Company:Changxin Memory Technologies
File:CXMT logo 2.png | |
CXMT | |
Native name | 长鑫存储技术有限公司 |
Formerly | Innotron Memory Hefei Chang Xin Heifei Rui-li Integrated Circuit Manufacturing |
Industry | Semiconductors |
Founded | May 2016 |
Headquarters | Hefei, Anhui , China |
Key people | Zhu Yiming (Chairman & CEO) |
Number of employees | 3,000 |
Website | cxmt.com |
ChangXin Memory Technologies (CXMT, Chinese: 长鑫存储)[lower-alpha 1] is a Chinese semiconductor foundry headquartered in Hefei, Anhui specializing in the production of DRAM memory.
As of 2020, ChangXin can manufacture LPDDR4 and DDR4 RAM on a 19nm process and as if early 2021, they will achieve 17nm. The company has a capacity of approximately 40,000 wafers per month.[1]
History
Together with JHICC (Fujian Jinhua Integrated Circuit) and Xi'an UniIC Semiconductors, Innotron was one of a set of Chinese semiconductor plants established in 2016 to compete with global manufacturers of computer memory.[2][3][4] In early 2017, a $7.2 billion deal for a 125,000, 12" (300mm) wafer per month production fabrication plant was announced.[5] Innotron's factory was completed by mid-2017[3] and production equipment was installed at the plant in late 2017. Trials and mass production were scheduled for late 2018 and early 2019.[6][7] In late 2018, CEO Zhu Yiming was reported to have visited ASML to discuss the purchase of extreme ultraviolet lithography machines.[7]
Initially, Innotron was thought to have chosen 8Gb LPDDR4 memory as its first product. At the time, analysts claimed that patent and IP issues would present a barrier to its competing with major manufacturers.[3] In mid-2018, trial production of 19 nm 8Gb LPDDR4 was reported to have begun.[8] Innotron's initial capacity was ~20,000 wafers per month, a small output in terms of the industry as a whole.[2]
In mid 2019 Innotron, which had changed its name to Changxin Memory Technologies, was reported to have made some design changes in an attempt to avoid possible technology related sanctions deriving from the China–United States trade war.[9]
In Dec 2019 in an interview with EE Times the company stated its first Fab was in productions, and producing 20,000 wafers per month, making 8Gbit LPDDR4 and DDR4 DRAM at 19 nm.[10]
The company is reported to increase production to 3% of world DRAM output, or about 40,000 wafers a month by the end of 2020.[11]
Facilities
As of late 2019 CXMT has over 3,000 employees and runs a fab with a 65,000 square meters clean room space. Over 70% of its employees are engineers working on various R&D-related projects. CXMT uses its 10G1 process technology (aka 19 nm) to make 4 Gb and 8 Gb DDR4 memory chips.[12]
LPDDR4 RAM was added to the product porfolio in 2020.[13]
Notes
- ↑ Formerly known as Innotron Memory, Hefei Chang Xin, or Heifei Rui-li Integrated Circuit Manufacturing.
References
- ↑ Mellor, Chris (2020-10-13). "Micron said to be mulling action against Chinese DRAM maker CXMT – report". Blocks & Files. https://blocksandfiles.com/2020/10/13/micron-may-sue-chinese-dram-maker-cxmt-for-stealing-ip/. Retrieved 2021-08-16.
- ↑ 2.0 2.1 Shilov, Anton (25 Apr 2018), "Chinese DRAM Industry Spreading Its Wings: Two More DRAM Fabs Ready", www.anandtech.com, https://www.anandtech.com/show/12681/chinese-dram-industry-spreading-its-wings-two-more-dram-fabs-ready
- ↑ 3.0 3.1 3.2 "The Three Major Chinese Memory Companies Arrange Trial Production to Begin in 2H18 and Formal Production in 2019, Says TrendForce", trendforce.com, 19 Apr 2018, https://press.trendforce.com/press/20180419-3090.html
- ↑ "China set to produce first locally designed DRAM chip". Nikkei Asian Review. 12 June 2019. https://asia.nikkei.com/Economy/Trade-war/China-set-to-produce-first-locally-designed-DRAM-chip. Retrieved 15 May 2020.
- ↑ "China firms to invest CNY18 billion to develop 19nm DRAM technology", chinaflashmarket.com, 31 Oct 2017, http://en.chinaflashmarket.com/TradeNewsDetails.aspx?QXJ0aWNsZV9JRD0xMjAxMw%3D%3D[yes|permanent dead link|dead link}}]
- ↑ Roos, Gina (26 Apr 2018), "Three Chinese Companies to Start Memory IC Production in 2018", epsnews.com, https://epsnews.com/2018/04/26/three-chinese-companies-to-start-memory-ic-production-in-2018/
- ↑ 7.0 7.1 Ting-Fang, Cheng (22 Oct 2018), "Chinese state-backed chipmaker targets Europe amid US resistance", nikkei.com, https://asia.nikkei.com/Economy/Trade-War/Chinese-state-backed-chipmaker-targets-Europe-amid-US-resistance
- ↑ Manners, David (19 July 2018), "China memory production gets closer", www.electronicsweekly.com, https://www.electronicsweekly.com/news/business/china-memory-production-gets-closer-2018-07/
- ↑ Ting-Fang, Cheng (12 June 2019), "China set to produce first locally designed DRAM chip - Changxin Memory minimizes US tech to avoid trade war fallout", Nikkei, https://asia.nikkei.com/Economy/Trade-war/China-set-to-produce-first-locally-designed-DRAM-chip
- ↑ Yoshida, Junko (3 Dec 2019), "ChangXin Emerging as China's First & Only DRAM Maker", www.eetimes.com, https://www.eetimes.com/changxin-emerging-as-chinas-first-only-dram-maker/
- ↑ "China memory chip output zooms from zero to 5% of world total". Nikkei Asian Review. 20 November 2019. https://asia.nikkei.com/Business/China-tech/China-memory-chip-output-zooms-from-zero-to-5-of-world-total. Retrieved 15 May 2020.
- ↑ Shilov, Anton (2 Dec 2019), "ChangXin Memory Technologies (CXMT) is Ramping up Chinese DRAM Using Qimonda IP", www.anandtech.com, https://www.anandtech.com/show/15161/cxmt-ramp-up
- ↑ "Chinese Semiconductor Companies Growing Fast" (in ko). 28 Feb 2020. http://www.businesskorea.co.kr/news/articleView.html?idxno=42029.
External links