Cite web |title=PBlaze5 910/916 series NVMe SSD |url=http://memblaze.com/en/index.php?c=article&a=type&tid=102 |url-status=dead |archive-url=https://web.archive.org/web/20190327091248/https://memblaze.com/en/index.php?c=article&a=type&tid=102 |archive-date=27 March 2019 |access-date=26 March 2019 |website=memblaze.com }}</ref><ref name="memblaze-pblaze5-510">{{Cite web |title=PBlaze5 510/516 series NVMe™ SSD |url=http://memblaze.com/en/index.php?c=article&a=type&tid=103 |url-status=dead |archive-url=https://web.archive.org/web/20190327091116/http://memblaze.com/en/index.php?c=article&a=type&tid=103 |archive-date=27 March 2019 |access-date=26 March 2019 |website=memblaze.com }}</ref> ADATA SX 8200 PRO (also being sold under "XPG Gammix" branding, model S11 PRO)
|-
| 3D QLC NAND || 100–1,500 ||  Samsung SSD 860 QVO SATA, Intel SSD 660p, Micron 5210 ION, Crucial P1, Samsung SSD BM991 NVMe<ref name="evans-qlc-nand">{{Cite web |last=Evans |first=Chris |date=7 November 2018 |title=QLC NAND - What can we expect from the technology? |url=https://www.architecting.it/blog/qlc-nand/ |url-status=live |archive-url=https://web.archive.org/web/20231102133726/https://www.architecting.it/blog/qlc-nand/ |archive-date=2 November 2023 }}</ref><ref name="micron-20181105">{{Cite press release |last=Dicker |first=Derek |date=5 November 2018 |title=Say Hello: Meet the World's First QLC SSD, the Micron 5210 ION |url=https://www.micron.com/about/blog/2018/november/meet%20the%20worlds%20first%20qlc%20ssd%20the%20micron%205210%20ion |url-status=live |archive-url=https://web.archive.org/web/20190130163245/https://www.micron.com/about/blog/2018/november/meet%20the%20worlds%20first%20qlc%20ssd%20the%20micron%205210%20ion |archive-date=30 January 2019 |publisher=[[Company:Micron Technology|Micron Technology]] }}</ref><ref>{{cite web|url=https://www.micron.com/products/advanced%20solutions/qlc%20nand|title=QLC NAND|website=Micron.com}}{{Dead link|date=October 2022 |bot=InternetArchiveBot |fix-attempted=yes }}</ref><ref name="anandtech-20180807">{{Cite news |last=Tallis |first=Billy |title=The Intel SSD 660p SSD Review: QLC NAND Arrives For Consumer SSDs |work=[[AnandTech]] |url=https://www.anandtech.com/show/13078/the-intel-ssd-660p-ssd-review-qlc-nand-arrives |url-status=live |archive-url=https://web.archive.org/web/20231102131136/https://www.anandtech.com/show/13078/the-intel-ssd-660p-ssd-review-qlc-nand-arrives |archive-date=2 November 2023 }}</ref><ref>{{cite web|url=http://www.storagesearch.com/ssdmyths-endurance.html|title=SSD endurance myths and legends articles on StorageSearch.com|website=StorageSearch.com}}</ref><ref name="toms-20181019">{{Cite news |last=Webster |first=Sean |date=19 October 2018 |title=Samsung Announces QLC SSDs And Second-Gen Z-NAND |work=[[Tom's Hardware]] |url=https://www.tomshardware.com/news/samsung-qlc-z-nand-ssd-flash,37945.html |url-status=live |archive-url=https://web.archive.org/web/20231102141850/https://www.tomshardware.com/news/samsung-qlc-z-nand-ssd-flash,37945.html |archive-date=2 November 2023 }}</ref><ref name="pcgamesn-20190108">{{Cite news |last=James |first=Dave |date=8 January 2019 |title=Samsung 860 QVO review: the first QLC SATA SSD, but it can't topple TLC yet |work=PCGamesN |url=https://www.pcgamesn.com/samsung-860-qvo-review-benchmarks-qlc-ssd |url-status=live |archive-url=https://web.archive.org/web/20231121125529/https://www.pcgamesn.com/samsung-860-qvo-review-benchmarks-qlc-ssd |archive-date=21 November 2023 }}</ref><ref name="samsung-20180807">{{Cite press release |date=7 August 2018 |title=Samsung Electronics Starts Mass Production of Industry's First 4-bit Consumer SSD |url=https://news.samsung.com/global/samsung-electronics-starts-mass-production-of-industrys-first-4-bit-consumer-ssd |url-status=live |archive-url=https://web.archive.org/web/20231102132203/https://news.samsung.com/global/samsung-electronics-starts-mass-production-of-industrys-first-4-bit-consumer-ssd |archive-date=2 November 2023 |publisher=[[Company:Samsung|Samsung]] }}</ref>
|-
| 3D PLC NAND || unknown || In development by SK Hynix (formerly Intel)<ref name="reuters-20201020">{{Cite news |last1=Jin |first1=Hyunjoo |last2=Nellis |first2=Stephen |last3=Hu |first3=Krystal |last4=Bera |first4=Ayanti |last5=Lee |first5=Joyce |date=20 October 2020 |title=South Korea's SK Hynix to buy Intel's NAND business for $9 billion |editor-last=Coates |editor-first=Stephen |url=https://www.reuters.com/article/us-intel-divestiture-sk-hynix-idUSKBN2742IY |url-status=live |archive-url=https://web.archive.org/web/20231102132619/https://www.reuters.com/article/us-intel-divestiture-sk-hynix-idUSKBN2742IY |archive-date=2 November 2023 |newspaper={{wipe|Reuters}} }}</ref> and [[Company:Kioxia|Kioxia]] (formerly Toshiba Memory).<ref name="auto4" />
|-
| SLC (floating-<br>gate) NOR || 100,000–1,000,000 || Numonyx M58BW (Endurance rating of 100,000 erases per block);<br />[[Company:Spansion|Spansion]] S29CD016J (Endurance rating of 1,000,000 erases per block)
|-
| MLC (floating-<br>gate) NOR || 100,000 || Numonyx J3 flash
|}

However, by applying certain algorithms and design paradigms such as [[Wear leveling|wear leveling]] and memory over-provisioning, the endurance of a storage system can be tuned to serve specific requirements.<ref>{{cite web |url=http://www.wdc.com/WDProducts/SSD/whitepapers/en/NAND_Evolution_0812.pdf |title=NAND Evolution and its Effects on Solid State Drive Useable Life |publisher=Western Digital |year=2009 |access-date=22 April 2012 |url-status=dead |archive-url=https://web.archive.org/web/20111112000643/http://www.wdc.com/WDProducts/SSD/whitepapers/en/NAND_Evolution_0812.pdf |archive-date=12 November 2011}}</ref>

In order to compute the longevity of the NAND&nbsp;flash, one must account for the size of the memory chip, the type of memory (e.g. SLC/MLC/TLC), and use pattern. Industrial NAND are in demand due to their capacity, longer endurance and reliability in sensitive environments.

As the number of bits per cell increases, performance and life of NAND flash may degrade, increasing random read times to 100μs for TLC NAND which is 4 times the time required in SLC NAND, and twice the time required in MLC NAND, for random reads.<ref name="auto6"/>

==Flash file systems==
{{Main|Flash file system}}

Because of the particular characteristics of flash memory, it is best used with either a controller to perform wear leveling and error correction or specifically designed flash file systems, which spread writes over the media and deal with the long erase times of NOR&nbsp;flash blocks. The basic concept behind flash file systems is the following: when the flash store is to be updated, the file system will write a new copy of the changed data to a fresh block, remap the file pointers, then erase the old block later when it has time.

In practice, flash file systems are used only for memory technology devices (MTDs), which are embedded flash memories that do not have a controller. Removable flash [[Memory card|memory card]]s, SSDs, eMMC/[[Engineering:Universal Flash Storage|eUFS]] chips and [[Engineering:USB flash drive|USB flash drive]]s have built-in [[Flash memory controller|controller]]s to perform wear leveling and error correction so use of a specific flash file system may not add benefit.

==Capacity==
Multiple chips are often arrayed or die stacked to achieve higher capacities<ref>{{cite news |url=http://www.dailycircuitry.com/2012/04/as-follow-up-to-our-flash-vs-dram.html |title=Flash vs DRAM follow-up: chip stacking |publisher=The Daily Circuit |date=22 April 2012 |access-date=22 April 2012 |url-status=dead |archive-url=https://web.archive.org/web/20121124042741/http://www.dailycircuitry.com/2012/04/as-follow-up-to-our-flash-vs-dram.html |archive-date=24 November 2012}}</ref> for use in consumer electronic devices such as multimedia players or [[Engineering:GPS|GPS]]s. The capacity scaling (increase) of flash chips used to follow [[Moore's law]] because they are manufactured with many of the same integrated circuits techniques and equipment. Since the introduction of 3D NAND, scaling is no longer necessarily associated with Moore's law since ever smaller transistors (cells) are no longer used.

Consumer flash storage devices typically are advertised with usable sizes expressed as a small integer power of two (2, 4, 8, etc.) and a conventional designation of megabytes (MB) or gigabytes (GB); e.g., 512&nbsp;MB, 8&nbsp;GB. This includes [[Solid-state drive|SSD]]s marketed as hard drive replacements, in accordance with traditional hard drives, which use [[SI prefix|decimal prefixes]].<ref>{{cite web |url=http://www.convertunits.com/type/computer+data+storage |title=Computer data storage unit conversion - non-SI quantity |access-date=2015-05-20 |url-status=live |archive-url=https://web.archive.org/web/20150508070909/http://www.convertunits.com/type/computer+data+storage |archive-date=8 May 2015}}</ref> Thus, an SSD marked as "64&nbsp;[[Gigabyte|GB]]" is at least {{nowrap|64 × 1000<sup>3</sup>}} bytes (64&nbsp;GB). Most users will have slightly less capacity than this available for their files, due to the space taken by file system metadata and because some operating systems report SSD capacity using [[Binary prefix|binary prefix]]es which are somewhat larger than conventional prefixes .

The flash memory chips inside them are sized in strict binary multiples, but the actual total capacity of the chips is not usable at the drive interface.
It is considerably larger than the advertised capacity in order to allow for distribution of writes ([[Wear leveling|wear leveling]]), for sparing, for error correction codes, and for other [[Metadata|metadata]] needed by the device's internal firmware.

In 2005, Toshiba and [[Company:SanDisk|SanDisk]] developed a NAND&nbsp;flash chip capable of storing 1&nbsp;GB of data using [[Multi-level cell|multi-level cell]] (MLC) technology, capable of storing two bits of data per cell. In September 2005, [[Company:Samsung Electronics|Samsung Electronics]] announced that it had developed the world's first 2&nbsp;GB chip.<ref>{{cite news |first=Anton |last=Shilov |url=http://www.xbitlabs.com/news/memory/display/20050912212649.html |title=Samsung Unveils 2GB Flash Memory Chip |publisher=X-bit labs |date=12 September 2005 |access-date=30 November 2008 |url-status=dead |archive-url=https://web.archive.org/web/20081224220204/http://www.xbitlabs.com/news/memory/display/20050912212649.html |archive-date=24 December 2008}}</ref>

In March 2006, Samsung announced flash hard drives with a capacity of 4&nbsp;GB, essentially the same order of magnitude as smaller laptop hard drives, and in September 2006, Samsung announced an 8&nbsp;GB chip produced using a 40&nbsp;nm manufacturing process.<ref>{{cite news |first=Wolfgang |last=Gruener |url=http://www.tgdaily.com/content/view/28504/135/ |archive-url=https://web.archive.org/web/20080323070752/http://www.tgdaily.com/content/view/28504/135/ |url-status=dead |archive-date=23 March 2008 |title=Samsung announces 40 nm Flash, predicts 20 nm devices |publisher=TG Daily |date=11 September 2006 |access-date=30 November 2008 }}</ref>
In January 2008, SanDisk announced availability of their 16&nbsp;GB MicroSDHC and 32&nbsp;GB SDHC Plus cards.<ref name="sandisk-20080107">{{Cite press release |date=7 January 2008 |title=SanDisk Announces the 12-Gigabyte microSDHC Card - the World's Largest Capacity Card for Mobile Phones |url=http://www.sandisk.com/Corporate/PressRoom/PressReleases/PressRelease.aspx?ID=4079 |url-status=dead |archive-url=https://web.archive.org/web/20081219084116/http://www.sandisk.com/Corporate/PressRoom/PressReleases/PressRelease.aspx?ID=4079 |archive-date=19 December 2008 |publisher=[[Company:SanDisk|SanDisk]] |place=Las Vegas, Nevada |id=4079 }}</ref><ref name="sandisk-20080131">{{Cite press release |date=31 January 2008 |title=SanDisk UltraII Line Picks Up Speed and Boosts Capacity with New 32- AND 16-Gigabyte SDHC and 8GB SDHC Plus Cards |url=http://www.sandisk.com/Corporate/PressRoom/PressReleases/PressRelease.aspx?ID=4091 |url-status=dead |archive-url=https://web.archive.org/web/20081219084247/http://www.sandisk.com/Corporate/PressRoom/PressReleases/PressRelease.aspx?ID=4091 |archive-date=19 December 2008 |publisher=[[Company:SanDisk|SanDisk]] |place=Las Vegas, Nevada |id=4091 }}</ref>

More recent flash drives (as of 2012) have much greater capacities, holding 64, 128, and 256&nbsp;GB.<ref>https://www.pcworld.com/article/225370/look_out_for_the_256gb_thumb_drive_and_the_128gb_tablet.html{{dead link|date=June 2022}}; {{cite web |url=https://techcrunch.com/2009/07/20/kingston-outs-the-first-256gb-flash-drive/ |title=Kingston outs the first 256GB flash drive |date=20 July 2009 |access-date=2017-08-28 |url-status=live |archive-url=https://web.archive.org/web/20170708012814/https://techcrunch.com/2009/07/20/kingston-outs-the-first-256gb-flash-drive/ |archive-date=8 July 2017}} 20 July 2009, Kingston DataTraveler 300 is 256&nbsp;GB.</ref>

A joint development at Intel and Micron will allow the production of 32-layer 3.5 terabyte (TB{{clarify|3500 GB or 3.5 * 1024 GB?|date=February 2020}}) NAND&nbsp;flash sticks and 10&nbsp;TB standard-sized SSDs. The device includes 5 packages of 16 × 48&nbsp;GB&nbsp;TLC dies, using a floating gate cell design.<ref>{{Cite news |url = http://www.gizmag.com/high-capacity-3d-flash-memory/36782 |title = 3D flash technology moves forward with 10&nbsp;TB SSDs and the first 48-layer memory cells |last = Borghino |first = Dario |date = 31 March 2015 |work = Gizmag |access-date = 31 March 2015 |url-status = live |archive-url = https://web.archive.org/web/20150518115212/http://www.gizmag.com/high-capacity-3d-flash-memory/36782/ |archive-date = 18 May 2015}}</ref>

Flash chips continue to be manufactured with capacities under or around 1&nbsp;MB (e.g. for BIOS-ROMs and embedded applications).

In July 2016, Samsung announced the 4 TB {{clarify|4000 GB or 4 * 1024 GB?|date=February 2020}} Samsung 850 EVO which utilizes their 256&nbsp;Gbit 48-layer TLC 3D V-NAND.<ref>{{Cite news|url=https://www.custompcreview.com/news/samsung-launches-4tb-850-evo-ssd-priced-1499/30838/|title=Samsung Launches Monster 4TB 850 EVO SSD Priced at $1,499 {{!}} Custom PC Review|date=2016-07-13|newspaper=Custom PC Review |access-date=2016-10-08|url-status=live|archive-url=https://web.archive.org/web/20161009172049/https://www.custompcreview.com/news/samsung-launches-4tb-850-evo-ssd-priced-1499/30838/|archive-date=9 October 2016}}</ref> In August 2016, Samsung announced a 32&nbsp;TB 2.5-inch SAS&nbsp;SSD based on their 512&nbsp;Gbit 64-layer TLC 3D&nbsp;V-NAND. Further, Samsung expects to unveil SSDs with up to 100&nbsp;TB of storage by 2020.<ref>{{Cite news|url=https://www.custompcreview.com/news/samsung-unveils-32tb-ssd-leveraging-4th-gen-64-layer-3d-v-nand/31651/|title=Samsung Unveils 32TB SSD Leveraging 4th Gen 64-Layer 3D V-NAND {{!}} Custom PC Review|date=2016-08-11|newspaper=Custom PC Review |access-date=2016-10-08|url-status=live|archive-url=https://web.archive.org/web/20161009170533/https://www.custompcreview.com/news/samsung-unveils-32tb-ssd-leveraging-4th-gen-64-layer-3d-v-nand/31651/|archive-date=9 October 2016}}</ref>

==Transfer rates==
Flash memory devices are typically much faster at reading than writing.<ref name="master2010">{{cite journal |last1=Master |first1=Neal |last2=Andrews |first2=Mathew |last3=Hick |first3=Jason |last4=Canon |first4=Shane |last5=Wright |first5=Nicholas |title=Performance analysis of commodity and enterprise class flash devices |journal=IEEE Petascale Data Storage Workshop |date=2010 |url=http://www.pdsw.org/pdsw10/resources/papers/master.pdf |url-status=live |archive-url=https://web.archive.org/web/20160506160509/http://www.pdsw.org/pdsw10/resources/papers/master.pdf |archive-date=6 May 2016}}</ref> Performance also depends on the quality of storage controllers, which become more critical when devices are partially full.{{vague|date=December 2020}}<ref name="master2010" /> Even when the only change to manufacturing is die-shrink, the absence of an appropriate controller can result in degraded speeds.<ref name="dailytech-20091002">{{Cite news |last=Ng |first=Jansen |title=Samsung Confirms 32nm Flash Problems, Working on New SSD Controller |work=dailytech.com |url=http://www.dailytech.com/article.aspx?newsid=16407 |url-status=dead |access-date=3 October 2009 |archive-url=https://web.archive.org/web/20160304003356/http://www.dailytech.com/article.aspx?newsid=16407 |archive-date=4 March 2016 }}</ref>

==Applications==

==={{Anchor|SERIAL}}Serial flash===
[[File:IPhone 3G teardown - Silicon Storage Tech SST25VF080B-3309.jpg|thumb|Serial Flash: Silicon Storage Tech SST25VF080B]]
Serial flash is a small, low-power flash memory that provides only serial access to the data - rather than addressing individual bytes, the user reads or writes large contiguous groups of bytes in the address space serially. Serial Peripheral Interface Bus (SPI) is a typical protocol for accessing the device. 
When incorporated into an [[Embedded system|embedded system]], serial flash requires fewer wires on the [[Engineering:Printed circuit board|PCB]] than parallel flash memories, since it transmits and receives data one bit at a time. This may permit a reduction in board space, power consumption, and total system cost.

There are several reasons why a serial device, with fewer external pins than a parallel device, can significantly reduce overall cost:

* Many [[Engineering:Application-specific integrated circuit|ASICs]] are pad-limited, meaning that the size of the [[Engineering:Die (integrated circuit)|die]] is constrained by the number of wire bond pads, rather than the complexity and number of gates used for the device logic. Eliminating bond pads thus permits a more compact integrated circuit, on a smaller die; this increases the number of dies that may be fabricated on a [[Engineering:Wafer (electronics)|wafer]], and thus reduces the cost per die.
* Reducing the number of external pins also reduces assembly and packaging costs. A serial device may be packaged in a smaller and simpler package than a parallel device.
* Smaller and lower pin-count packages occupy less PCB area.
* Lower pin-count devices simplify PCB routing.

There are two major SPI flash types. The first type is characterized by small pages and one or more internal SRAM page buffers allowing a complete page to be read to the buffer, partially modified, and then written back (for example, the Atmel AT45 ''DataFlash'' or the [[Company:Micron Technology|Micron Technology]] Page Erase NOR&nbsp;Flash). The second type has larger sectors where the smallest sectors typically found in this type of SPI flash are 4&nbsp;kB, but they can be as large as 64&nbsp;kB. Since this type of SPI flash lacks an internal SRAM buffer, the complete page must be read out and modified before being written back, making it slow to manage. However, the second type is cheaper than the first and is therefore a good choice when the application is code shadowing.

The two types are not easily exchangeable, since they do not have the same pinout, and the command sets are incompatible.

Most FPGAs are based on SRAM configuration cells and require an external configuration device, often a serial flash chip, to reload the configuration [[Bitstream|bitstream]] every power cycle.<ref name="maxfield">
Clive Maxfield.
[https://books.google.com/books?id=u0xyEuXF3l4C "Bebop to the Boolean Boogie: An Unconventional Guide to Electronics"].
p. 232.
</ref>

====Firmware storage====
With the increasing speed of modern CPUs, parallel flash devices are often much slower than the memory bus of the computer they are connected to. Conversely, modern SRAM offers access times below 10&nbsp;[[Nanosecond|ns]], while DDR2 SDRAM offers access times below 20&nbsp;ns. Because of this, it is often desirable to shadow code stored in flash into RAM; that is, the code is copied from flash into RAM before execution, so that the CPU may access it at full speed. Device [[Firmware|firmware]] may be stored in a serial flash chip, and then copied into SDRAM or SRAM when the device is powered-up.<ref>Many serial flash devices implement a ''bulk read'' mode and incorporate an internal address counter, so that it is trivial to configure them to transfer their entire contents to RAM on power-up. When clocked at 50&nbsp;MHz, for example, a serial flash could transfer a 64 Mbit firmware image in less than two seconds.</ref> Using an external serial flash device rather than on-chip flash removes the need for significant process compromise (a manufacturing process that is good for high-speed logic is generally not good for flash and vice versa). Once it is decided to read the firmware in as one big block it is common to add compression to allow a smaller flash chip to be used. Since 2005, many devices use serial NOR flash to deprecate parallel NOR flash for firmware storage. Typical applications for serial flash include storing firmware for hard drives, [[Ethernet]] network interface adapters, [[DSL modem]]s, etc.

===Flash memory as a replacement for hard drives===
{{Main|Solid-state drive}}
[[File:Intel 525 mSATA SSD.jpg|thumb|An Intel mSATA SSD in 2020]]
One more recent application for flash memory is as a replacement for hard disks. Flash memory does not have the mechanical limitations and latencies of hard drives, so a [[Solid-state drive|solid-state drive]] (SSD) is attractive when considering speed, noise, power consumption, and reliability. Flash drives are gaining traction as mobile device secondary storage devices; they are also used as substitutes for hard drives in high-performance desktop computers and some servers with RAID and [[Storage area network|SAN]] architectures.

There remain some aspects of flash-based SSDs that make them unattractive. The cost per gigabyte of flash memory remains significantly higher than that of hard disks.<ref name="elitepcbuilding-20110317">{{Cite web |date=17 March 2011 |title=SSD vs. HDD |url=http://elitepcbuilding.com/ssd-vs-hdd |url-status=dead |archive-url=https://web.archive.org/web/20110820095531/http://elitepcbuilding.com/ssd-vs-hdd |archive-date=20 August 2011 |access-date=11 July 2011 |website=elitepcbuilding.com |author=((Lyth0s)) }}</ref> Also flash memory has a finite number of P/E (''program/erase'') cycles, but this seems to be currently under control since warranties on flash-based SSDs are approaching those of current hard drives.<ref>{{cite web |url=http://www.storagesearch.com/bitmicro-art1.html |title=Flash Solid State Disks – Inferior Technology or Closet Superstar? |publisher=STORAGEsearch |access-date=30 November 2008 |url-status=live |archive-url=https://web.archive.org/web/20081224215032/http://www.storagesearch.com/bitmicro-art1.html |archive-date=24 December 2008}}</ref> In addition, deleted files on SSDs can remain for an indefinite period of time before being overwritten by fresh data; erasure or shred techniques or software that work well on magnetic hard disk drives have no effect on SSDs, compromising security and forensic examination. However, due to the so-called ''[[Engineering:Trim (computing)#SD/MMC|TRIM]]'' command employed by most solid state drives, which marks the logical block addresses occupied by the deleted file as unused to enable garbage collection, data recovery software is not able to restore files deleted from such.

For relational databases or other systems that require [[ACID]] transactions, even a modest amount of flash storage can offer vast speedups over arrays of disk drives.<ref name="ssd-strat-mysql">{{Cite web |last=Matsunobu |first=Yoshinori |date=15 April 2010 |title=SSD Deployment Strategies for MySQL |url=http://www.slideshare.net/matsunobu/ssd-deployment-strategies-for-mysql |url-status=dead |archive-url=https://web.archive.org/web/20160303224013/http://www.slideshare.net/matsunobu/ssd-deployment-strategies-for-mysql |archive-date=3 March 2016 }}</ref>

In May 2006, [[Company:Samsung Electronics|Samsung Electronics]] announced two flash-memory based PCs, the Q1-SSD and Q30-SSD were expected to become available in June 2006, both of which used 32&nbsp;GB SSDs, and were at least initially available only in {{wipe|South Korea}}.<ref>{{cite web |url=http://www.samsung.com/he/presscenter/pressrelease/pressrelease_20060524_0000257996.asp |title=Samsung Electronics Launches the World's First PCs with NAND Flash-based Solid State Disk |work=Press Release |publisher=Samsung |date=24 May 2006 |access-date=30 November 2008 |url-status=live |archive-url=https://web.archive.org/web/20081220094813/http://www.samsung.com/he/presscenter/pressrelease/pressrelease_20060524_0000257996.asp |archive-date=20 December 2008}}</ref> The Q1-SSD and Q30-SSD launch was delayed and finally was shipped in late August 2006.<ref>{{cite web| url=https://news.softpedia.com/news/Samsung-s-SSD-Notebook-33475.shtml| title=Samsung's SSD Notebook| date=22 August 2006| access-date=15 October 2018| archive-date=15 October 2018| archive-url=https://web.archive.org/web/20181015192607/https://news.softpedia.com/news/Samsung-s-SSD-Notebook-33475.shtml| url-status=dead}}</ref>

The first flash-memory based PC to become available was the Sony Vaio UX90, announced for pre-order on 27 June 2006 and began to be shipped in Japan on 3 July 2006 with a 16Gb flash memory hard drive.<ref name="sony-20060627">{{Cite press release |date=27 June 2006 |title=文庫本サイズの「VAIO type U」 フラッシュメモリー搭載モデル発売 |trans-title=Release of the "VAIO type U" paperback-sized model with flash memory |url=https://www.sony.jp/CorporateCruise/Press/200606/06-0627/ |url-status=live |archive-url=https://web.archive.org/web/20230510003927/https://www.sony.jp/CorporateCruise/Press/200606/06-0627/ |archive-date=10 May 2023 |publisher=[[Company:Sony|Sony]] |language=ja }}</ref> In late September 2006 Sony upgraded the flash-memory in the Vaio UX90 to 32Gb.<ref>{{cite web | url=http://nbnews.info/en/news/397 | title=Sony Vaio UX UMPC – now with 32 GB Flash memory &#124; NBnews.info. Laptop and notebook news, reviews, test, specs, price &#124; Каталог ноутбуков, ультрабуков и планшетов, новости, обзоры | access-date=7 November 2018 | archive-date=28 June 2022 | archive-url=https://web.archive.org/web/20220628004451/https://nbnews.info/en/news/397 | url-status=dead }}</ref>

A solid-state drive was offered as an option with the first MacBook Air introduced in 2008, and from 2010 onwards, all models were shipped with an SSD. Starting in late 2011, as part of [[Company:Intel|Intel]]'s [[Engineering:Ultrabook|Ultrabook]] initiative, an increasing number of ultra-thin laptops are being shipped with SSDs standard.

There are also hybrid techniques such as [[Hybrid drive|hybrid drive]] and [[Software:ReadyBoost|ReadyBoost]] that attempt to combine the advantages of both technologies, using flash as a high-speed non-volatile [[Cache (computing)|cache]] for files on the disk that are often referenced, but rarely modified, such as application and operating system [[Executable|executable]] files.

===Flash memory as RAM===
{{As of|2012|post=,}} there are attempts to use flash memory as the main computer memory, [[Dynamic random-access memory|DRAM]].<ref name="toms-20120725">{{Cite news |last=Perry |first=Douglas |date=July 25, 2012  |title=Princeton: Replacing RAM with Flash Can Save Massive Power |work=[[Tom's Hardware]] |url=https://www.tomshardware.com/news/fusio-io-flash-ssdalloc-memory-ram,16352.html |url-status=live |archive-url=https://web.archive.org/web/20231106092024/https://www.tomshardware.com/news/fusio-io-flash-ssdalloc-memory-ram,16352.html |archive-date=6 November 2023 }}</ref>

===Archival or long-term storage===
Floating-gate transistors in the flash storage device hold charge which represents data. This charge gradually leaks over time, leading to an accumulation of [[Data integrity#Logical integrity|logical errors]], also known as "bit rot" or "bit fading".<ref name=ni12 />

==== Data retention ====
It is unclear how long data on flash memory will persist under archival conditions (i.e., benign temperature and humidity with infrequent access with or without prophylactic rewrite). Datasheets of Atmel's flash-based "ATmega" microcontrollers typically promise retention times of 20 years at 85&nbsp;°C (185&nbsp;°F) and 100 years at 25&nbsp;°C (77&nbsp;°F).<ref>{{cite web |title=8-Bit AVR Microcontroller ATmega32A Datasheet Complete |date=2016-02-19 |access-date=2016-05-29 |page=18 |url=https://www.atmel.com/images/atmel-8155-8-bit-microcontroller-avr-atmega32a_datasheet.pdf |quote=Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85&nbsp;°C or 100 years at 25&nbsp;°C |url-status=dead |archive-url=https://web.archive.org/web/20160409120244/http://www.atmel.com/Images/Atmel-8155-8-bit-Microcontroller-AVR-ATmega32A_Datasheet.pdf |archive-date=9 April 2016}}</ref>

The retention span varies among types and models of flash storage. When supplied with power and idle, the charge of the transistors holding the data is routinely refreshed by the [[Firmware|firmware]] of the flash storage.<ref name="ni12">{{Cite web |date=23 July 2020 |title=Understanding Life Expectancy of Flash Storage |url=https://www.ni.com/en-us/support/documentation/supplemental/12/understanding-life-expectancy-of-flash-storage.html |url-status=live |archive-url=https://web.archive.org/web/20231201202529/https://www.ni.com/en/support/documentation/supplemental/12/understanding-life-expectancy-of-flash-storage.html |archive-date=1 December 2023 |access-date=19 December 2020 |website=www.ni.com }}</ref> The ability to retain data varies among flash storage devices due to differences in firmware, [[Data redundancy|data redundancy]], and error correction algorithms.<ref name="bunnie-microsdcards">{{Cite web |date=29 December 2013 |title=On Hacking MicroSD Cards |url=https://www.bunniestudios.com/blog/?p=3554 |url-status=live |archive-url=https://web.archive.org/web/20231102105433/https://www.bunniestudios.com/blog/?p=3554 |archive-date=2 November 2023 |website=bunnie's blog }}</ref>

An article from [[Organization:Carnegie Mellon University|CMU]] in 2015 states "Today's flash devices, which do not require flash refresh, have a typical retention age of 1 year at room temperature." And that retention time decreases exponentially with increasing temperature. The phenomenon can be modeled by the [[Arrhenius equation]].<ref>{{cite web
 |title       = Data Retention in MLC NAND Flash Memory: Characterization, Optimization, and Recovery
 |date        = 2015-01-27
 |access-date  = 2016-04-27
 |page       = 10
 |url         = https://users.ece.cmu.edu/~omutlu/pub/flash-memory-data-retention_hpca15.pdf
 |url-status     = live
 |archive-url  = https://web.archive.org/web/20161007000927/https://users.ece.cmu.edu/~omutlu/pub/flash-memory-data-retention_hpca15.pdf
 |archive-date = 7 October 2016}}</ref><ref>{{cite web
|title = JEDEC SSD Specifications Explained
|url = https://www.jedec.org/sites/default/files/Alvin_Cox%20%5BCompatibility%20Mode%5D_0.pdf
|at = p. 27
}}</ref>

=== FPGA configuration ===

Some FPGAs are based on flash configuration cells that are used directly as (programmable) switches to connect internal elements together, using the same kind of floating-gate transistor as the flash data storage cells in data storage devices.<ref name="maxfield" />

==Industry==

One source states that, in 2008, the flash memory industry includes about US$9.1 billion in production and sales. Other sources put the flash memory market at a size of more than US$20 billion in 2006, accounting for more than eight percent of the overall semiconductor market and more than 34 percent of the total semiconductor memory market.<ref>{{cite journal|last=Yinug |first=Christopher Falan |date=July 2007 |title=The Rise of the Flash Memory Market: Its Impact on Firm Behavior and Global Semiconductor Trade Patterns |journal=Journal of International Commerce and Economics |url=http://www.usitc.gov/journal/Final_falan_article1.pdf |access-date=19 April 2008 |archive-url=https://web.archive.org/web/20080529180622/http://www.usitc.gov/journal/Final_falan_article1.pdf |archive-date=29 May 2008 |url-status=dead}}</ref>
In 2012, the market was estimated at $26.8 billion.<ref name="it2013-04-18">{{Cite news |last=Hajdarbegovic |first=Nermin |date=17 April 2013 |title=NAND memory market rockets |work=TG Daily |url=http://www.tgdaily.com/hardware-brief/71015-nand-memory-market-rockets |url-status=dead |access-date=18 April 2013 |archive-url=https://web.archive.org/web/20160208114459/http://www.tgdaily.com/hardware-brief/71015-nand-memory-market-rockets |archive-date=8 February 2016 }}</ref> It can take up to 10 weeks to produce a flash memory chip.<ref name="appleinsider-20190701">{{Cite news |last=Owen |first=Malcolm |title=Power outage may have ruined 15 exabytes of WD and Toshiba flash storage |work=AppleInsider |url=https://appleinsider.com/articles/19/07/01/power-outage-may-have-ruined-15-exabytes-of-wd-and-toshiba-memory |url-status=live |archive-url=https://web.archive.org/web/20231102134950/https://appleinsider.com/articles/19/07/01/power-outage-may-have-ruined-15-exabytes-of-wd-and-toshiba-memory |archive-date=2 November 2023 }}</ref>

===Manufacturers===
{{Main|Engineering:List of flash memory controller manufacturers|Engineering:List of solid-state drive manufacturers}}

The following were the largest NAND flash memory manufacturers, as of the second quarter of 2023.<ref>{{cite web |title=NAND Flash manufacturers' market share 2019 |url=https://www.statista.com/statistics/275886/market-share-held-by-leading-nand-flash-memory-manufacturers-worldwide/ |website=[[Company:Statista|Statista]] |access-date=3 July 2019}}</ref>

#[[Company:Samsung Electronics|Samsung Electronics]] {{ndash}} 31.4%
#[[Company:Kioxia|Kioxia]] {{ndash}} 20.6% 
#Western Digital Corporation {{ndash}} 12.6%
#[[Company:SK Hynix|SK Hynix]] {{ndash}} 18.5%
#[[Company:Micron Technology|Micron Technology]] {{ndash}} 12.3%
#Others {{ndash}} 8.7%   Note: SK Hynix acquired Intel's NAND business at the end of 2021<ref>{{cite news
 |url=https://www.reuters.com/technology/sk-hynix-completes-first-phase-9-bln-intel-nand-business-buy-2021-12-29/
 |title=SK Hynix completes first phase of $9 bln Intel NAND business buy |newspaper=Reuters |date=29 December 2021 |access-date=June 27, 2022}}</ref> Kioxia spun out and got renamed of Toshiba in 2018/2019.<ref name="zdnet-20190718">{{Cite news |last=Kwan |first=Campbell |title=Former Toshiba memory business to rebrand as Kioxia |work=[[ZDNet]] |url=https://www.zdnet.com/article/former-toshiba-memory-business-to-rebrand-as-kioxia/ |url-status=live |access-date=12 July 2023 |archive-url=https://web.archive.org/web/20231004074304/https://www.zdnet.com/article/former-toshiba-memory-business-to-rebrand-as-kioxia/ |archive-date=4 October 2023 }}</ref>

Samsung remains the largest NAND flash memory manufacturer as of first quarter 2022.<ref>{{cite web
 |url=https://businessquant.com/nand-revenue-by-manufacturer-worldwide#:~:text=NAND%20manufacturers%20collectively%20generated%20%2417.91,third%20and%20fourth%20positions%2C%20respectively.
 |title=NAND Revenue by Manufacturers Worldwide (2014-2022) |date=26 May 2020 |access-date=June 27, 2022}}</ref>

===Shipments===

{| class="wikitable sortable" style="text-align: center"
|+ Flash memory shipments ({{estimation}} manufactured units)
! Year(s)
! data-sort-type="number" | Discrete flash memory chips
! data-sort-type="number" | Flash memory data capacity (gigabytes)
! data-sort-type="number" | [[Engineering:Floating-gate MOSFET|Floating-gate MOSFET]] [[Memory cell (computing)|memory cells]] (billions)
|-
| 1992
| 26,000,000<ref name="Smithsonian">{{Cite web |year=1997 |title=The Flash Memory Market |url=http://smithsonianchips.si.edu/ice/cd/MEMORY97/SEC05.PDF#page=4 |url-status=live |archive-url=https://web.archive.org/web/20230419132956/http://smithsonianchips.si.edu/ice/cd/MEMORY97/SEC05.PDF#page=4 |archive-date=19 April 2023 |access-date=16 October 2019 |publisher=Integrated Circuit Engineering Corporation |page=4 |via=Smithsonian Institution }}</ref>
| {{formatnum:{{#expr:(256*9+512*5+1024*9+2048*2+4096*1+8192*0.1)*1024/8000000 round 1}}|}}<ref name="Smithsonian"/>
| {{formatnum:{{#expr:(256*9+512*5+1024*9+2048*2+4096*1+8192*0.1)*1024/1000000 round 0}}|}}{{efn|name=MLC|Single-level cell (1-[[Bit|bit]] per [[Memory cell (computing)|cell]]) up until 2009. [[Multi-level cell]] (up to 4-bit or half-[[Byte|byte]] per cell) commercialised in 2009.<ref name="toshiba2009"/><ref name="toshiba-sd-2009"/>}}
|-
| 1993
| 73,000,000<ref name="Smithsonian"/>
| {{formatnum:{{#expr:(256*15+512*10+1024*32+2048*9+4096*18+8192*0.2)*1024/8000000 round 0}}|}}<ref name="Smithsonian"/>
| {{formatnum:{{#expr:(256*15+512*10+1024*32+2048*9+4096*18+8192*0.2)*1024/1000000 round 0}}|}}{{efn|name=MLC}}
|-
| 1994
| 112,000,000<ref name="Smithsonian"/>
| {{formatnum:{{#expr:(256*20+512*12+1024*45+2048*12+4096*18+8192*5+16384*0.1)*1024/8000000 round 0}}|}}<ref name="Smithsonian"/>
| {{formatnum:{{#expr:(256*20+512*12+1024*45+2048*12+4096*18+8192*5+16384*0.1)*1024/1000000 round 0}}|}}{{efn|name=MLC}}
|-
| 1995
| 235,000,000<ref name="Smithsonian"/>
| {{formatnum:{{#expr:(256*25+512*22+1024*82+2048*12+4096*18+8192*5+16384*3+32768*0.1)*1024/8000000 round 0}}|}}<ref name="Smithsonian"/>
| {{formatnum:{{#expr:(256*25+512*22+1024*82+2048*12+4096*18+8192*5+16384*3+32768*0.1)*1024/1000000 round 0}}|}}{{efn|name=MLC}}
|-
| 1996
| 359,000,000<ref name="Smithsonian"/>
| {{formatnum:{{#expr:(256*30+512*34+1024*105+2048*55+4096*85+8192*40+16384*9+32768*0.6+65536*0.1)*1024/8000000 round 0}}|}}<ref name="Smithsonian"/>
| {{formatnum:{{#expr:(256*30+512*34+1024*105+2048*55+4096*85+8192*40+16384*9+32768*0.6+65536*0.1)*1024/1000000 round 0}}|}}{{efn|name=MLC}}
|-
| 1997
| {{formatnum:{{#expr:(0.2+32+135+150+160)*1000000}}|}}+<ref name="Cappelletti">{{cite book |last1=Cappelletti |first1=Paulo |last2=Golla |first2=Carla |last3=Olivo |first3=Piero |last4=Zanoni |first4=Enrico |title=Flash Memories |date=2013 |publisher=Springer Science & Business Media |isbn=9781461550150 |page=32 |url=https://books.google.com/books?id=cHzrBwAAQBAJ&pg=PA32}}</ref>
| {{formatnum:{{#expr:(64*1+16*32+8*135+4*150+1*160)*(1024*1024)/1000000/8 round 0}}|}}+<ref name="Cappelletti"/>
| {{formatnum:{{#expr:(64*1+16*32+8*135+4*150+1*160)*(1024*1024)/1000000 round 0}}|}}+{{efn|name=MLC}}
|-
| 1998
| {{formatnum:{{#expr:1800000000/1.44/1.64 round 0}}|}}<ref>{{cite journal |title=Not Flashing Quite As Fast |journal=Electronic Business |date=2000 |volume=26 |issue=7–13 |page=504 |url=https://books.google.com/books?id=e6mzAAAAIAAJ |publisher=Cahners Publishing Company |quote=Unit shipments increased 64% in 1999 from the prior year, and are forecast to increase 44% to 1.8 billion units in 2000.}}</ref>
| {{formatnum:{{#expr:(64*2+16*60+8*185+4*180+1*185)*(1024*1024)/1000000/8 round 0}}|}}+<ref name="Cappelletti"/>
| {{formatnum:{{#expr:(64*2+16*60+8*185+4*180+1*185)*(1024*1024)/1000000 round 0}}|}}+{{efn|name=MLC}}
|-
| 1999
| rowspan="2" | 12,800,000,000<ref name="evolution-of-nonvol-mem">{{Cite web |last=Sze |first=Simon Min |title=Evolution of Nonvoltatile Semiconductor Memory: From Invention to Nanocrystal Memory |url=https://indico.cern.ch/event/422861/attachments/891704/1255315/Sze_26APR05.pdf#page=41 |url-status=live |archive-url=https://web.archive.org/web/20231102132745/https://indico.cern.ch/event/422861/attachments/891704/1255315/Sze_26APR05.pdf#page=41 |archive-date=2 November 2023 |access-date=22 October 2019 |website=[[Organization:CERN|CERN]] |publisher=National Yang Ming Chiao Tung University |page=41 }}</ref>
| {{formatnum:{{#expr:(64*13+16*105+8*165+4*200+1*215)*(1024*1024)/1000000/8 round 0}}|}}+<ref name="Cappelletti"/>
| {{formatnum:{{#expr:(64*13+16*105+8*165+4*200+1*215)*(1024*1024)/1000000 round 0}}|}}+{{efn|name=MLC}}
|-
| 2000{{ndash}}2004
| rowspan="8" | {{formatnum:{{#expr:125*(1024*1024*1024)}}|}} (NAND)<ref name="Forbes">{{Cite magazine |last=Handy |first=Jim |date=26 May 2014 |title=How Many Transistors Have Ever Shipped? |url=https://www.forbes.com/sites/jimhandy/2014/05/26/how-many-transistors-have-ever-shipped/ |url-status=live |magazine={{wipe|Forbes}} |archive-url=https://web.archive.org/web/20231102131132/https://www.forbes.com/sites/jimhandy/2014/05/26/how-many-transistors-have-ever-shipped/?sh=39d954484425 |archive-date=2 November 2023 |access-date=21 October 2019 }}</ref>
| rowspan="8" | {{formatnum:{{#expr:125*(1024*1024*1024)*8}}|}} (NAND)<ref name="Forbes"/>
|-
| 2005{{ndash}}2007
| {{?}}
|-
| 2008
| {{formatnum:{{#expr:1160000000/0.946 round 0}}|}} (mobile NAND)<ref name="dramexchange">{{Cite news |date=30 December 2008 |title=Markit View: Major events in the 2008 DRAM industry; End application demand remains weak, 2009 NAND Flash demand bit growth being revised down to 81% |work=DRAMeXchange |url=https://www.dramexchange.com/WeeklyResearch/Post/2/1911.html |url-status=live |access-date=16 October 2019 |archive-url=https://web.archive.org/web/20230415091001/https://www.dramexchange.com/WeeklyResearch/Post/2/1911.html |archive-date=15 April 2023 }}</ref>
|-
| 2009
| {{formatnum:{{#expr:1160000000/0.946 round 0}}|}}+ (mobile NAND)
|-
| 2010
| 7,280,000,000+{{efn|Flash memory chip shipments in 2010:
*NOR {{ndash}} 3.64{{nbsp}}billion<ref name="ihs-20110609">{{Cite press release |date=9 June 2011 |title=NOR Flash Memory Finds Growth Opportunities in Tablets and E-Book Readers |url=https://technology.ihs.com/389310/nor-flash-memory-finds-growth-opportunities-in-tablets-and-e-book-readers |url-status=dead |archive-url=https://web.archive.org/web/20191016173757/https://technology.ihs.com/389310/nor-flash-memory-finds-growth-opportunities-in-tablets-and-e-book-readers |archive-date=16 October 2019 |access-date=16 October 2019 |publisher=[[Company:IHS Markit|IHS Markit]] |work=IHS Technology }}</ref>
*NAND {{ndash}} 3.64{{nbsp}}billion+ ({{estimation}})
}}
|-
| 2011
| 8,700,000,000<ref name="koreatimes-20120829">{{Cite news |date=29 August 2012 |title=Samsung to unveil new mass-storage memory cards |work=The Korea Times |url=http://www.koreatimes.co.kr/www/tech/2019/06/693_118515.html |url-status=live |access-date=16 October 2019 |archive-url=https://web.archive.org/web/20231102132835/http://www.koreatimes.co.kr/www/tech/2019/06/693_118515.html |archive-date=2 November 2023 }}</ref>
|-
| 2012
| {{formatnum:{{#expr:1700000000/(33/100) round 0}}|}} (serial)<ref name="winbond-20130410">{{Cite press release |date=10 April 2013 |title=Winbond Top Serial Flash Memory Supplier Worldwide, Ships 1.7 Billion Units in 2012, Ramps 58nm Production |url=https://www.businesswire.com/news/home/20130410005060/en/Winbond-Top-Serial-Flash-Memory-Supplier-Worldwide |url-status=live |archive-url=https://web.archive.org/web/20231102131008/https://www.businesswire.com/news/home/20130410005060/en/Winbond-Top-Serial-Flash-Memory-Supplier-Worldwide |archive-date=2 November 2023 |access-date=16 October 2019 |publisher=[[Company:Winbond|Winbond]] |place=San Jose, Calif. & Taichung, Taiwan |via={{wipe|Business Wire}} }}</ref>
|-
| 2013
| {{?}}
|-
| 2014
| {{?}}
| 59,000,000,000<ref name="kitguru">{{Cite news |last=Shilov |first=Anton |date=1 October 2015 |title=Samsung: NAND flash industry will triple output to 253EB by 2020 |work=KitGuru |url=https://www.kitguru.net/components/hard-drives/anton-shilov/samsung-nand-flash-industry-will-triple-output-to-253eb-by-2020/ |url-status=live |access-date=16 October 2019 |archive-url=https://web.archive.org/web/20231107110422/https://www.kitguru.net/components/hard-drives/anton-shilov/samsung-nand-flash-industry-will-triple-output-to-253eb-by-2020/ |archive-date=7 November 2023 }}</ref>
| {{formatnum:{{#expr:59000000000*2}}|}}+{{efn|name=MLC}}
|-
| 2015
| {{formatnum:{{#expr:10000000000/1.3 round 0}}|}} (NAND)<ref name="nikkei-20160721">{{Cite news |date=21 July 2016 |title=Flash memory prices rebound as makers introduce larger-capacity chips |work=Nikkei Asian Review |publisher=Nikkei, Inc. |url=https://asia.nikkei.com/Business/Flash-memory-prices-rebound-as-makers-introduce-larger-capacity-chips |url-status=live |access-date=16 October 2019 |archive-url=https://web.archive.org/web/20231102131915/https://asia.nikkei.com/Business/Flash-memory-prices-rebound-as-makers-introduce-larger-capacity-chips |archive-date=2 November 2023 }}</ref>
| 85,000,000,000<ref name="seekingalpha-20160830">{{Cite web |last=Tidwell |first=William |date=30 August 2016 |title=Data 9, Storage 1 - NAND Production Falls Behind in the Age of Hyperscale |url=https://seekingalpha.com/article/4002948-data-9-storage-1-nand-production-falls-behind-age-hyperscale |url-access=limited |url-status=live |archive-url=https://web.archive.org/web/20230418183504/https://seekingalpha.com/article/4002948-data-9-storage-1-nand-production-falls-behind-in-age-of-hyperscale |archive-date=18 April 2023 |access-date=17 October 2019 |website=[[Finance:Seeking Alpha|Seeking Alpha]] |publisher=Micron }}</ref>
| {{formatnum:{{#expr:85000000000*2}}|}}+{{efn|name=MLC}}
|-
| 2016
| {{?}}
| 100,000,000,000<ref>{{cite book |last1=Coughlin |first1=Thomas M. |title=Digital Storage in Consumer Electronics: The Essential Guide |date=2017 |publisher=Springer |isbn=9783319699073 |page=217 |url=https://books.google.com/books?id=K2dCDwAAQBAJ&pg=PA217}}</ref>
| {{formatnum:{{#expr:100000000000*2}}|}}+{{efn|name=MLC}}
|-
| 2017
| {{?}}
| 148,200,000,000{{efn|Flash memory data capacity shipments in 2017:
*NAND [[Non-volatile memory|non-volatile memory]] (NVM) {{ndash}} 85{{nbsp}}exabytes ({{estimation}})<ref name="IDC">{{Cite web |last1=Reinsel |first1=David |last2=Gantz |first2=John |last3=Rydning |first3=John |date=November 2018 |title=IDC White Paper: The Digitization of the World |url=https://www.seagate.com/files/www-content/our-story/trends/files/idc-seagate-dataage-whitepaper.pdf#page=14 |url-status=live |archive-url=https://web.archive.org/web/20231128141338/https://www.seagate.com/files/www-content/our-story/trends/files/idc-seagate-dataage-whitepaper.pdf#page=14 |archive-date=28 November 2023 |access-date=17 October 2019 |website=[[Company:Seagate Technology|Seagate Technology]] |publisher=[[Company:International Data Corporation|International Data Corporation]] |page=14 |id=US44413318 }}</ref>
*[[Solid-state drive]] (SSD) {{ndash}} 63.2{{nbsp}}exabytes<ref name="register-20180228">{{Cite news |last=Mellor |first=Chris |date=28 February 2018 |title=Who was the storage dollar daddy in 2017? S. S. D |work=The Register |url=https://www.theregister.co.uk/2018/02/28/crossover_ssd_dollars_exceeded_disk_drive_dollars_in_2017/ |url-status=live |access-date=17 October 2019 |archive-url=https://web.archive.org/web/20231110163436/https://www.theregister.com/2018/02/28/crossover_ssd_dollars_exceeded_disk_drive_dollars_in_2017/ |archive-date=10 November 2023 }}</ref>
}}
| {{formatnum:{{#expr:148200000000*2}}|}}+{{efn|name=MLC}}
|-
| 2018
| {{?}}
| 231,640,000,000{{efn|Flash memory data capacity shipments in 2018 ({{estimation}})
*NAND NVM {{ndash}} 140{{nbsp}}exabytes<ref name="IDC"/>
*SSD {{ndash}} {{#expr:63.2*1.45}}{{nbsp}}exabytes<ref name="trendfocus-20190307">{{Cite press release |date=7 March 2019 |title=Combined SSD, HDD Storage Shipped Jumps 21% to 912 Exabytes in 2018 |url=https://www.businesswire.com/news/home/20190307005812/en/TRENDFOCUS-Combined-SSD-HDD-Storage-Shipped-Jumps |url-status=live |archive-url=https://web.archive.org/web/20231102133652/https://www.businesswire.com/news/home/20190307005812/en/TRENDFOCUS-Combined-SSD-HDD-Storage-Shipped-Jumps |archive-date=2 November 2023 |access-date=17 October 2019 |publisher=TRENDFOCUS |place=Cupertino, Calif. |via={{wipe|Business Wire}} }}</ref>
}}
| {{formatnum:{{#expr:231640000000*2}}|}}+{{efn|name=MLC}}
|-
| 2019
| {{?}}
| {{?}}
| {{?}}
|-
| 2020
| {{?}}
| {{?}}
| {{?}}
|-
! 1992{{ndash}}2020
! 45,358,454,134+ memory chips
! 758,057,729,630+ gigabytes
! 2,321,421,837,044{{nbsp}}billion+ cells
|}

In addition to individual flash memory chips, flash memory is also [[Embedded system|embedded]] in [[Engineering:Microcontroller|microcontroller]] (MCU) chips and system-on-chip (SoC) devices.<ref name="arm">{{Cite conference |last=Yiu |first=Joseph |date=February 2015 |title=Design of SoC for High Reliability Systems with Embedded Processors |url=https://community.arm.com/cfs-file/__key/telligent-evolution-components-attachments/01-2142-00-00-00-00-70-29/Embedded-SoC-Design-for-High-Reliability-Systems-1.02.pdf |conference=Embedded World 2015 |publisher=[[Company:Arm Holdings|ARM]] |archive-url=https://web.archive.org/web/20231204181327/https://community.arm.com/cfs-file/__key/telligent-evolution-components-attachments/01-2142-00-00-00-00-70-29/Embedded-SoC-Design-for-High-Reliability-Systems-1.02.pdf |archive-date=4 December 2023 |access-date=23 October 2019 |url-status=live }}</ref> Flash memory is embedded in ARM chips,<ref name="arm"/> which have sold 150{{nbsp}}billion units worldwide {{as of|2019|lc=y}},<ref name="anandtech-20191008">{{Cite news |last=Smith |first=Ryan |date=8 October 2019 |title=Arm TechCon 2019 Keynote Live Blog (Starts at 10am PT/17:00 UTC) |work=[[AnandTech]] |url=https://www.anandtech.com/show/14959/arm-techcon-2019-keynote-live-blog |url-status=live |access-date=15 October 2019 |archive-url=https://web.archive.org/web/20231121113816/https://www.anandtech.com/show/14959/arm-techcon-2019-keynote-live-blog |archive-date=21 November 2023 }}</ref> and in [[Engineering:Programmable system-on-chip|programmable system-on-chip]] (PSoC) devices, which have sold 1.1{{nbsp}}billion units {{as of|2012|lc=yes}}.<ref name="cypress">{{cite web |title=2011 Annual Report |url=http://investors.cypress.com/static-files/62237288-5a22-4903-9ef8-3719d37ea699 |website=[[Company:Cypress Semiconductor|Cypress Semiconductor]] |year=2012 |access-date=16 October 2019 |archive-date=16 October 2019 |archive-url=https://web.archive.org/web/20191016115727/http://investors.cypress.com/static-files/62237288-5a22-4903-9ef8-3719d37ea699 |url-status=dead }}</ref> This adds up to at least 151.1{{nbsp}}billion MCU and SoC chips with embedded flash memory, in addition to the 45.4{{nbsp}}billion known individual flash chip sales {{as of|2015|lc=y}}, totalling at least 196.5{{nbsp}}billion chips containing flash memory.

==Flash scalability==

Due to its relatively simple structure and high demand for higher capacity, NAND&nbsp;flash memory is the most aggressively scaled technology among electronic devices. The heavy competition among the top few manufacturers only adds to the aggressiveness in shrinking the [[Engineering:Floating-gate MOSFET|floating-gate MOSFET]] design rule or process technology node.<ref name=NEA/> While the expected shrink timeline is a factor of two every three years per original version of [[Moore's law]], this has recently been accelerated in the case of NAND&nbsp;flash to a factor of two every two years. <!-- In November 2012, Samsung started production of 19&nbsp;nm NAND chips (marketed them as "10&nbsp;nm class", explained as something between 10 and 19&nbsp;nm).<ref>{{cite news |url=http://www.anandtech.com/show/7173/samsung-ssd-840-evo-review-120gb-250gb-500gb-750gb-1tb-models-tested |title=Samsung SSD 840 EVO Review: 120GB, 250GB, 500GB, 750GB & 1TB Models Tested |last=Anand |first=Lal Shimpi |date=July 25, 2013 |publisher=AnandTech |access-date=9 January 2015}} "''Samsung calls its latest NAND process 10nm-class or 1x-nm, which can refer to feature sizes anywhere from 10nm to 19nm but we've also heard it referred to as 19nm TLC.''"</ref><ref name="objectiveanalysis-firstvnand">{{Cite web |last=Handy |first=Jim |date=July 2014 |title=Samsung samples 3D NAND SSD |url=https://objective-analysis.com/uploads/2014-07-01_Objective_Analysis_Alert_-_Samsung_Samples_3D_NAND_SSD.pdf |url-status=dead |archive-url=https://web.archive.org/web/20150109085810/https://objective-analysis.com/uploads/2014-07-01_Objective_Analysis_Alert_-_Samsung_Samples_3D_NAND_SSD.pdf |archive-date=9 January 2015 |access-date=9 January 2015 |publisher=ObjectiveAnalysis |quote=..Samsung introduced its 19nm NAND by calling it a “10nm-class” product. Once again, the press misunderstood and broadcast to the world that Samsung was ahead of all of its competitors }}</ref><ref name="pcworld-20130725">{{Cite magazine |last=Jacobi |first=Jon L. |last2=Brown |first2=Michael |date=25 July 2013 |title=Samsung's 840 EVO SSD family: Fast, large, and in charge |url=http://www.pcworld.com/article/2045163/samsungs-840-evo-ssd-family-fast-large-and-in-charge.html |url-status=live |magazine=PC World |archive-url=https://web.archive.org/web/20230329063848/https://www.pcworld.com/article/453057/samsungs-840-evo-ssd-family-fast-large-and-in-charge.html |archive-date=29 March 2023 |access-date=9 January 2015 |quote=the 19nm manufacturing process used to produce the NAND. Samsung for some reason is calling this 10nm-class, or 1x NAND, but they assured us that it's 19nm. }}</ref><ref name="eetimes-20121120">{{Cite news |last=Clarke |first=Peter |date=20 November 2012 |title=Samsung takes NAND memory below 20-nm |work=EE Times |url=https://www.eetimes.com/Samsung-takes-NAND-memory-below-20-nm/ |url-status=live |access-date=21 December 2012 |archive-url=https://web.archive.org/web/20220206115823/https://www.eetimes.com/samsung-takes-nand-memory-below-20-nm/# |archive-date=6 February 2022 }}</ref> -->
{{clear}}

{| class="wikitable"
|-
! ITRS or company !! 2010 !! 2011 !! 2012 !! 2013 !! 2014 !! 2015 !! 2016 !! 2017 !! 2018
|-
| ITRS Flash Roadmap 2011<ref name=ti-roadmap2013-04>{{cite web|url=http://www.techinsights.com/uploadedFiles/Public_Website/Content_-_Primary/Marketing/2013/Nand_Flash_Roadmap/NAND-Flash-Roadmap.ppt |title=Technology Roadmap for NAND Flash Memory |date=April 2013 |publisher=techinsights |access-date=9 January 2015 |url-status=dead |archive-url=https://web.archive.org/web/20150109095122/http://www.techinsights.com/uploadedFiles/Public_Website/Content_-_Primary/Marketing/2013/Nand_Flash_Roadmap/NAND-Flash-Roadmap.ppt |archive-date=9 January 2015 }}</ref> || 32&nbsp;nm || 22&nbsp;nm || 20&nbsp;nm || 18&nbsp;nm || 16&nbsp;nm|| || || ||
|-
| Updated ITRS Flash Roadmap<ref name=ti-roadmap2014-04>{{cite web|url=http://www.techinsights.com/uploadedFiles/NAND-Flash-Roadmap-2014.ppt |title=Technology Roadmap for NAND Flash Memory |date=April 2014 |publisher=techinsights |access-date=9 January 2015 |url-status=dead |archive-url=https://web.archive.org/web/20150109095119/http://www.techinsights.com/uploadedFiles/NAND-Flash-Roadmap-2014.ppt |archive-date=9 January 2015 }}</ref> || || || || || 17&nbsp;nm || 15&nbsp;nm || 14&nbsp;nm || ||
|-
| [[Company:Samsung|Samsung]]<ref name=ti-roadmap2013-04/><ref name=ti-roadmap2014-04/><ref name=ti-roadmap-2016>{{cite web |title=NAND Flash Memory Roadmap |url=http://www.techinsights.com/techservices/TechInsights-NAND-Flash-Roadmap-2016.pdf |website=TechInsights |date=June 2016 |access-date=25 June 2018 |archive-date=25 June 2018 |archive-url=https://web.archive.org/web/20180625075602/http://www.techinsights.com/techservices/TechInsights-NAND-Flash-Roadmap-2016.pdf |url-status=dead }}</ref><br />(Samsung 3D NAND)<ref name=ti-roadmap2014-04/> || 35–20&nbsp;nm<ref name="samsung-history">{{cite web |title=History |url=https://www.samsung.com/us/aboutsamsung/company/history/ |website=[[Company:Samsung Electronics|Samsung Electronics]] |publisher=[[Company:Samsung|Samsung]] |access-date=19 June 2019}}</ref> || 27&nbsp;nm || 21&nbsp;nm <br /> ([[Multi-level cell|MLC]], TLC) || 19–16&nbsp;nm <br /> 19–[[Engineering:10 nm process|10 nm]] (MLC, TLC)<ref name="tomshardware">{{Cite news |last=Parrish |first=Kevin |date=11 April 2013 |title=Samsung Mass Producing 128Gb 3-bit MLC NAND Flash |work=[[Tom's Hardware]] |url=https://www.tomshardware.co.uk/NAND-128Gb-Mass-Production-3-bit-MLC,news-43458.html |url-status=dead |access-date=21 June 2019 |archive-url=https://web.archive.org/web/20190621175628/https://www.tomshardware.co.uk/NAND-128Gb-Mass-Production-3-bit-MLC,news-43458.html |archive-date=21 June 2019 }}</ref> || 19–10&nbsp;nm<br />V-NAND (24L) || 16–10&nbsp;nm<br />V-NAND (32L) || 16–10&nbsp;nm || 12–10&nbsp;nm || 12–10&nbsp;nm
|-
| [[Company:Micron Technology|Micron]], [[Company:Intel|Intel]]<ref name=ti-roadmap2013-04/><ref name=ti-roadmap2014-04/><ref name=ti-roadmap-2016/> || 34–25&nbsp;nm || 25&nbsp;nm || 20&nbsp;nm <br /> (MLC + HKMG) || 20&nbsp;nm <br /> (TLC) || 16&nbsp;nm || 16&nbsp;nm<br />3D NAND || 16&nbsp;nm<br />3D NAND || 12&nbsp;nm<br />3D NAND || 12&nbsp;nm<br />3D NAND
|-
| [[Company:Toshiba|Toshiba]], [[Company:Western Digital|WD]] ([[Company:SanDisk|SanDisk]])<ref name=ti-roadmap2013-04/><ref name=ti-roadmap2014-04/><ref name=ti-roadmap-2016/> || 43–32&nbsp;nm <br /> 24&nbsp;nm (Toshiba)<ref>{{cite web|url=http://www.toshiba.co.jp/about/press/2010_08/pr3101.htm?from=RSS_PRESS&uid=20100831-1112e|title=Toshiba : News Release (31 Aug, 2010): Toshiba launches 24nm process NAND flash memory|website=Toshiba.co.jp}}</ref> || 24&nbsp;nm || 19&nbsp;nm <br /> (MLC, TLC) ||  || 15&nbsp;nm || 15&nbsp;nm<br />3D NAND || 15&nbsp;nm<br />3D NAND || 12&nbsp;nm <br /> 3D&nbsp;NAND || 12&nbsp;nm <br /> 3D&nbsp;NAND
|-
| [[Company:SK Hynix|SK Hynix]]<ref name=ti-roadmap2013-04/><ref name=ti-roadmap2014-04/><ref name=ti-roadmap-2016/> || 46–35&nbsp;nm || 26&nbsp;nm || 20&nbsp;nm (MLC) ||  || 16&nbsp;nm || 16&nbsp;nm || 16&nbsp;nm || 12&nbsp;nm || 12&nbsp;nm
|}

As the [[Engineering:MOSFET|MOSFET]] feature size of flash memory cells reaches the 15–16&nbsp;nm minimum limit, further flash density increases will be driven by TLC (3&nbsp;bits/cell) combined with vertical stacking of NAND memory planes. The decrease in endurance and increase in uncorrectable bit error rates that accompany feature size shrinking can be compensated by improved error correction mechanisms.<ref name="anandtech-20101202">{{Cite news |last=Shimpi |first=Anand Lal |date=2 December 2010 |title=Micron's ClearNAND: 25nm + ECC, Combats Increasing Error Rates |work=[[AnandTech]] |url=https://www.anandtech.com/show/4043/micron-announces-clearnand-25nm-with-ecc |url-status=live |access-date=2 December 2010 |archive-url=https://web.archive.org/web/20101203082325/http://www.anandtech.com/show/4043/micron-announces-clearnand-25nm-with-ecc |archive-date=3 December 2010 }}</ref> Even with these advances, it may be impossible to economically scale flash to smaller and smaller dimensions as the number of electron holding capacity reduces. Many promising new technologies (such as [[Ferroelectric RAM|FeRAM]], MRAM, [[Programmable metallization cell|PMC]], [[Phase-change memory|PCM]], [[Resistive random-access memory|ReRAM]], and others) are under investigation and development as possible more scalable replacements for flash.<ref name="future">{{Cite conference |last1=Kim |first1=Kinam |last2=Koh |first2=Gwan-Hyeob |date=16 May 2004 |title=Future memory technology including emerging new memories |conference=24th International Conference on Microelectronics |location=Niš, Serbia |publisher=[[Organization:Institute of Electrical and Electronics Engineers|Institute of Electrical and Electronics Engineers]] |pages=377–384 |doi=10.1109/ICMEL.2004.1314646 |isbn=978-0-7803-8166-7 |s2cid=40985239 }}</ref>

===Timeline===

{| class="wikitable"
! Date of introduction !! Chip name !! Memory Package Capacity<br/>Megabits (Mb), Gigabits (Gb), Terabits (Tb) || Flash type || Cell type || Layers or<br/>Stacks of Layers || Manufacturer(s) || Process || Area || Ref
|-
| 1984 || ? || ? || NOR || SLC || 1 || Toshiba || ? || ? || <ref name="auto1"/>
|-
| 1985 || ? || 256 kb || NOR || SLC || 1 || Toshiba || 2,000&nbsp;nm || ? || <ref name="stol">{{Cite web |title=Memory |url=http://maltiel-consulting.com/Semiconductor_technology_memory.html |url-status=live |archive-url=https://web.archive.org/web/20231102131915/http://maltiel-consulting.com/Semiconductor_technology_memory.html |archive-date=2 November 2023 |access-date=25 June 2019 |website=STOL (Semiconductor Technology Online) }}</ref>
|-
| 1987 || ? || ? || NAND || SLC || 1 || Toshiba || ? || ? || <ref name=":0"/>
|-
| 1989 || ? || 1 Mb || NOR || SLC || 1 || Seeq, Intel || ? || ? || <ref name="stol"/>
|-
|  ||  || 4 Mb || NAND || SLC || 1 || Toshiba || 1,000&nbsp;nm ||  || 
|-
| 1991 || ? || 16 Mb || NOR || SLC || 1 || Mitsubishi || 600&nbsp;nm || ? || <ref name="stol"/>
|-
| 1993 || DD28F032SA || 32 Mb || NOR || SLC || 1 || Intel || ? || 280&nbsp;mm² || <ref name="Intel-Product-Timeline">{{Cite web |date=July 2005 |title=A chronological list of Intel products. The products are sorted by date. |url=http://download.intel.com/museum/research/arc_collect/timeline/TimelineDateSort7_05.pdf |url-status=dead |archive-url=https://web.archive.org/web/20070809053720/http://download.intel.com/museum/research/arc_collect/timeline/TimelineDateSort7_05.pdf |archive-date=9 August 2007 |access-date=31 July 2007 |publisher=[[Company:Intel|Intel]] |work=Intel museum }}</ref><ref name="dd28f032sa-datasheet">{{Cite web |title=DD28F032SA Datasheet |url=https://pdf.datasheetcatalog.com/datasheet/Intel/mXyzzuqw.pdf |url-status=live |archive-url=https://web.archive.org/web/20231204175055/https://pdf.datasheetcatalog.com/datasheet/Intel/mXyzzuqw.pdf |archive-date=4 December 2023 |access-date=27 June 2019 |publisher=[[Company:Intel|Intel]] }}</ref>
|-
| 1994 || ? || 64 Mb || NOR || SLC || 1 || NEC || 400&nbsp;nm || ? || <ref name="stol"/>
|-
| 1995 || ? || 16 Mb || DINOR || SLC || 1 || Mitsubishi, Hitachi || ? || ? || |<ref name="stol"/><ref name="smithsonian-japan">{{Cite web |year=1996 |title=Japanese Company Profiles |url=http://smithsonianchips.si.edu/ice/cd/PROF96/JAPAN.PDF |url-status=dead |archive-url=https://web.archive.org/web/20230419065056/http://smithsonianchips.si.edu/ice/cd/PROF96/JAPAN.PDF |archive-date=19 April 2023 |access-date=27 June 2019 |publisher=Integrated Circuit Engineering Corporation |via=Smithsonian Institution }}</ref>
|-
|  ||  ||  || NAND || SLC || 1 || Toshiba || ? || ? || <ref name="toshiba-19950302">{{Cite press release |date=2 March 1995 |title=Toshiba to Introduce Flash Memory Cards |url=https://www.global.toshiba/ww/news/corporate/1995/03/pr0201.html |url-status=live |archive-url=https://web.archive.org/web/20231106084148/https://www.global.toshiba/ww/news/corporate/1995/03/pr0201.html |archive-date=6 November 2023 |access-date=20 June 2019 |publisher=[[Company:Toshiba|Toshiba]] |id=PR0201 |location=Tokyo }}</ref>
|-
|  ||  || 32 Mb || NAND || SLC || 1 || Hitachi, Samsung, Toshiba || ? || ? || <ref name="stol"/>
|-
|  ||  || 34 Mb || Serial || SLC || 1 || SanDisk ||  ||  || 
|-
| 1996 || ? || 64 Mb || NAND || SLC || 1 || Hitachi, Mitsubishi || 400&nbsp;nm || ? || <ref name="stol"/>
|-
|  ||  ||  ||  || QLC || 1 || NEC ||  ||  || 
|-
|  ||  || 128 Mb || NAND || SLC || 1 || Samsung, Hitachi || ? ||  || 
|-
| 1997 || ? || 32 Mb || NOR || SLC || 1 || Intel, Sharp || 400&nbsp;nm || ? || <ref name="worldwideicmanuf">{{Cite web |year=1997 |title=Worldwide IC Manufacturers |url=http://smithsonianchips.si.edu/ice/cd/STATUS98/SEC02.PDF |url-status=dead |archive-url=https://web.archive.org/web/20230814162607/http://smithsonianchips.si.edu/ice/cd/STATUS98/SEC02.PDF |archive-date=14 August 2023 |access-date=10 July 2019 |publisher=Integrated Circuit Engineering Corporation |via=Smithsonian Institution }}</ref>
|-
|  ||  ||  || NAND || SLC || 1 || AMD, Fujitsu || 350&nbsp;nm ||  || 
|-
| 1999 || ? || 256 Mb || NAND || SLC || 1 || Toshiba || 250&nbsp;nm || ? || <ref name="stol"/>
|-
|  ||  ||  ||  || MLC || 1 || Hitachi || 1 ||  || 
|-
| 2000 || ? || 32 Mb || NOR || SLC || 1 || Toshiba || 250&nbsp;nm || ? || <ref name="stol"/>
|-
|  ||  || 64 Mb || NOR || QLC || 1 || STMicroelectronics || 180&nbsp;nm ||  || 
|-
|  ||  || 512 Mb || NAND || SLC || 1 || Toshiba || ? || ? || <ref name="toshiba-20020909b">{{Cite press release |date=9 September 2002 |title=Toshiba announces 0.13 micron 1Gb monolithic NAND featuring large block size for improved write/erase speed performance |url=http://www.toshiba.com/taec/news/press_releases/2002/to-230.jsp |url-status=dead |archive-url=https://web.archive.org/web/20060311224004/http://www.toshiba.com/taec/news/press_releases/2002/to-230.jsp |archive-date=11 March 2006 |access-date=11 March 2006 |publisher=[[Company:Toshiba|Toshiba]] }}</ref>
|-
| 2001 || ? || 512 Mb || NAND || MLC || 1 || Hitachi || ? || ? || <ref name="stol"/>
|-
|  ||  || 1 Gibit || NAND || MLC || 1 || Samsung ||  ||  || 
|-
|  ||  ||  ||  ||  || 1 || Toshiba, SanDisk || 160&nbsp;nm || ? || <ref name="toshiba-20011112">{{Cite press release |date=12 November 2001 |title=Toshiba and SanDisk introduce a one gigabit NAND flash memory chip, doubling capacity of future flash products |url=https://www.global.toshiba/ww/news/corporate/2001/11/pr1202.html |url-status=live |archive-url=https://web.archive.org/web/20230419132953/https://www.global.toshiba/ww/news/corporate/2001/11/pr1202.html |archive-date=19 April 2023 |access-date=20 June 2019 |publisher=[[Company:Toshiba|Toshiba]] |id=pr1202 |location=Las Vegas, Nv. and Tokyo, Japan }}</ref>
|-
| 2002 || ? || 512 Mb || NROM || MLC || 1 || Saifun || 170&nbsp;nm || ? || <ref name="stol"/>
|-
|  ||  || 2 Gb || NAND || SLC || 1 || Samsung, Toshiba || ? || ? || <ref name="samsung2000s">{{Cite web |title=History: Continuing the legacy 2000-2009 |url=https://semiconductor.samsung.com/about-us/history/ |url-status=live |archive-url=https://web.archive.org/web/20231201063417/https://semiconductor.samsung.com/about-us/history/ |archive-date=1 December 2023 |access-date=25 June 2019 |website=Samsung Semiconductor |publisher=[[Company:Samsung|Samsung]] }}</ref><ref name="toshiba-20020909">{{Cite press release |date=9 September 2002 |title=Toshiba announces 1 gigabyte CompactFlash™ card |url=http://www.toshiba.com/taec/news/press_releases/2002/to-231.jsp |url-status=dead |archive-url=https://web.archive.org/web/20060311212118/http://www.toshiba.com/taec/news/press_releases/2002/to-231.jsp |archive-date=11 March 2006 |access-date=11 March 2006 |publisher=[[Company:Toshiba|Toshiba]] }}</ref>
|-
| 2003 || ? || 128 Mb || NOR || MLC || 1 || Intel || 130&nbsp;nm || ? || <ref name="stol"/>
|-
|  ||  || 1 Gb || NAND || MLC || 1 || Hitachi ||  ||  || 
|-
| 2004 || ? || 8 Gb || NAND || SLC || 1 || Samsung || 60&nbsp;nm || ? || <ref name="samsung2000s"/>
|-
| 2005 || ? || 16 Gb || NAND || SLC || 1 || Samsung || 50&nbsp;nm || ? || <ref name="samsung-history"/>
|-
| 2006 || ? || 32 Gb || NAND || SLC || 1 || Samsung || 40&nbsp;nm ||  || 
|-
| Apr-07 || THGAM || 128 Gb || Stacked NAND || SLC ||  || Toshiba || 56&nbsp;nm || 252&nbsp;mm² || <ref name="toshiba2007">{{Cite press release |date=17 April 2007 |title=Toshiba commercializes Industry's Highest Capacity Embedded NAND Flash Memory for Mobile Consumer Products |url=https://www.global.toshiba/ww/news/corporate/2007/04/pr1702.html |url-status=live |archive-url=https://web.archive.org/web/20220518042936/https://www.global.toshiba/ww/news/corporate/2007/04/pr1702.html |archive-date=18 May 2022 |access-date=23 November 2010 |publisher=[[Company:Toshiba|Toshiba]] |id=PR1702 }}</ref>
|-
| Sep-07 || ? || 128 Gb || Stacked NAND || SLC ||  || Hynix || ? || ? || <ref name="hynix2007">{{Cite news |date=5 September 2007 |title=Hynix Surprises NAND Chip Industry |work=The Korea Times |url=https://www.koreatimes.co.kr/www/news/biz/2007/09/123_9628.html |url-status=live |access-date=8 July 2019 |archive-url=https://web.archive.org/web/20231121145653/http://www.koreatimes.co.kr/www/news/biz/2007/09/123_9628.html |archive-date=21 November 2023 }}</ref>
|-
| 2008 || THGBM || 256 Gb || Stacked NAND || SLC ||  || Toshiba || 43&nbsp;nm || 353&nbsp;mm² || <ref name="toshiba2008">{{Cite press release |date=7 August 2008 |title=Toshiba Launches the Largest Density Embedded NAND Flash Memory Devices |url=https://www.global.toshiba/ww/news/corporate/2008/08/pr0701.html |url-status=live |archive-url=https://web.archive.org/web/20231107222127/https://www.global.toshiba/ww/news/corporate/2008/08/pr0701.html |archive-date=7 November 2023 |access-date=21 June 2019 |publisher=[[Company:Toshiba|Toshiba]] |id=PR0701 }}</ref>
|-
| 2009 || ? || 32 Gb || NAND || TLC ||  || Toshiba || 32&nbsp;nm || 113&nbsp;mm² || <ref name="toshiba2009">{{Cite press release |date=11 February 2009 |title=Toshiba Makes Major Advances in NAND Flash Memory with 3-bit-per-cell 32nm generation and with 4-bit-per-cell 43nm technology |url=http://www.toshiba.co.jp/about/press/2009_02/pr1102.htm |url-status=live |archive-url=https://web.archive.org/web/20230419145952/https://www.global.toshiba/ww/news/corporate/2009/02/pr1102.html |archive-date=19 April 2023 |access-date=21 June 2019 |publisher=[[Company:Toshiba|Toshiba]] |id=PR1102 }}</ref>
|-
|  ||  || 64 Gb || NAND || QLC ||  || Toshiba, SanDisk || 43&nbsp;nm || ? || <ref name="toshiba2009"/><ref name="toshiba-sd-2009">{{Cite news |date=13 October 2009 |title=SanDisk ships world's first memory cards with 64 gigabit X4 NAND flash |work=SlashGear |url=https://www.slashgear.com/sandisk-ships-worlds-first-memory-cards-with-64-gigabit-x4-nand-flash-1360217 |url-status=live |access-date=20 June 2019 |archive-url=https://web.archive.org/web/20230418183511/https://www.slashgear.com/sandisk-ships-worlds-first-memory-cards-with-64-gigabit-x4-nand-flash-1360217/ |archive-date=18 April 2023 }}</ref>
|-
| 2010 || ? || 64 Gb || NAND || SLC ||  || Hynix || 20&nbsp;nm || ? || <ref name="hynix2010s">{{cite web |title=History: 2010s |url=https://www.skhynix.com/eng/about/history2010.jsp |website=[[Company:SK Hynix|SK Hynix]] |access-date=8 July 2019 |archive-date=17 May 2021 |archive-url=https://web.archive.org/web/20210517040328/https://www.skhynix.com/eng/about/history2010.jsp |url-status=dead }}</ref>
|-
|  ||  ||  ||  || TLC ||  || Samsung || 20&nbsp;nm || ? || <ref name="samsung-history"/>
|-
|  || THGBM2 || 1 Tb || Stacked NAND || QLC ||  || Toshiba || 32&nbsp;nm || 374&nbsp;mm² || <ref name="toshiba2010">{{Cite press release |date=17 June 2010 |title=Toshiba Launches Industry's Largest Embedded NAND Flash Memory Modules |url=https://www.global.toshiba/ww/news/corporate/2010/06/pr1701.html |url-status=live |archive-url=https://web.archive.org/web/20231106085036/https://www.global.toshiba/ww/news/corporate/2010/06/pr1701.html |archive-date=6 November 2023 |access-date=21 June 2019 |publisher=[[Company:Toshiba|Toshiba]] |id=PR1701 }}</ref>
|-
| 2011 || KLMCG8GE4A || 512 Gb || Stacked NAND || MLC ||  || Samsung || ? || 192&nbsp;mm² || <ref name="samsung-emmc441">{{Cite web |date=December 2011 |title=e.MMC 4.41 Specification compatibility Rev 1.1 |url=https://z3d9b7u8.stackpathcdn.com/pdf-down/K/L/M/KLMAG2GE4A-A001-Samsung.pdf |url-status=live |archive-url=https://web.archive.org/web/20231204170418/https://z3d9b7u8.stackpathcdn.com/pdf-down/K/L/M/KLMAG2GE4A-A001-Samsung.pdf |archive-date=4 December 2023 |access-date=15 July 2019 |publisher=[[Company:Samsung Electronics|Samsung Electronics]] }}</ref>
|-
| 2013 || ? || ? || NAND || SLC ||  || SK Hynix || 16&nbsp;nm || ? || <ref name="hynix2010s"/>
|-
|  ||  || 128 Gb || V-NAND || TLC ||  || Samsung || 10&nbsp;nm || ? || 
|-
| 2015 || ? || 256 Gb || V-NAND || TLC ||  || Samsung || ? || ? || <ref name="tomshardware"/>
|-
| 2017 || eUFS 2.1 || 512 Gb || V-NAND || TLC || 8 of 64 || Samsung || ? || ? || <ref name="anandtech-20171205" />
|-
|  ||  || 768 Gb || V-NAND || QLC ||  || Toshiba || ? || ? || <ref name="toshiba-20170628">{{Cite press release |date=28 June 2017 |title=Toshiba Develops World's First 4-bit Per Cell QLC NAND Flash Memory |url=https://www.techpowerup.com/234729/toshiba-develops-worlds-first-4-bit-per-cell-qlc-nand-flash-memory |url-status=live |archive-url=https://web.archive.org/web/20231102131301/https://www.techpowerup.com/234729/toshiba-develops-worlds-first-4-bit-per-cell-qlc-nand-flash-memory |archive-date=2 November 2023 |access-date=20 June 2019 |publisher=[[Company:Toshiba|Toshiba]] |via=TechPowerUp }}</ref>
|-
|  || KLUFG8R1EM || 4 Tb || Stacked V-NAND || TLC ||  || Samsung || ? || 150&nbsp;mm² || <ref name="anandtech-20171205" />
|-
| 2018 || ? || 1 Tb || V-NAND || QLC ||  || Samsung || ? || ? || <ref name="anandtech-20180806">{{Cite news |last=Shilov |first=Anton |date=6 August 2018 |title=Samsung Starts Mass Production of QLC V-NAND-Based SSDs |work=[[AnandTech]] |url=https://www.anandtech.com/show/13170/samsung-starts-mass-production-of-qlc-vnandbased-ssds |url-status=live |access-date=23 June 2019 |archive-url=https://web.archive.org/web/20231102133017/https://www.anandtech.com/show/13170/samsung-starts-mass-production-of-qlc-vnandbased-ssds |archive-date=2 November 2023 }}</ref>
|-
|  ||  || 1.33 Tb || V-NAND || QLC ||  || Toshiba || ? || 158&nbsp;mm² || <ref name="engadget-20180720">{{Cite news |last=Dent |first=Steve |date=20 July 2018 |title=Toshiba's flash chips could boost SSD capacity by 500 percent |work=[[Software:Engadget|Engadget]] |url=https://www.engadget.com/2018/07/20/toshiba-flash-166-gb-per-chip/ |url-status=live |access-date=23 June 2019 |archive-url=https://web.archive.org/web/20231106203450/https://www.engadget.com/2018-07-20-toshiba-flash-166-gb-per-chip.html |archive-date=6 November 2023 }}</ref><ref name="eetimes-20190220">{{Cite news |last=McGrath |first=Dylan |date=20 February 2019 |title=Toshiba Claims Highest-Capacity NAND |work=EE Times |location=San Francisco |url=https://www.eetimes.com/document.asp?doc_id=1334344 |url-status=live |access-date=23 June 2019 |archive-url=https://web.archive.org/web/20230423012213/https://www.eetimes.com/toshiba-claims-highest-capacity-nand/ |archive-date=23 April 2023 }}</ref>
|-
| 2019 || ? || 512 Gb || V-NAND || QLC ||  || Samsung || ? || ? || <ref name="electronicsweekly-samsung">{{Cite news |last=Manners |first=David |date=30 January 2019 |title=Samsung makes 1TB flash eUFS module |work=Electronics Weekly |url=https://www.electronicsweekly.com/news/business/samsung-makes-1tb-flash-module-2019-01/ |url-status=live |access-date=23 June 2019 |archive-url=https://web.archive.org/web/20230210114056/https://www.electronicsweekly.com/news/business/samsung-makes-1tb-flash-module-2019-01/ |archive-date=10 February 2023 }}</ref><ref name="anandtech-samsung-2018">{{Cite news |last=Tallis |first=Billy |date=17 October 2018 |title=Samsung Shares SSD Roadmap for QLC NAND And 96-layer 3D NAND |work=[[AnandTech]] |url=https://www.anandtech.com/show/13497/samsung-shares-ssd-roadmap-for-qlc-nand-and-96layer-3d-nand |url-status=live |access-date=27 June 2019 |archive-url=https://web.archive.org/web/20231106103853/https://www.anandtech.com/show/13497/samsung-shares-ssd-roadmap-for-qlc-nand-and-96layer-3d-nand |archive-date=6 November 2023 }}</ref>
|-
|  ||  || 1 Tb || V-NAND || TLC ||  || SK Hynix || ? || ? || <ref name="anandtech-20190626">{{Cite news |last=Shilov |first=Anton |date=26 June 2019 |title=SK Hynix Starts Production of 128-Layer 4D NAND, 176-Layer Being Developed |work=[[AnandTech]] |url=https://www.anandtech.com/show/14589/sk-hynix-128-layer-4d-nand |url-status=live |access-date=8 July 2019 |archive-url=https://web.archive.org/web/20230622221123/https://www.anandtech.com/show/14589/sk-hynix-128-layer-4d-nand |archive-date=22 June 2023 }}</ref>
|-
|  || eUFS 2.1 || 1 Tb || Stacked V-NAND<ref name="zdnet-20190129">{{Cite news |last=Mu-Hyun |first=Cho |title=Samsung produces 1TB eUFS memory for smartphones |work=[[ZDNet]] |url=https://www.zdnet.com/article/samsung-produces-1tb-eufs-memory-for-smartphones/ |url-status=live |archive-url=https://web.archive.org/web/20231102133634/https://www.zdnet.com/article/samsung-produces-1tb-eufs-memory-for-smartphones/ |archive-date=2 November 2023 }}</ref> || QLC || 16 of 64 || Samsung || ? || 150&nbsp;mm² || <ref name="electronicsweekly-samsung" /><ref name="anandtech-samsung-2018" /><ref name="samsung-20190130">{{Cite press release |date=30 January 2019 |title=Samsung Breaks Terabyte Threshold for Smartphone Storage with Industry's First 1TB Embedded Universal Flash Storage |url=https://news.samsung.com/global/samsung-breaks-terabyte-threshold-for-smartphone-storage-with-industrys-first-1tb-embedded-universal-flash-storage |url-status=live |archive-url=https://web.archive.org/web/20231130040907/https://news.samsung.com/global/samsung-breaks-terabyte-threshold-for-smartphone-storage-with-industrys-first-1tb-embedded-universal-flash-storage |archive-date=30 November 2023 |access-date=13 July 2019 |publisher=[[Company:Samsung|Samsung]] }}</ref>
|-
| 2023 || eUFS 4.0 || 8 Tb || 3D NAND || QLC || 232 || Micron || ? || ? || <ref name="ufs4-infographic">{{Cite web |year=2023 |title=UFS 4.0 Infographic |url=https://media-www.micron.com/-/media/client/global/images/in_line-images/products/managed-nand/ufs-4_0/ufs-4-infographic.pdf |url-status=live |archive-url=https://web.archive.org/web/20231029022836/https://media-www.micron.com/-/media/client/global/images/in_line-images/products/managed-nand/ufs-4_0/ufs-4-infographic.pdf |archive-date=29 October 2023 |publisher=Micron }}</ref>
|}

==See also==
* eMMC
* [[NOR flash replacement]]
* Intel hex file format
* [[Flash memory controller]]
* List of flash file systems
* [[Engineering:List of flash memory controller manufacturers|List of flash memory controller manufacturers]]
* [[Engineering:MicroSDXC|microSDXC]] (up to 2&nbsp;[[Terabyte|TB]]), and the successor format Secure Digital Ultra Capacity (SDUC) supporting cards up to 128&nbsp;[[Tebibyte|TiB]]
* [[Organization:Open NAND Flash Interface Working Group|Open NAND Flash Interface Working Group]]
* [[Read-mostly memory]] (RMM)
* [[Engineering:Universal Flash Storage|Universal Flash Storage]]
* [[Engineering:USB flash drive security|USB flash drive security]]
* [[Engineering:Write amplification|Write amplification]]

==Notes==
{{Notelist|30em}}

==References==
{{reflist|colwidth=30em}}

==External links==
* [http://news.thomasnet.com/fullstory/547012 Semiconductor Characterization System has diverse functions] {{Webarchive|url=https://web.archive.org/web/20181022073504/https://news.thomasnet.com/fullstory/547012 |date=22 October 2018 }}
* [http://www.eetimes.com/design/memory-design/4211387/Understanding-and-selecting-higher-performance-NAND-architectures?Ecosystem=memory-design Understanding and selecting higher performance NAND architectures] {{Webarchive|url=https://web.archive.org/web/20121031081837/http://www.eetimes.com/design/memory-design/4211387/Understanding-and-selecting-higher-performance-NAND-architectures?Ecosystem=memory-design |date=31 October 2012 }}
* [http://www.slideshare.net/ennael/dwmw2-kr201209 How flash storage works, presentation by David Woodhouse from Intel]
* [http://hypnocube.com/2014/11/flash-endurance-testing/ Flash endurance testing]
* [http://adreca.net/NAND-Flash-Data-Recovery-Cookbook.pdf NAND Flash Data Recovery Cookbook]
* [https://openwrt.org/docs/techref/flash.layout#types_of_flash_memory Type of Flash Memory] by [[Software:OpenWrt|OpenWrt]]

{{Solid-state drive|state=collapsed}}

[[Category:Computer memory]]
[[Category:Non-volatile memory]]
[[Category:Solid-state computer storage media]]

{{Sourceattribution|Flash memory}}