Engineering:IAg

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IAg or Immersion Silver Plating is a surface plating technology used for Printed Circuit Boards.

Description

It consists of a thin immersion silver plating over the copper traces.

Advantages of IAg

  • Excellent surface planarity (compared to e.g. HASL)
  • Low High Frequency Signal loss due to skin effect

Disadvantages of IAg

  • Rapid degradation of surface due to oxidation or contamination (with e.g. sulfur or chlorine)
  • Silver "whiskers" form across electrical potentials and short out components [1]

Specifications

IPC Standard: IPC-4553

See also

References

  1. ↑ Slocum, Dan, Jr. (2003-09-25). "Surface Finishes Utilized in the PCB Industry". http://dcchapters.ipc.org/assets/pnw/presentations/20030925_Finishes.pdf. 




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