File:Ultrasonic wedge bonding.webm
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Ultrasonic_wedge_bonding.webm (file size: 7.03 MB, MIME type: video/webm)
Summary
| Description |
English: Demonstration of ultrasonic wedge bonding of an aluminium wire between gold electrodes on a PCB board and gold electrodes on a sapphire substrate, reverse bonding order, at the NanoFabLab at AlbaNova University Center/Stockholm University. Deitsch: Ultraschall-Wedge-Wedge-Bonden eines Aluminium-Drahts zwischen Gold-Kontakten einer Leiterplatte und auf einem Saphir-Substrat. NanoFabLab am AlbaNova Universitätszentrum/Stockholms Universität. |
| Date | |
| Source | Own work |
| Author | Holger Motzkau |
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This file was selected as the media of the day for 04 July 2013. It was captioned as follows:
English: Demonstration of ultrasonic wedge bonding of an aluminium wire between gold electrodes on a PCB board and gold electrodes on a sapphire substrate, reverse bonding order, at the NanoFabLab at AlbaNova University Center/Stockholm University.
Other languages
English: Demonstration of ultrasonic wedge bonding of an aluminium wire between gold electrodes on a PCB board and gold electrodes on a sapphire substrate, reverse bonding order, at the NanoFabLab at AlbaNova University Center/Stockholm University. 中文（简体）：引线接合
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| Date/Time | Dimensions | User | Comment | |
|---|---|---|---|---|
| current | 01:46, 3 July 2013 | (7.03 MB) | imagescommonswiki>Prolineserver | User created page with UploadWizard |
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