Engineering:Centrino

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Short description: Brand name by Intel
Components of the Centrino platform. From right, clockwise: Intel PRO/Wireless wireless network adapter, Intel mobile processor, Intel mobile southbridge chipset, and Intel mobile northbridge chipset.

Centrino is a brand name of Intel Corporation which represents its Wi-Fi and WiMAX wireless computer networking adapters. Previously the same brand name was used by the company as a platform-marketing initiative. The change of the meaning of the brand name occurred on January 7, 2010.[1](p1) The Centrino was replaced by the Ultrabook.

The old platform-marketing brand name covered a particular combination of mainboard chipset, mobile CPU and wireless network interface in the design of a laptop. Intel claimed that systems equipped with these technologies delivered better performance, longer battery life and broader wireless network interoperability than non-Centrino systems.

The new product line name for Intel wireless products is Intel Centrino Wireless.[2]

Intel Centrino

Wireless LAN Chipset Centrino Processor Codename Release Date Manufacturing

Technology

Microarchitecture
Intel

Wireless

Products

800 Series Carmel Intel Pentium M Banias 2003 130 nm Intel P6
Dothan 2004 90 nm
900 Series Sonoma 2005
Napa Intel Core Solo/Duo Yonah 2006 65 nm
Intel Core 2 Duo/Solo Merom Intel Core
Santa Rosa Intel Core 2 Solo/Duo 2007
Penryn 2008 45 nm
4 Series Montevina
5 Series Calpella Intel Core i7/i7 Extreme Edition Clarksfield 2009 Intel Nehalem
Intel Core i3/i5/i7 Arrandale 2010 32 nm
6 Series Huron River Intel Core i3/i5/i7/i7 Extreme Edition Sandy Bridge 2011 Intel Sandy Bridge
7 Series Chief River Intel Core i3/i5/i7/i7 Extreme Edition Ivy Bridge 2012 22 nm
8 Series Shark Bay Intel Core i3/i5/i7/i7 Extreme Edition Haswell 2013 Intel Haswell
9 Series Crescent Bay Intel Core M/i3/i5/i7 Broadwell 2014 14 nm
100 Series Sunrise Point Intel Core m3/m5/m7/i3/i5/i7 Skylake 2015 Intel Skylake
200 Series Union Point Intel Core m3/i3/i5/i7 Kaby Lake 2016

Notebook implementations

Carmel platform (2003)

Intel used "Carmel" as the codename for the first-generation Centrino platform, introduced in March 2003.

Centrino Carmel platform
Mobile chipset an Intel Mobile 855 Express series chipset (codenamed Odem or Montara with Intel Extreme Graphics 2), including ICH4M southbridge.
  • RAM supported for PC-2100 (DDR-266) or PC-2700 (DDR-333) SO-DIMM.
Mobile processor Processors - Socket 479
  • an Intel Pentium M (codenamed Banias) processor with a 400 MT/s FSB, or
  • an Intel Pentium M (codenamed Dothan) processor with a 400 MT/s FSB (after May 2004).
Wireless network an Intel PRO/Wireless 2100B (codenamed Calexico) or later 2200BG mini-PCI Wi-Fi adapter (codenamed Calexico2).

Industry-watchers initially criticized the Carmel platform for its lack of support for IEEE 802.11g, because many independent Wi-Fi chip-makers like Broadcom and Atheros had already started shipping 802.11g products. Intel responded that the IEEE had not finalized the 802.11g standard at the time of Carmel's announcement. In early 2004, after the finalization of the 802.11g standard, Intel permitted an Intel PRO/Wireless 2200BG to substitute for the 2100. At the same time, they permitted the new Dothan Pentium M to substitute for the Banias Pentium M. Initially, Intel permitted only the 855GM chipset, which did not support external graphics. Later, Intel allowed the 855GME and 855PM chips, which did support external graphics, in Centrino laptops.

Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Carmel could attain or exceed the performance of older Pentium 4-M platforms, while allowing for laptops to operate for 4 to 5 hours on a 48 W-h battery. Carmel also allowed laptop manufacturers to create thinner and lighter laptops because its components did not dissipate much heat, and thus did not require large cooling systems.

Sonoma platform (2005)

Intel used Sonoma as the codename for the second-generation Centrino platform, introduced in January 2005.

Centrino Sonoma platform
Mobile chipset an Intel Mobile 915 Express series chipset (codenamed Alviso with Intel GMA 900), including ICH6M southbridge.
  • RAM supported for PC2-4200 (DDR2-533) SO-DIMM.
Mobile processor Processors - Socket 479
Wireless network an Intel PRO/Wireless 2200BG or 2915ABG mini-PCI Wi-Fi adapter (both codenamed Calexico2).

The Mobile 915 Express chipset, like its desktop version, supports many new features such as DDR2, PCI Express, Intel High Definition Audio, and SATA. Unfortunately, the introduction of PCI Express and faster Pentium M processors causes laptops built around the Sonoma platform to have a shorter battery-life than their Carmel counterparts; Sonoma laptops typically achieve between 3.5–4.6 hours of battery-life on a 53 W-h battery.

Napa platform (2006)

The codename Napa designates the third-generation Centrino platform, introduced in January 2006 at the Winter Consumer Electronics Show. The platform initially supported Intel Core Duo processors but the newer Core 2 Duo processors were launched and supported in this platform from July 27, 2006 onwards.

Centrino Napa platform
Mobile chipset an Intel Mobile 945 Express series chipset (codenamed Calistoga with Intel GMA 950), including ICH7M southbridge.
  • RAM supported for PC2-4200 (DDR2-533) and PC2-5300 (DDR2-667) SO-DIMM.
Mobile processor Processors - Socket M / Micro-FCBGA
  • an Intel Core Solo, Core Duo (codenamed Yonah) processor, or
  • an Intel Core 2 Duo (codenamed Merom) processor with a 667 MT/s FSB for Napa Refresh platform, or
  • an Intel Core 2 Solo (codenamed Merom) processor with 533 MT/s FSB for Napa Refresh platform (Sept 2007).
Wireless network an Intel PRO/Wireless 3945ABG mini-PCIe Wi-Fi adapter (codenamed Golan).
  • Some newer models (as of 1st quarter 2007) of the Napa Refresh platform contain the newer 4965AGN (a/b/g/draft-n) wireless cards.

Intel uses Centrino Duo branding for laptops with dual-core Core Duo processors and retains the Centrino name for laptops with single core (Core Solo) processors. Some of the initial Core Duo laptops are still labeled as Intel Centrino rather than Centrino Duo.

Santa Rosa platform (2007)

The codename Santa Rosa refers to the fourth-generation Centrino platform, which was released on Thursday May 10, 2007.

Centrino Santa Rosa platform
Mobile chipset an Intel Mobile 965 Express series chipset (codenamed Crestline): GM965 with Intel GMA X3100 graphics technology or PM965 with discrete graphics, and ICH8M southbridge, 800 MT/s front side bus with Dynamic Front Side Bus Switching to save power during low utilization.
  • Intel Dynamic Acceleration (IDA), better Windows Vista Aero support.[3]
  • RAM supported for PC2-4200 (DDR2-533) and PC2-5300 (DDR2-667) SO-DIMM.[4] Runs DDR2-800 SO-DIMMs at 667 MHz even though an 800 MT/s front side bus is supported.[5]
  • EFI-compliant firmware, a successor to BIOS.
  • optional NAND flash-memory caching branded as Intel Turbo Memory (codenamed Robson).
  • Ethernet LAN controller 82562V (codenamed Ekron-N) or Gigabit Ethernet LAN controllers 82566MM and 82566MC (codenamed Nineveh).
Mobile processor Processors - Socket P / Socket M / Micro-FCBGA
  • an Intel Core 2 Duo (codenamed Merom) second generation processor with 800 MT/s FSB, or
  • an Intel Core 2 Duo (codenamed Penryn) 45 nm processor with 800 MT/s FSB and SSE4.1, which will add 47 new instructions to SSSE3. It was scheduled for release in January 2008[6] for Santa Rosa Refresh platform.
Wireless network an Intel WiFi Link 4965AGN (a/b/g/draft-n) mini-PCIe Wi-Fi adapter (codenamed Kedron).
  • Wireless-N technology boasts a 5X speed increase, along with a 2X greater coverage area, and supports 2.4 GHz and 5 GHz signal bands, with enough bandwidth for high definition audio and video streams.[7]

The Santa Rosa platform comes with dynamic acceleration technology, allowing single threaded applications to execute faster. When a single threaded application is running, the CPU can turn off one of its cores and overclock the active core. In this way the CPU maintains the same Thermal Profile as it would when both cores are active. Santa Rosa performs well as a mobile gaming platform due to its ability to switch between single threaded and multithreaded tasks.[8] Other power savings come from an Enhanced Sleep state where both the CPU cores and the chipset will power down.

The wireless chipset update was originally intended to include WWAN Internet access via HSDPA (3.5G), (codenamed Windigo) co-developed with Nokia.[9][10] After announcing a working partnership, both later retracted the deal citing the lack of a clear business case for the technology. Support for WiMAX (802.16) was originally scheduled for inclusion in Santa Rosa but was later delayed until Montevina in 2008.[9]

It is branded as "Centrino Pro" when combined with the enhanced security technologies Intel introduced with vPro and "Centrino Duo" when they are not used.[11]

Montevina platform (2008)

The codename Montevina refers to the fifth-generation Centrino platform, now formally named Centrino 2 to avoid confusion with previous Centrino platforms. It was scheduled for release at Computex Taipei 2008, which took place on June 3–7, 2008,[12] but was delayed until July 15, due to problems with integrated graphics and wireless certification.[13]

Centrino Montevina platform
Mobile chipset an Intel Mobile Express series 4 chipset (codenamed Cantiga; GL40, GS45, GM45, PM45) with Intel GMA X4500 graphics technology and ICH9M southbridge, 1066 MT/s (667 MT/s for GL40) FSB. The GM45/GS45 graphics core is clocked at 533 MHz and 400 MHz for GL40, which contains ten unified shaders, up from the eight provided by GMA X3100.
  • RAM support for PC2-5300 (DDR2-667), PC2-6400 (DDR2-800), PC3-6400 (DDR3-800), PC3-8500 (DDR3-1066) SO-DIMM. (GL40 does not support DDR3-1066)
  • NAND flash-memory caching branded as Intel Turbo Memory (codenamed Robson 2).
  • Gigabit Ethernet LAN controllers 82567LM and 82567LF (codenamed Boazman).[14]
  • Main support for DisplayPort with an external connector attached to the motherboard along with full supplemental support of HDMI, DVI, and VGA standards.
Mobile processor Processors - Socket P / Socket M / Micro-FCBGA
  • a second-generation Intel Core 2 Duo (codenamed Penryn) 45nm processor with 800-1066 MT/s FSB with clock speeds ranging from 2 GHz to 3.06 GHz, also featuring SSE4.1 support, which adds 47 new instructions to SSSE3. It was planned to consume no more than 29W, compared to Merom's and first-generation Penryn's 34W TDP. But after release only a few models (P series) have 25W TDP and the rest (T series) still have 35W TDP, besides the Q series (Quad core) TDP is 45W.
Wireless network Wireless Modules
  • Intel WiMAX/WiFi Link 5350 mini-PCIe (codenamed Echo Peak-P) supporting both WiMAX and up to 450Mbit/s Wi-Fi, or
  • Intel Ultimate N WiFi Link 5300 mini-PCIe adapter (codenamed Shirley Peak 3x3) supporting up to 450Mbit/s, or
  • Intel WiMAX/WiFi Link 5150 mini-PCIe adapter (codenamed Echo Peak-V) supporting both WiMAX and up to 300Mbit/s Rx / 150Mbit/s Tx Wi-Fi, or
  • Intel WiFi Link 5100 mini-PCIe adapter (codenamed Shirley Peak 1x2) supporting up to 300Mbit/s Rx / 150Mbit/s Tx

It is branded as Centrino 2 vPro when combined with built-in security and manageability features technologies.

Calpella platform (2009)

The codename Calpella refers to the sixth-generation Centrino platform. Though originally scheduled to premiere in Q3 2009 with the second iteration of Nehalem processors,[15] Intel had stated that due to pressure from computer manufacturers, they would delay the release of the platform until at least October 2009 (Q4 2009) to allow OEM partners to clear excess inventory of existing chips. This was believed to be spurred by the lowered demand due to unfavorable economic conditions throughout 2009.[16]

Centrino Calpella platform
Mobile chipset an Intel Mobile Express Series 5 chipset (PCHM codenamed Ibex Peak) with Intel HD Graphics technology that will allow for optimized decoding/encoding and editing/playback of H.264/MPEG-4 AVC video used in Blu-ray Discs and HD 1080p video, optimized for MPEG-2 (DVD) video playback and editing.
  • Integrated memory controller and integrated PCI express controller remove the need for a northbridge and the older FSB technology.
  • Direct connect to DisplayPort with DPCP as with its predecessor along with legacy support for HDMI (and HDCP), DVI, and VGA.
  • RAM supported for PC3-6400 (DDR3-800), PC3-8500 (DDR3-1066), PC3-10600 (DDR3-1333) and PC3-12800 (DDR3-1600) SO-DIMM.
  • Gigabit Ethernet LAN controllers 82577LM and 82577LF (codenamed Hanksville).
  • Solid-state drive or Hybrid hard drives support.
  • Second generation Intel Turbo Memory solid-state cache (codenamed Braidwood), canceled.
Mobile processor Processors, based on Intel Nehalem microarchitecture[17]
  • an Intel Core i7 Extreme processor (codenamed Clarksfield-XE) 45nm for Quad Core version, 55W TDP.
  • an Intel Core i7 processor (codenamed Clarksfield) 45nm for Quad Core version, 45W TDP.
  • an Intel Core i3/Core i5/Core i7 processor (codenamed Arrandale-SV contains 32nm Hillel and 45nm Ironlake) for Dual Core version, 35W TDP.
  • an Intel Core i7 processor (codenamed Arrandale-LV contains 32nm Hillel and 45nm Ironlake) for Dual Core version, 25W TDP.
  • an Intel Core i5/Core i7 processor (codenamed Arrandale-ULV contains 32nm Hillel and 45nm Ironlake) for Dual Core version, 18W TDP.
Wireless network Wireless Modules[18]
  • Intel Centrino Ultimate-N 6300 AGN mini-PCIe adapter (codenamed Puma Peak 3×3), or
  • Intel Centrino Advanced-N + WiMAX 6250 AGN mini-PCIe adapter (codenamed Kilmer Peak), or
  • Intel Centrino Advanced-N 6200 AGN mini-PCIe adapter (codenamed Puma Peak 2×2), or
  • Intel Centrino Wireless-N 1000 BGN mini-PCIe adapter (codenamed Condor Peak)

Huron River platform (2011)

The codename "Huron River" refers to the seventh-generation Centrino platform.

Centrino Huron River platform
Mobile chipset an Intel Mobile Express Series 6 chipset (PCHM codenamed Cougar Point[19]).
  • Gigabit Ethernet LAN controllers 82579LM and 82579LF (codenamed Lewisville).
Mobile processor Processors, based on Intel Sandy Bridge microarchitecture
Wireless network Wireless Modules
  • Intel Centrino Ultimate-N 6300 AGN mini-PCIe adapter [20] (codenamed Puma Peak 3×3), or
  • Intel Centrino Advanced-N + WiMAX 6250 AGN mini-PCIe adapter [21] (codenamed Kilmer Peak 2x2), or
  • Intel Centrino Advanced-N 6205 AGN mini-PCIe adapter [22] (codenamed Taylor Peak 2×2), or
  • Intel Centrino Advanced-N 6230 AGN mini-PCIe adapter with Bluetooth [23] (codenamed Rainbow Peak 2×2), or
  • Intel Centrino Wireless-N + WiMAX 6150 BGN mini-PCIe adapter [24] (codenamed Kelsey Peak 2x1), or
  • Intel Centrino Wireless-N 1030 BGN mini-PCIe adapter with Bluetooth[25] (codenamed Rainbow Peak 2×1), or
  • Intel Centrino Wireless-N 1000 BGN mini-PCIe adapter [26] (codenamed Condor Peak 2×1)

Chief River platform (2012)

The codename Chief River refers to the eighth-generation Centrino platform.

Centrino Chief River platform
Mobile chipset an Intel Mobile Express Series 7 chipset (PCHM codenamed Panther Point )
  • Gigabit Ethernet LAN controllers 82579LM and 82579LF (codenamed Lewisville).
Mobile processor Processors, based on Intel Ivy Bridge microarchitecture
Wireless network Wireless Modules
  • Intel Centrino Ultimate-N 6300
  • Intel Centrino Advanced-N 6235
  • Intel Centrino Advanced-N 6205
  • Intel Centrino Wireless-N 2230 (codenamed Jackson Peak)
  • Intel Centrino Wireless-N 2200
  • Intel Centrino Wireless-N 135
  • Intel Centrino Wireless-N 105 (codenamed Canyon Peak)

Shark Bay platform (2013)

The codename Shark Bay refers to the ninth-generation Centrino platform.

Centrino Shark Bay platform
Mobile chipset an Intel Mobile Express Series 8 chipset (PCHM codenamed Lynx Point)
  • Gigabit Ethernet LAN controllers I217LM and I217V (codenamed Clarkville).
Mobile processor Processors, based on Intel Haswell microarchitecture
Wireless network Wireless Modules Wilkins Peak

Jon Worrel predicted in 2012 that Shark Bay would comprise a single Multi-Chip Module (MCM) package.[27]

Mobile Internet Device

Main page: Mobile Internet device

Menlow platform (2008)

On March 2, 2008, Intel introduced the Intel Atom processor brand[28] for a new family of low-power processor platforms. The components have thin, small designs and work together to "enable the best mobile computing and Internet experience" on mobile and low-power devices.

Intel's second generation MID platform (codenamed Menlow) contains a 45 nm Intel Atom processor (codenamed Silverthorne) which can run up to 2.0 GHz and a System Controller Hub (codenamed Poulsbo) which includes Intel HD Audio (codenamed Azalia).

Centrino Menlow platform
Mobile chipset an Intel SCH (codenamed Poulsbo) with integrated GMA 500 graphics (PowerVR SGX 535 based)
Mobile processor a 45 nm Intel Atom CPU (codenamed Silverthorne)
Wireless network a wireless radio

This platform was initially branded as Centrino Atom but the logo was dropped in August 2008; the logo had caused confusion between laptop and MID with previous marketing of Centrino stating only Intel chipsets are being used. Hence MIDs will be branded as Atom to allow integration with other OEM chipsets for the low-end market.[29][30]

Intel Centrino Wireless

Intel Centrino Advanced-N 6205

Intel Centrino Wireless is the brand for Intel Wi-Fi and WiMAX adapters. The product line includes:

  • Intel Centrino Wireless-N 1000
  • Intel Centrino Advanced-N 6200
  • Intel Centrino Ultimate-N 6300
  • Intel Centrino Advanced-N + WiMAX 6250

Centrino with Intel vPro technology

Laptops with Intel vPro technology have hardware features that allow a system administrator to remotely access wired and wireless laptops for maintenance and servicing if the operating system is unresponsive or crashed and, when a laptop is connected to AC power (not on battery power), allow a sys-admin to remotely access the laptop when the system is asleep or laptop power is off. It is targeted more for businesses than consumers.[31]

  • Centrino laptop with Intel vPro technology (Santa Rosa platform)
  • Centrino 2 laptop with Intel vPro technology (Montevina platform)

Security technologies

Laptops with vPro have the typical dual-core or quad-core processor and wireless features of the Centrino family.

  • The vPro technology built into the chipset adds management, security, and remote-deployment features for: monitoring laptops (protected event logs, access to BIOS settings, out-of-band alerting, protected data storage), maintaining and updating systems (access to protected system information, remote power up, console redirection), repairing systems (remote boot, console redirection, preboot access to BIOS settings, protected events logs), and securing systems (remote power up, hardware filters for network traffic, agent presence checks/triggers, out-of-band alerting).
  • The 45 nm Centrino 2 package is based on the Penryn microprocessor and Q47/Q45 chipset. It includes a better graphics engine (integrated) than Centrino, and three key additional features: Transport Layer Security (TLS) secured communications over an open local area network (LAN) for wired laptops outside the corporate firewall (not supported for wireless states), support for Microsoft Network Access Protection (NAP), and support for out-of-band management and security features in Sx (all sleep states) when the laptop is inside the corporate firewall.

See also

References

  1. "Second-Generation Intel® Centrino TM Mobile Technology" (in en). Intel Technology Journal 9 (1). February 17, 2005. doi:10.1535/itj.0901. ISSN 1535-864X. https://www.intel.com/content/dam/www/public/us/en/documents/research/2005-vol09-iss-1-intel-technology-journal.pdf. 
  2. Connect with Intel® Centrino® Processor Technology
  3. Intel dumbs down dual Santa Rosa cores with IDA - The INQUIRER, http://www.theinquirer.net/default.aspx?article=35699 
  4. Intel 965 Express Chipset Family Datasheet - For the Intel 82Q965, 82Q963, 82G965 Graphics and Memory Controller Hub (GMCH) and Intel 82P965 Memory Controller Hub (MCH), http://www.intel.com/Products/Desktop/Chipsets/Q965-Q963/Q965-Q963-technicaldocuments.htm 
  5. Intel Santa Rosa Does Not Support DDR2-800, http://www.randomprocess.ca/intel-santa-rosa-does-not-support-ddr2-800/ 
  6. Flynn, Laurie J. (2007-09-18), "Intel Previews a New Family of Power-Saving Chips", The New York Times, https://www.nytimes.com/2007/09/18/technology/18cnd-chip.html?_r=1&oref=slogin, retrieved 2010-04-28 
  7. Rickwood, Lee, Intel Unveils Next Gen Processor, PCWorld.ca, http://www.pcworld.ca/news/column/71f851780a010408006ca32e2485d70f/pg1.htm, retrieved 2007-05-09 
  8. Santa Rosa Revealed, TrustedReviews, http://www.trustedreviews.com/notebooks/review/2007/04/17/Intel-Santa-Rosa-Revealed/p2 
  9. 9.0 9.1 Intel Wireless Connectivity Roadmap, The Register, https://www.theregister.co.uk/2006/10/06/intel_wireless_roadmap/ 
  10. Intel, NextGen feature Nokia chip, CNET, http://news.cnet.com/2100-1044_3-6120407.html?part=rss&tag=6120407&subj=news 
  11. Santa Rosa officially dubbed Centrino Pro, Engadget, https://www.engadget.com/2006/10/20/intels-santa-rosa-platform-officially-dubbed-centrino-pro/ 
  12. Kim, Arnold (2008-02-18), Intel Processors and Platform (Montevina) Due in June 2008, MacRumors.com, http://www.macrumors.com/2008/02/18/next-mobile-intel-processors-montevina-due-in-june-2008/ 
  13. Kircos, Bill (2008-05-28), Intel Delays Next-Generation Centrino Chipset, pcmag.com, https://www.pcmag.com/article2/0,1759,2309998,00.asp?kc=PCRSS03069TX1K0001121 
  14. Tony Smith (2006-10-11), Intel to follow 'Santa Rosa' Centrino with 'Montevina', The Register, http://www.reghardware.co.uk/2006/10/11/intel_centrino_roadmap/, retrieved 2006-10-19 
  15. Intel to launch Calpella notebook platform in 3Q09, digitimes.com, 2008-08-05, http://www.digitimes.com/news/a20080805PD201.html 
  16. Notebook vendors looking for delay of Intel's Calpella platform, digitimes.com, 2009-01-05, http://www.digitimes.com/news/a20090105PD206.html 
  17. CPU list, http://www.hwinfo.com/Lists/cpu.htm 
  18. Intel:不會再有Centrino 3平台 Centrino品牌被降格成網絡模組品牌, 電腦領域 HKEPC Hardware, 2009-08-05, http://global.hkepc.com/3844 
  19. Chipset list, http://www.hwinfo.com/Lists/chipset.htm 
  20. Intel® Centrino® Ultimate-N 6300 Intel webpage, March 2011
  21. Intel® Centrino® Advanced–N + WiMAX 6250 Intel webpage, March 2011
  22. Intel® Centrino® Advanced-N 6205 Intel webpage, March 2011
  23. Intel® Centrino® Advanced-N 6230 Intel webpage, March 2011
  24. Intel® Centrino® Advanced-N + WiMAX 6150 Intel webpage, March 2011
  25. Intel® Centrino® Wireless-N 1030 Intel webpage, March 2011
  26. Intel® Centrino® Wireless-N 1000 Intel webpage, March 2011
  27. Worrel, Jon (2012-04-15). "Intel migrates to desktop Multi-Chip Modules (MCMs) with 14nm Broadwell". http://www.fudzilla.com/home/item/26786-intel-migrates-to-desktop-multi-chip-module-mcm-with-14nm-broadwell. "The platform is called "Shark Bay" for notebooks and ultrabooks, and it will consist of a single Multi-Chip Module (MCM) package fully integrating the PCH from previous generation 22nm Ivy Bridge (2012) directly into the same die as the 22nm Haswell (2013) CPU." 
  28. Intel Announces Intel Atom Brand for New Family of Low-Power Processors, http://www.intel.com/pressroom/archive/releases/20080302comp.htm 
  29. Intel Centrino Atom logo being dropped, http://www.pocketables.net/2008/08/intel-centrino.html 
  30. Intel Drops Centrino Atom Brand After Five Months - Business Center - PC World, https://www.pcworld.com/article/149791/intel_drops_centrino_atom_brand_after_five_months.html 
  31. Intel Centrino 2 with vPro technology and Intel Core2 processor with vPro technology, Intel, http://download.intel.com/products/vpro/whitepaper/crossclient.pdf, retrieved 2008-08-07 

External links

Centrino
2003–2011
Succeeded by
Ultrabook