Physics:Stanene

From HandWiki
Revision as of 04:44, 5 February 2024 by QCDvac (talk | contribs) (change)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Short description: Topological insulating semiconductor


Stanene[1][2][3] is a topological insulator, which may display dissipationless currents at its edges near room temperature. It is composed of tin atoms arranged in a single layer, in a manner similar to graphene.[4] Stanene got its name by combining stannum (the Latin name for tin) with the suffix -ene used by graphene.[5] Research is ongoing in Germany and China, as well as at laboratories at Stanford and UCLA.[6]

The addition of fluorine atoms to the tin lattice could extend the critical temperature up to 100 °C.[7] This would make it practical for use in integrated circuits to make smaller, faster and more energy efficient computers.

See also

Stannenes (Similar name to Stanene)

References

  1. DOE/SLAC National Accelerator Laboratory (2013-11-21). "Will 2-D tin be the next super material?". Sciencedaily.com. http://www.sciencedaily.com/releases/2013/11/131121135635.htm. Retrieved 2014-01-10. 
  2. Garcia, J. C.; de Lima, D. B.; Assali, L. V. C.; Justo, J. F. (2011). "Group IV Graphene- and Graphane-Like Nanosheets". J. Phys. Chem. C 115: 13242. doi:10.1021/jp203657w. 
  3. "Will 2-D tin be the next super material?". Phys.org. 21 November 2013. http://phys.org/news/2013-11-d-tin-super-material.html. Retrieved 2014-01-10. 
  4. Xu, Yong; Yan, Binghai; Zhang, Hai-Jun; Wang, Jing; Xu, Gang; Tang, Peizhe; Duan, Wenhui; Zhang, Shou-Cheng (2013-09-24). "Large-Gap Quantum Spin Hall Insulators in Tin Films" (in en). Physical Review Letters 111 (13): 136804. doi:10.1103/PhysRevLett.111.136804. ISSN 0031-9007. PMID 24116803. https://link.aps.org/doi/10.1103/PhysRevLett.111.136804. 
  5. Singh, Ritu (November 24, 2013). "Tin could be the next super material for computer chips". Zeenews. http://zeenews.india.com/news/science/tin-could-be-the-next-super-material-for-computer-chips_892199.html. 
  6. Markoff, John (January 9, 2014). "Designing the Next Wave of Computer Chips". New York Times. http://www.nytimes.com/2014/01/10/science/designing-the-next-wave-of-computer-chips.html. Retrieved January 10, 2014. 
  7. "Will 2-D Tin be the Next Super Material?" (Press release). Stanford University: SLAC National Accelerator Laboratory. November 21, 2013.

External links