Physics:IEEE Transactions on Advanced Packaging
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| |Subject |Discipline}} | Multi-chip modules, wafer-scale integration |
|---|---|
| Language | English |
| Edited by | Ganesh Subbarayan |
| Publication details | |
Former name(s) | IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing |
| History | 1999–2010 |
| Publisher | IEEE Components, Packaging, and Manufacturing Technology Society |
| Frequency | Quarterly |
| 1.276 (2010) | |
| Standard abbreviations | |
| ISO 4 | IEEE Trans. Adv. Packag. |
| Indexing | |
| CODEN | ITAPFZ |
| ISSN | 1521-3323 |
| LCCN | 99111625 |
| OCLC no. | 39742480 |
| Links | |
)IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276.[1]
References
- ↑ "IEEE Transactions on Advanced Packaging". 2010 Journal Citation Reports. Web of Science (Science ed.). Thomson Reuters. 2011.
External links
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