| Display title | Engineering:Back end of line |
| Default sort key | Back end of line |
| Page length (in bytes) | 3,912 |
| Namespace ID | 3034 |
| Namespace | Engineering |
| Page ID | 18136 |
| Page content language | en - English |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of redirects to this page | 0 |
| Counted as a content page | Yes |
| Page image |  |
| HandWiki item ID | None |
| Edit | Allow all users (infinite) |
| Move | Allow all users (infinite) |
| Page creator | imported>Dennis Ross |
| Date of page creation | 11:00, 25 June 2023 |
| Latest editor | imported>Dennis Ross |
| Date of latest edit | 11:00, 25 June 2023 |
| Total number of edits | 1 |
| Recent number of edits (within past 90 days) | 0 |
| Recent number of distinct authors | 0 |
Description | Content |
Article description: (description) This attribute controls the content of the description and og:description elements. | The back end of line (BEOL) is the second portion of IC fabrication where the individual devices (transistors, capacitors, resistors, etc.) get interconnected with wiring on the wafer, the metalization layer. Common metals are copper and aluminum.
BEOL generally begins when the first layer of metal... |