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{{Short description|Series of microprocessors}}
{{Infobox CPU
{{Infobox CPU
| name          = ELVEES Multicore
| name          = ELVEES Multicore
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| numcores      = 0–8 processors + 0–16 DSP
| numcores      = 0–8 processors + 0–16 DSP
}}
}}
'''Multicore''' ({{lang-ru|МУЛЬТИКОР|italic=yes}}) is a series of 32-bit [[Engineering:Microprocessor|microprocessor]]s with embedded [[Engineering:Digital signal processor|DSP]] cores developed by ELVEES, Russia.<ref name=solokhina/> The microprocessor is a MIPS32 core (called RISCore32 by ELVEES; optionally with an [[Floating-point unit|FPU]]) or an ARM Cortex-A9 core. Some of the processors in the series are [[Engineering:Radiation hardening|radiation hardened]] (rad-hard) for space applications.
'''Multicore''' ({{langx|ru|МУЛЬТИКОР|italic=yes}}) is a series of 32-bit [[Engineering:Microprocessor|microprocessor]]s with embedded [[Engineering:Digital signal processor|DSP]] cores developed by ELVEES, Russia.<ref name=solokhina/> The microprocessor is a MIPS32 core (called RISCore32 by ELVEES; optionally with an [[Floating-point unit|FPU]]) or an ARM Cortex-A9 core. Some of the processors in the series are [[Engineering:Radiation hardening|radiation hardened]] (rad-hard) for space applications.




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==Details==
==Details==
===1892VM1Ya===
===1892VM1Ya===
*{{lang-ru|1892ВМ1Я|italic=yes}}
*{{langx|ru|1892ВМ1Я|italic=yes}}
*CMOS process
*CMOS process
*[[Engineering:Ball grid array|HSBGA292]] package
*[[Engineering:Ball grid array|HSBGA292]] package


===1892VM2Ya===
===1892VM2Ya===
*{{lang-ru|1892ВМ2Я|italic=yes}} (MC-24)
*{{langx|ru|1892ВМ2Я|italic=yes}} (MC-24)
*2 cores: RISCore32 + ELcore-24 (DSP-core with [[Single instruction, multiple data|SIMD]] architecture)
*2 cores: RISCore32 + ELcore-24 (DSP-core with [[Single instruction, multiple data|SIMD]] architecture)
*manufactured in a 250nm CMOS process
*manufactured in a 250&nbsp;nm CMOS process
*18 million transistors
*18 million transistors
*[[Engineering:Ball grid array|HSBGA292]] package
*[[Engineering:Ball grid array|HSBGA292]] package


===1892VM3T===
===1892VM3T===
*{{lang-ru|1892ВМ3Т|italic=yes}} (MC-12)
*{{langx|ru|1892ВМ3Т|italic=yes}} (MC-12)
*2 cores: RISCore32 + ELcore-14 (DSP-core with [[Single instruction, single data|SISD]] architecture)
*2 cores: RISCore32 + ELcore-14 (DSP-core with [[Single instruction, single data|SISD]] architecture)
*manufactured in a 250nm CMOS process
*manufactured in a 250&nbsp;nm CMOS process
*18 million transistors
*18 million transistors
*[[Engineering:Quad Flat Package|PQFP240]] package
*[[Engineering:Quad Flat Package|PQFP240]] package


===1892VM4Ya===
===1892VM4Ya===
*{{lang-ru|1892ВМ4Я|italic=yes}} (MC-0226G, ''МЦОС'')
*{{langx|ru|1892ВМ4Я|italic=yes}} (MC-0226G, ''МЦОС'')
*3 cores: RISCore32 + 2x ELcore-26 (DSP-core with [[Multiple instruction, multiple data|MIMD]] architecture)
*3 cores: RISCore32 + 2x ELcore-26 (DSP-core with [[Multiple instruction, multiple data|MIMD]] architecture)
*manufactured in a [[Physics:Foundry model|foundry]] outside Russia in a 250nm CMOS process
*manufactured in a [[Physics:Foundry model|foundry]] outside Russia in a 250&nbsp;nm CMOS process
*26 million transistors
*26 million transistors
*[[Engineering:Ball grid array|HSBGA416]] package
*[[Engineering:Ball grid array|HSBGA416]] package
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===1892VM5Ya===
===1892VM5Ya===
*{{lang-ru|1892ВМ5Я|italic=yes}} (МС-0226, ''ЦПОС-02'')
*{{langx|ru|1892ВМ5Я|italic=yes}} (МС-0226, ''ЦПОС-02'')
*3 cores: RISCore32 + 2x ELcore-26 (DSP-core with [[Multiple instruction, multiple data|MIMD]] architecture)
*3 cores: RISCore32 + 2x ELcore-26 (DSP-core with [[Multiple instruction, multiple data|MIMD]] architecture)
*manufactured in a [[Physics:Foundry model|foundry]] outside Russia in a 250nm CMOS process
*manufactured in a [[Physics:Foundry model|foundry]] outside Russia in a 250&nbsp;nm CMOS process
*26 million transistors
*26 million transistors
*[[Engineering:Ball grid array|HSBGA416]] package
*[[Engineering:Ball grid array|HSBGA416]] package
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===1892VM7Ya===
===1892VM7Ya===
*{{lang-ru|1892ВМ7Я|italic=yes}} (МС-0428)
*{{langx|ru|1892ВМ7Я|italic=yes}} (МС-0428)
*130nm CMOS process, 81 million transistors
*130&nbsp;nm CMOS process, 81 million transistors
*[[Engineering:Ball grid array|HSBGA765]] package
*[[Engineering:Ball grid array|HSBGA765]] package
*includes 2 [[Engineering:SpaceWire|SpaceWire]] ports
*includes 2 [[Engineering:SpaceWire|SpaceWire]] ports


===1892VM8Ya===
===1892VM8Ya===
*{{lang-ru|1892ВМ8Я|italic=yes}} (MC-24R)
*{{langx|ru|1892ВМ8Я|italic=yes}} (MC-24R)
*manufactured by [[Company:X-Fab|X-Fab]] Malaysia in a 250nm CMOS process and later by [[Company:TSMC|TSMC]] in a 40nm CMOS process (with the clock speed increased to 100 MHz)
*manufactured by [[Company:X-Fab|X-Fab]] Malaysia in a 250&nbsp;nm CMOS process and later by [[Company:TSMC|TSMC]] in a 40&nbsp;nm CMOS process (with the clock speed increased to 100&nbsp;MHz)
*[[Engineering:Ball grid array|HSBGA416]] package
*[[Engineering:Ball grid array|HSBGA416]] package
*includes 2 [[Engineering:SpaceWire|SpaceWire]] ports; supports [[ECC memory]]
*includes 2 [[Engineering:SpaceWire|SpaceWire]] ports; supports [[ECC memory]]


===1892VM10Ya===
===1892VM10Ya===
*{{lang-ru|1892ВМ10Я|italic=yes}} (NVCom-02T)
*{{langx|ru|1892ВМ10Я|italic=yes}} (NVCom-02T)
*manufactured in a foundry outside Russia in a 130nm CMOS process
*manufactured in a foundry outside Russia in a 130&nbsp;nm CMOS process
*does not contain any [[Engineering:Semiconductor intellectual property core|IP blocks]] from outside Russia<ref name=multicore180123/>
*does not contain any [[Engineering:Semiconductor intellectual property core|IP blocks]] from outside Russia<ref name=multicore180123/>
*50 million transistors
*50 million transistors
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===1892VM11Ya===
===1892VM11Ya===
*{{lang-ru|1892ВМ11Я|italic=yes}} (NVCom-02)
*{{langx|ru|1892ВМ11Я|italic=yes}} (NVCom-02)
*manufactured by Angstrem in a 65nm CMOS process
*manufactured by Angstrem in a 65&nbsp;nm CMOS process
*[[Engineering:Ball grid array|BGA586]] package
*[[Engineering:Ball grid array|BGA586]] package
*includes 24-channel correlator for [[Engineering:GPS|GPS]] and [[Astronomy:GLONASS|GLONASS]] signals
*includes 24-channel correlator for [[Engineering:GPS|GPS]] and [[Astronomy:GLONASS|GLONASS]] signals


===1892VM12AT===
===1892VM12AT===
*{{lang-ru|1892ВМ12АТ|italic=yes}} (MCT-03P)
*{{langx|ru|1892ВМ12АТ|italic=yes}} (MCT-03P)
*manufactured in Zelenograd in a 180nm CMOS process
*manufactured in Zelenograd in a 180&nbsp;nm CMOS process
*does not contain any [[Engineering:Semiconductor intellectual property core|IP blocks]] from outside Russia<ref name=multicore180123/>
*does not contain any [[Engineering:Semiconductor intellectual property core|IP blocks]] from outside Russia<ref name=multicore180123/>
*[[Engineering:Quad Flat Package|CQFP240]] package
*[[Engineering:Quad Flat Package|CQFP240]] package
*includes 2 [[Engineering:SpaceWire|SpaceWire]] ports; supports [[ECC memory]]
*includes 2 [[Engineering:SpaceWire|SpaceWire]] ports; supports [[ECC memory]]
*radiation tolerance to not less than 300 kRad, working temperature from -60 to 85 °C
*radiation tolerance to not less than 300 kRad, working temperature from -60 to 85&nbsp;°C


===1892VM14Ya===
===1892VM14Ya===
*{{lang-ru|1892ВМ14Я|italic=yes}} (MCom-02)
*{{langx|ru|1892ВМ14Я|italic=yes}} (MCom-02)
*manufactured by [[Company:TSMC|TSMC]] in a 40nm CMOS process
*manufactured by [[Company:TSMC|TSMC]] in a 40&nbsp;nm CMOS process
*[[Engineering:Ball grid array|HFCBGA 1296]] package
*[[Engineering:Ball grid array|HFCBGA 1296]] package
*includes 2 [[Engineering:SpaceWire|SpaceWire]] ports; hardware accelerators for H.264 and [[JPEG]] encoding; correlator for [[Engineering:GPS|GPS]] and [[Astronomy:GLONASS|GLONASS]] signals
*includes 2 [[Engineering:SpaceWire|SpaceWire]] ports; hardware accelerators for H.264 and [[JPEG]] encoding; correlator for [[Engineering:GPS|GPS]] and [[Astronomy:GLONASS|GLONASS]] signals


===1892VM15AF===
===1892VM15AF===
*{{lang-ru|1892ВМ15АФ|italic=yes}} (MC-30SF6)
*{{langx|ru|1892ВМ15АФ|italic=yes}} (MC-30SF6)
*manufactured in Zelenograd in a 180nm CMOS process
*manufactured in Zelenograd in a 180&nbsp;nm CMOS process
*does not contain any [[Engineering:Semiconductor intellectual property core|IP blocks]] from outside Russia<ref name=multicore180123/>
*does not contain any [[Engineering:Semiconductor intellectual property core|IP blocks]] from outside Russia<ref name=multicore180123/>
*[[Engineering:Pin grid array|CPGA720]] package
*[[Engineering:Pin grid array|CPGA720]] package
*includes 2 [[Engineering:SpaceWire|SpaceWire]] ports; supports [[ECC memory]]; hardware accelerators for [[Fast Fourier transform|FFT]] and [[JPEG]] encoding
*includes 2 [[Engineering:SpaceWire|SpaceWire]] ports; supports [[ECC memory]]; hardware accelerators for [[Fast Fourier transform|FFT]] and [[JPEG]] encoding
*power consumption 5&nbsp;W
*power consumption 5&nbsp;W
*triple redundancy for registers; radiation tolerance to not less than 300 kRad, working temperature from -60 to 85 °C
*triple redundancy for registers; radiation tolerance to not less than 300 kRad, working temperature from -60 to 85&nbsp;°C


===1892VM16T===
===1892VM16T===
*{{lang-ru|1892ВМ16Т|italic=yes}}
*{{langx|ru|1892ВМ16Т|italic=yes}}
*manufactured by Mikron Group in a 180nm CMOS process
*manufactured by Mikron Group in a 180&nbsp;nm CMOS process
*[[Engineering:Quad Flat Package|CQFP240]] package
*[[Engineering:Quad Flat Package|CQFP240]] package
*working temperature from -60 to 85 °C
*working temperature from -60 to 85&nbsp;°C


===1892VM17F===
===1892VM17F===
*{{lang-ru|1892ВМ17Ф|italic=yes}}
*{{langx|ru|1892ВМ17Ф|italic=yes}}
*manufactured by Mikron Group in a 180nm CMOS process
*manufactured by Mikron Group in a 180&nbsp;nm CMOS process
*[[Engineering:Pin grid array|CPGA416]] package
*[[Engineering:Pin grid array|CPGA416]] package
*working temperature from -60 to 85 °C
*working temperature from -60 to 85&nbsp;°C


===1892VM18F===
===1892VM18F===
*{{lang-ru|1892ВМ18Ф|italic=yes}}
*{{langx|ru|1892ВМ18Ф|italic=yes}}
*manufactured by Mikron Group in a 180nm CMOS process
*manufactured by Mikron Group in a 180&nbsp;nm CMOS process
*[[Engineering:Pin grid array|CPGA720]] package
*[[Engineering:Pin grid array|CPGA720]] package
*working temperature from -60 to 85 °C
*working temperature from -60 to 85&nbsp;°C


===1892VM196===
===1892VM196===
*{{lang-ru|1892ВМ196|italic=yes}}
*{{langx|ru|1892ВМ196|italic=yes}}
*manufactured in Zelenograd in a 180nm process
*manufactured in Zelenograd in a 180&nbsp;nm process
*does not contain any [[Engineering:Semiconductor intellectual property core|IP blocks]] from outside Russia
*does not contain any [[Engineering:Semiconductor intellectual property core|IP blocks]] from outside Russia
*[[Engineering:Pin grid array|CPGA416]] package
*[[Engineering:Pin grid array|CPGA416]] package
*includes [[Engineering:SpaceWire|SpaceWire]], [[ARINC 429]], [[Serial Peripheral Interface|SPI]], and [[CAN bus|CAN]] interfaces as well as a 12-bit, 100KHz [[Analog-to-digital converter|ADC]]
*includes [[Engineering:SpaceWire|SpaceWire]], [[ARINC 429]], [[Serial Peripheral Interface|SPI]], and [[CAN bus|CAN]] interfaces as well as a 12-bit, 100&nbsp;kHz [[Analog-to-digital converter|ADC]]


===1892VM206===
===1892VM206===
*{{lang-ru|1892ВМ206|italic=yes}}
*{{langx|ru|1892ВМ206|italic=yes}}
*manufactured in Zelenograd in a 180nm process
*manufactured in Zelenograd in a 180&nbsp;nm process
*does not contain any [[Engineering:Semiconductor intellectual property core|IP blocks]] from outside Russia
*does not contain any [[Engineering:Semiconductor intellectual property core|IP blocks]] from outside Russia
*[[Engineering:Pin grid array|CPGA720]] package
*[[Engineering:Pin grid array|CPGA720]] package
Line 398: Line 399:


===1892VM226===
===1892VM226===
*{{lang-ru|1892ВМ226|italic=yes}}
*{{langx|ru|1892ВМ226|italic=yes}}
*includes [[Engineering:SpaceWire|SpaceWire]] and SpaceFibre interfaces
*includes [[Engineering:SpaceWire|SpaceWire]] and SpaceFibre interfaces


===1892VM236===
===1892VM236===
*{{lang-ru|1892ВМ236|italic=yes}}
*{{langx|ru|1892ВМ236|italic=yes}}
*manufactured in Zelenograd in a 90nm process
*manufactured in Zelenograd in a 90&nbsp;nm process
*includes [[Engineering:SpaceWire|SpaceWire]] interface
*includes [[Engineering:SpaceWire|SpaceWire]] interface


===1892VM248===
===1892VM248===
*{{lang-ru|1892ВМ248|italic=yes}} (RoboDeus)
*{{langx|ru|1892ВМ248|italic=yes}} (RoboDeus)
*manufactured by [[Company:TSMC|TSMC]] in a 16nm process
*manufactured by [[Company:TSMC|TSMC]] in a 16&nbsp;nm process
*intended for data centers and robotic systems
*intended for data centers and robotic systems
*MIPI [[Camera Serial Interface|CSI]] and [[Display Serial Interface|DSI]] interfaces (4K / 60fps), hardware accelerators for H.264 and HEVC
*MIPI [[Camera Serial Interface|CSI]] and [[Display Serial Interface|DSI]] interfaces (4K / 60fps), hardware accelerators for H.264 and HEVC
Line 414: Line 415:


===1892VA018===
===1892VA018===
*{{lang-ru|1892ВА018|italic=yes}} (Scythian)
*{{langx|ru|1892ВА018|italic=yes}} (Scythian)
*intended for smart cameras, robotic systems, industrial automation
*intended for smart cameras, robotic systems, industrial automation
*MIPI [[Camera Serial Interface|CSI]] and [[Display Serial Interface|DSI]] interfaces (4K / 60fps), hardware accelerators for H.264 and HEVC
*MIPI [[Camera Serial Interface|CSI]] and [[Display Serial Interface|DSI]] interfaces (4K / 60fps), hardware accelerators for H.264 and HEVC
Line 422: Line 423:


===1892VK016===
===1892VK016===
*{{lang-ru|1892ВК016|italic=yes}} (MCT-04R)
*{{langx|ru|1892ВК016|italic=yes}} (MCT-04R)
*manufactured in Russia in a 180nm CMOS process
*manufactured in Russia in a 180&nbsp;nm CMOS process
*[[Engineering:Pin grid array|CPGA720]] package
*[[Engineering:Pin grid array|CPGA720]] package
*intended for [[Solid-state drive|SSD]] controllers; includes [[Engineering:SpaceWire|SpaceWire]] and SpaceFibre interfaces; [[ECC memory|ECC]] for internal and external memory
*intended for [[Solid-state drive|SSD]] controllers; includes [[Engineering:SpaceWire|SpaceWire]] and SpaceFibre interfaces; [[ECC memory|ECC]] for internal and external memory
*radiation tolerance to not less than 200 kRad, working temperature from -60 to 85 °C
*radiation tolerance to not less than 200 kRad, working temperature from -60 to 85&nbsp;°C


===1892VK024===
===1892VK024===
*{{lang-ru|1892ВК024|italic=yes}} (MCT-07R)
*{{langx|ru|1892ВК024|italic=yes}} (MCT-07R)
*manufactured in a 180nm CMOS process
*manufactured in a 180&nbsp;nm CMOS process
*includes SpaceFibre, [[MIL-STD-1553]], and [[I²C]] interfaces as well as an 8-channel, 12-bit 200kHz [[Analog-to-digital converter|ADC]]
*includes SpaceFibre, [[MIL-STD-1553]], and [[I²C]] interfaces as well as an 8-channel, 12-bit 200&nbsp;kHz [[Analog-to-digital converter|ADC]]


===1892KP1Ya===
===1892KP1Ya===
*{{lang-ru|1892КП1Я|italics=yes}} (MCK-022)
*{{langx|ru|1892КП1Я|italics=yes}} (MCK-022)
*manufactured in a CMOS process
*manufactured in a CMOS process
*[[Engineering:Ball grid array|HSBGA-416]] package
*[[Engineering:Ball grid array|HSBGA-416]] package
*includes 16-port [[Engineering:SpaceWire|SpaceWire]] router
*includes 16-port [[Engineering:SpaceWire|SpaceWire]] router
*working temperature from -60 to 85 °C
*working temperature from -60 to 85&nbsp;°C


===1892KhD2Ya===
===1892KhD2Ya===
*{{lang-ru|1892ХД2Я|italics=yes}} (MCK-01)
*{{langx|ru|1892ХД2Я|italics=yes}} (MCK-01)
*manufactured in a CMOS process
*manufactured in a CMOS process
*[[Engineering:Ball grid array|HSBGA-416]] package
*[[Engineering:Ball grid array|HSBGA-416]] package
Line 450: Line 451:


==References==
==References==
{{reflist|refs=
<references>
 
<ref name=solokhina>{{cite conference
<ref name=solokhina>{{cite conference
|first=Tatiana
|first=Tatiana
Line 464: Line 466:
}}</ref>
}}</ref>
<ref name=multicore4_5>{{cite web
<ref name=multicore4_5>{{cite web
|title=Новые трехпроцессорные DSP-контроллеры «Мультикор»
|title=Новые трехпроцессорные DSP-контроллеры "Мультикор"
|trans-title=New 3-core DSP controllers "Multicore"
|trans-title=New 3-core DSP controllers "Multicore"
|publisher=Elvees Multicore
|publisher=Elvees Multicore
Line 519: Line 521:
|first=M.S.
|first=M.S.
|last=Piskarev
|last=Piskarev
|title=Процессоры «Мультикор»: от оборудования КА до систем искусственного интеллекта
|title=Процессоры "Мультикор": от оборудования КА до систем искусственного интеллекта
|trans-title="Multicore" processors: from spacecraft equipment to artificial intelligence systems
|trans-title="Multicore" processors: from spacecraft equipment to artificial intelligence systems
|language=ru
|language=ru
Line 554: Line 556:
<ref name=naumov>{{cite conference
<ref name=naumov>{{cite conference
|author=Sergey Naumov
|author=Sergey Naumov
|title=АО НПЦ «ЭЛВИС» - Презентация компании
|title=АО НПЦ "ЭЛВИС" - Презентация компании
|trans-title=AO NPC "ELVEES" - Company presentation
|trans-title=AO NPC "ELVEES" - Company presentation
|language=ru
|language=ru
Line 582: Line 584:
|access-date=2021-03-09
|access-date=2021-03-09
}}</ref>
}}</ref>
}}
 
</references>


==External links==
==External links==
* [http://multicore.ru/ Official site of ELVEES Multicore] (In Russian)
* [http://multicore.ru/ Official site of ELVEES Multicore] (In Russian)


{{List of Russian microprocessors}}
{{List of Soviet microprocessors}}


[[Category:MIPS implementations]]
[[Category:MIPS implementations]]

Latest revision as of 04:27, 15 May 2026

Short description: Series of microprocessors
ELVEES Multicore
General Info
Launched2004; 22 years ago (2004)
Designed byELVEES
Performance
Max. CPU clock rate80 MHz to 1.5 GHz
Architecture and classification
Min. feature size250 nm to 16 nm
Instruction setCPU MIPS32 + DSP ELcore
Physical specifications
Cores
  • 0–8 processors + 0–16 DSP
History

Multicore (Russian: МУЛЬТИКОР) is a series of 32-bit microprocessors with embedded DSP cores developed by ELVEES, Russia.[1] The microprocessor is a MIPS32 core (called RISCore32 by ELVEES; optionally with an FPU) or an ARM Cortex-A9 core. Some of the processors in the series are radiation hardened (rad-hard) for space applications.


Overview

Device Microprocessor core DSP core Production start (year) Process (nm) Clock rate (MHz) Remarks
1892VM1T RISCore32 1x ELcore ? ? ? [2]
1892VM1Ya RISCore32 1x ELcore ? ? ? [2][3]
1892VM2Ya RISCore32 1x ELcore-24 2005 250 80 [2][3][4][5]
1892VM3T RISCore32 1x ELcore-14 2005 250 80 [2][3][4]
1892VM4Ya RISCore32 2x ELcore-26 2006 250 100 [2][3][4][6]
1892VM5Ya RISCore32 2x ELcore-26 2006 250 100 [2][3][4][6]
1892VM5BYa RISCore32 2x ELcore-26 ? ? 90 [3]
1892VM7Ya RISCore32 + FPU 4x ELcore-28 2009 130 200 [4][5][7]
1892VM8Ya RISCore32 + FPU 1x ELcore-26 2010 250 80 rad-hard[2][3][5][8][9]
1892VM10Ya RISCore32 + FPU 2x ELcore-30 2012 130 250 [3][7]
1892VM11Ya RISCore32 + FPU 2x ELcore-30 2011 65 500 [10]
1892VM12AT RISCore32 + FPU — 2013 180 100 rad-hard[5][7][8][9]
1892VM14Ya 2x ARM Cortex-A9 + GPU Mali-300 2x ELcore-30M 2014 40 816 [7][8][9]
1892VM15AF RISCore32 + FPU 2x ELcore-30M 2014 180 120 rad-hard[5][7][8][9]
1892VM16T RISCore32 + FPU 1x ELcore 2014 180 110 rad-hard[2][8][11][12]
1892VM17F RISCore32 + FPU 1x ELcore 2014 180 110 rad-hard[2][8][11][12]
1892VM18F RISCore32 + FPU 2x ELcore 2015 180 110 rad-hard[2][8][11][12]
1892VM196 RISCore32 + FPU — 2018 180 120 rad-hard[7][8]
1892VM206 RISCore32 + FPU 2x ELcore-30M 2018 180 120 rad-hard[7][8]
1892VM218 ? ? ? ? ?
1892VM226 ? ? 2020 ? ? ? rad-hard[9]
1892VM236 ? ? 2019 90 ? rad-hard[8][9]
1892VM248 8x MIPS64 + PowerVR GPU 16x ELcore-50 2020 ? 16 1500 [9]
1892VM258 ? ? ? ? ?
1892VM268 ARM Cortex-M33 ? 2021 ? ? ? [13]
1892VA018 4x ARM Cortex-A53 + PowerVR GPU 2x ELcore-50 2020 ? ? 1200 [9]
1892VK016 2x RISCore32 — 2019 180 100 rad-hard[5][7][9]
1892VK024 RISCore32 + FPU 2x ELcore 2020 ? 180 ? rad-hard[5][9]
1892KP1Ya RISCore32 — 2010 ? 100 rad-hard[2][3][5][7][9]
1892KhD2Ya RISCore32 — 2007 ? ? rad-hard[2][3][4][5][9]

Details

1892VM1Ya

1892VM2Ya

  • Russian: 1892ВМ2Я (MC-24)
  • 2 cores: RISCore32 + ELcore-24 (DSP-core with SIMD architecture)
  • manufactured in a 250 nm CMOS process
  • 18 million transistors
  • HSBGA292 package

1892VM3T

  • Russian: 1892ВМ3Т (MC-12)
  • 2 cores: RISCore32 + ELcore-14 (DSP-core with SISD architecture)
  • manufactured in a 250 nm CMOS process
  • 18 million transistors
  • PQFP240 package

1892VM4Ya

  • Russian: 1892ВМ4Я (MC-0226G, МЦОС)
  • 3 cores: RISCore32 + 2x ELcore-26 (DSP-core with MIMD architecture)
  • manufactured in a foundry outside Russia in a 250 nm CMOS process
  • 26 million transistors
  • HSBGA416 package
  • includes 2 PCI controllers

1892VM5Ya

  • Russian: 1892ВМ5Я (МС-0226, ЦПОС-02)
  • 3 cores: RISCore32 + 2x ELcore-26 (DSP-core with MIMD architecture)
  • manufactured in a foundry outside Russia in a 250 nm CMOS process
  • 26 million transistors
  • HSBGA416 package
  • includes 1 PCI controller

1892VM7Ya

  • Russian: 1892ВМ7Я (МС-0428)
  • 130 nm CMOS process, 81 million transistors
  • HSBGA765 package
  • includes 2 SpaceWire ports

1892VM8Ya

  • Russian: 1892ВМ8Я (MC-24R)
  • manufactured by X-Fab Malaysia in a 250 nm CMOS process and later by TSMC in a 40 nm CMOS process (with the clock speed increased to 100 MHz)
  • HSBGA416 package
  • includes 2 SpaceWire ports; supports ECC memory

1892VM10Ya

  • Russian: 1892ВМ10Я (NVCom-02T)
  • manufactured in a foundry outside Russia in a 130 nm CMOS process
  • does not contain any IP blocks from outside Russia[14]
  • 50 million transistors
  • HSBGA400 package
  • includes 24-channel correlator for GPS / GLONASS

1892VM11Ya

  • Russian: 1892ВМ11Я (NVCom-02)
  • manufactured by Angstrem in a 65 nm CMOS process
  • BGA586 package
  • includes 24-channel correlator for GPS and GLONASS signals

1892VM12AT

  • Russian: 1892ВМ12АТ (MCT-03P)
  • manufactured in Zelenograd in a 180 nm CMOS process
  • does not contain any IP blocks from outside Russia[14]
  • CQFP240 package
  • includes 2 SpaceWire ports; supports ECC memory
  • radiation tolerance to not less than 300 kRad, working temperature from -60 to 85 °C

1892VM14Ya

1892VM15AF

  • Russian: 1892ВМ15АФ (MC-30SF6)
  • manufactured in Zelenograd in a 180 nm CMOS process
  • does not contain any IP blocks from outside Russia[14]
  • CPGA720 package
  • includes 2 SpaceWire ports; supports ECC memory; hardware accelerators for FFT and JPEG encoding
  • power consumption 5 W
  • triple redundancy for registers; radiation tolerance to not less than 300 kRad, working temperature from -60 to 85 °C

1892VM16T

  • Russian: 1892ВМ16Т
  • manufactured by Mikron Group in a 180 nm CMOS process
  • CQFP240 package
  • working temperature from -60 to 85 °C

1892VM17F

  • Russian: 1892ВМ17Ф
  • manufactured by Mikron Group in a 180 nm CMOS process
  • CPGA416 package
  • working temperature from -60 to 85 °C

1892VM18F

  • Russian: 1892ВМ18Ф
  • manufactured by Mikron Group in a 180 nm CMOS process
  • CPGA720 package
  • working temperature from -60 to 85 °C

1892VM196

1892VM206

1892VM226

1892VM236

  • Russian: 1892ВМ236
  • manufactured in Zelenograd in a 90 nm process
  • includes SpaceWire interface

1892VM248

  • Russian: 1892ВМ248 (RoboDeus)
  • manufactured by TSMC in a 16 nm process
  • intended for data centers and robotic systems
  • MIPI CSI and DSI interfaces (4K / 60fps), hardware accelerators for H.264 and HEVC
  • includes 10 Gigabit Ethernet, USB 3.1, HDMI, PCIe, and SATA interfaces

1892VA018

  • Russian: 1892ВА018 (Scythian)
  • intended for smart cameras, robotic systems, industrial automation
  • MIPI CSI and DSI interfaces (4K / 60fps), hardware accelerators for H.264 and HEVC
  • GNSS signal processor
  • hardware accelerators for software-defined radios (FFT, Viterbi)
  • includes Gigabit Ethernet and USB 3.0 interfaces

1892VK016

  • Russian: 1892ВК016 (MCT-04R)
  • manufactured in Russia in a 180 nm CMOS process
  • CPGA720 package
  • intended for SSD controllers; includes SpaceWire and SpaceFibre interfaces; ECC for internal and external memory
  • radiation tolerance to not less than 200 kRad, working temperature from -60 to 85 °C

1892VK024

  • Russian: 1892ВК024 (MCT-07R)
  • manufactured in a 180 nm CMOS process
  • includes SpaceFibre, MIL-STD-1553, and I²C interfaces as well as an 8-channel, 12-bit 200 kHz ADC

1892KP1Ya

  • Russian: 1892КП1Я (MCK-022)
  • manufactured in a CMOS process
  • HSBGA-416 package
  • includes 16-port SpaceWire router
  • working temperature from -60 to 85 °C

1892KhD2Ya

See also

  • Soviet integrated circuit designation

References

  1. ↑ Solokhina, Tatiana (23 June 2010). "Next Generation DSP Multi-Core Processor with SpaceWire Links as the Development of the 'MCFlight' Chipset For the On-Board Payload Data Processing Applications". St. Petersburg: Space Technology Centre, University of Dundee. pp. 313–318. http://2010.spacewire-conference.org/proceedings/Papers/Components/Solokhina.pdf. Retrieved 12 January 2017. 
  2. ↑ 2.00 2.01 2.02 2.03 2.04 2.05 2.06 2.07 2.08 2.09 2.10 2.11 "Изделия отечественного производства" (in Russian). AO "ENPO SPELS". http://www.spels.ru/index.php?option=com_easytablepro&view=easytable&id=13:op. Retrieved 1 September 2016. 
  3. ↑ 3.00 3.01 3.02 3.03 3.04 3.05 3.06 3.07 3.08 3.09 "СЕРИЯ 1892" (in ru). Promelektronika-VPK. http://promvpk.ru/Catalog/Index/51a26afc6d0fad80e4035b72. Retrieved 25 October 2017. 
  4. ↑ 4.0 4.1 4.2 4.3 4.4 4.5 "КАТАЛОГ 2008" (in ru). Elvees Multicore. http://multicore.ru/mc/data_sheets/ELVEES_catalogue.pdf. Retrieved 4 March 2019. 
  5. ↑ 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 "eidOS" (in ru). MiT. http://sicmit.ru/produktsija/programmnoe-obespechenie/eidos/. 
  6. ↑ 6.0 6.1 "Новые трехпроцессорные DSP-контроллеры "Мультикор"" (in Russian). Elvees Multicore. 20 March 2006. http://multicore.ru/index.php?id=1248&tx_ttnews%5Btt_news%5D=16&cHash=8bd5992cfd8913d7a6b52c1bb3c02542. Retrieved 12 January 2017. 
  7. ↑ 7.0 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 "КАТАЛОГ 2018" (in ru). Elvees Multicore. http://multicore.ru/mc/data_sheets/ELVEES_catalogue.pdf. Retrieved 4 March 2019. 
  8. ↑ 8.00 8.01 8.02 8.03 8.04 8.05 8.06 8.07 8.08 8.09 Piskarev, M.S. (25 April 2018). "Процессоры "Мультикор": от оборудования КА до систем искусственного интеллекта" (in ru). http://kpda.ru/upload/iblock/7ca/piskarev_250418.pdf. Retrieved 26 November 2018. 
  9. ↑ 9.00 9.01 9.02 9.03 9.04 9.05 9.06 9.07 9.08 9.09 9.10 9.11 Sergey Naumov (2020). "АО НПЦ "ЭЛВИС" - Презентация компании" (in ru). MES. Moscow. http://www.mes-conference.ru/data/year2020/commprsnt/Naumov.pdf. Retrieved 2021-03-04. 
  10. ↑ "Цифровой сигнальный процессор 1892ВМ11Я (NVCOM-02)" (in Russian). TechnoUnity. http://www.technounity.ru/uchastniki/produkty/tsifrovoy-signalnyy-protsessor-1892vm11ya-nvcom-02-65/. Retrieved 13 January 2017. 
  11. ↑ 11.0 11.1 11.2 "Серии Предприятия НИИМЭ и Микрон" (in ru). Optochip. https://optochip.org/series/mnf/35-1480. Retrieved 8 February 2018. 
  12. ↑ 12.0 12.1 12.2 "Микросхемы ПАО Микрон 2020" (in ru). Mikron. https://413100.selcdn.ru/upload-153a6b408c99eadfc8d7d3c5576481d8/iblock/05d/05d7224966d072bbbc986716f3e32ecc/katalog+VPK_2020.pdf. 
  13. ↑ Sergey Gruzdyev (2021). "Aladdin LiveOffice" (in ru). TB Forum. p. 12. https://f.hubspotusercontent00.net/hubfs/2037604/TBF/Presentations2021_online/TBFOFFline/TBF%2010-02-21%20hall%204/TBF_100221_hall4_%D0%A4%D0%A1%D0%A2%D0%AD%D0%9A_%D0%93%D1%80%D1%83%D0%B7%D0%B4%D0%B5%D0%B2.pdf. Retrieved 2021-03-05. 
  14. ↑ 14.0 14.1 14.2 "Российские микросхемы 1 и 2 уровня" (in ru). Elvees Multicore. 23 January 2018. http://multicore.ru/index.php?id=1248&tx_ttnews%5Btt_news%5D=249&cHash=a37597b34608c52dbdd3882f72201964. Retrieved 8 February 2018. 

Template:List of Russian microprocessors Template:List of Soviet microprocessors



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