Category:Chip carriers
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Here is a list of articles in the Chip carriers category of the Engineering portal.
Pertains to the packages that are used to provide larger, more robust assemblies for integrated circuit chips that are then soldered to circuit boards.
Pages in category "Chip carriers"
The following 39 pages are in this category, out of 39 total.
- Chip carrier (engineering)
- Chip-scale package (engineering)
- Fan-out wafer-level packaging (engineering)
- List of integrated circuit packaging types (engineering)
- Wafer-level packaging (engineering)
A
- AlSiC (chemistry)
B
- Ball grid array (engineering)
C
- Cerquad (engineering)
- Copper–tungsten (chemistry)
D
- Dual in-line package (engineering)
- Dye-and-pry (engineering)
- Dymalloy (chemistry)
E
- E-Material (chemistry)
- Electronic packaging (engineering)
- Embedded Wafer Level Ball Grid Array (engineering)
F
- Flatpack (electronics) (engineering)
- Flip chip (engineering)
I
- Integrated circuit packaging (engineering)
L
- Land grid array (engineering)
- Lead frame (engineering)
- Low insertion force (engineering)
M
- Mini-Cartridge (engineering)
- Multi-chip module (engineering)
- Multi-leaded power package (engineering)
P
- Package on package (engineering)
- Pin grid array (engineering)
Q
- Quad Flat No-leads package (engineering)
- Quad flat no-leads package (engineering)
- Quad Flat Package (engineering)
- Quad flat package (engineering)
S
- Small outline integrated circuit (engineering)
- Surface-mount technology (engineering)
T
- Thin Quad Flat Pack (engineering)
- Thin small outline package (engineering)
- Thin Small Outline Package (engineering)
- Through-hole technology (engineering)
U
- Universal integrated circuit card (computing)
X
- XSON (engineering)
Z
- Zig-zag in-line package (engineering)
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