Engineering:Wedge bonding: Difference between revisions

Latest revision as of 16:16, 7 February 2024

Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is commonly used in the semiconductor industry.

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Original source: https://en.wikipedia.org/wiki/Wedge bonding. Read more

v t e Wafer bonding techniques used in ICs, MEMS, and NEMS
Substrate bonding	Direct bonding Plasma-activated bonding Anodic bonding Eutectic bonding Glass frit bonding Adhesive bonding Thermocompression bonding Transient liquid phase diffusion bonding Surface activated bonding
Connections	Compliant bonding Wire bonding Ball bonding Thermosonic bonding Tape-automated bonding (TAB)
See also	Wafer bond characterization

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