Engineering:IAg
From HandWiki
IAg or Immersion Silver Plating is a surface plating technology used for Printed Circuit Boards.
Description
It consists of a thin immersion silver plating over the copper traces.
Advantages of IAg
- Excellent surface planarity (compared to e.g. HASL)
- Low High Frequency Signal loss due to skin effect
Disadvantages of IAg
- Rapid degradation of surface due to oxidation or contamination (with e.g. sulfur or chlorine)
- Silver "whiskers" form across electrical potentials and short out components [1]
Specifications
IPC Standard: IPC-4553
See also
- Electroless Nickel Immersion Gold (ENIG)
- Hot Air Solder Leveling (HASL)
- Organic Solderability Preservative (OSP)
- Reflow soldering
- Wave soldering
References
- ↑ Slocum, Dan, Jr. (2003-09-25). "Surface Finishes Utilized in the PCB Industry". http://dcchapters.ipc.org/assets/pnw/presentations/20030925_Finishes.pdf.
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