Physics:Cryogenic processor

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Short description: A unit for cooling to ultra-low temperatures


A Cryogenic processor is a unit designed to cool an object to ultra-low temperatures (usually around −300°F / −150°C) at a moderated rate in order to prevent thermal shock to the components being treated. The first commercial unit was developed by Ed Busch in the late 1960s.[1] The development of programmable[2] microprocessor controls allowed machines to follow temperature profiles that increased the effectiveness of the process. Some manufacturers make cryogenic processors with home computers to define the temperature profile.

Before programmable controls were added to control cryogenic processors, the treatment process of an object was done manually by immersing the object in liquid nitrogen.[1] This typically caused thermal shock to occur within an object, resulting in cracks in the structure. Modern cryogenic processors measure changes in temperature and adjust the input of liquid nitrogen to ensure that only fractional changes in temperature occur over a specific period of time. Their temperature measurements and adjustments are condensed into profiles that are used to repeat the process when treating for similarly grouped objects.

The general processing cycle for modern cryogenic processors occurs within a three-day time window, which includes 24 hours to reach the optimal minimum temperature for the product, 24 hours to hold the product at the minimum temperature, and 24 hours to return the product to room temperature. Depending on the item, some products require heating in an oven at higher temperatures. While some processors can provide both the negative and positive extreme temperatures, separate units, such as a cryogenic processor and a dedicated oven, can sometimes produce better results depending on the application.

The optimal minimum temperatures for objects, as well as the hold times involved, are determined by utilizing different research methods and are backed by analysis of the product to determine the optimum procedure for a particular product. As new metals are used in different combinations for newer products on the market, processing profiles may change accordingly to accommodate them. Furthermore, thermal profiles may undergo change based on the results of case studies produced by a manufacturer or client of cryogenic services. When a cryogenic processor is manufactured, the thermal profiles for the year of manufacture will be included. However, profiles from when the processor model was first engineered may be outdated. Outdated profiles may be included with a processor when the manufacturer does not have adequate funding to perform the necessary ongoing research.

To find thermal profiles for cryogenics, a number of companies maintain thermal profiles of various products that are updated for accuracy at regular intervals according to ongoing research, including data from independent trials and studies[citation needed]. Obtaining these profiles can be problematic if they are not used for educational purposes (mainly institutional research), as they typically only provide the updated profiles to their longtime service center partners.

Cryogenic processors have been said to have changed the field of cryogenics. Previously, cryogenics was largely theoretical, with inconsistent results from incremental improvements. Ongoing research aims to increase the accuracy of temperature treatment profiles, as well as the efficiency of hardware and associated control systems.

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