Engineering:Contact pad
From HandWiki
Contact pads or bond pads are designated surface areas of a printed circuit board (PCB) or die of an integrated circuit. Possibilities to contact to pads include soldering, wirebonding, flip chip mounting, or probe needles.
Further reading
- Jing Li, Evaluation and Improvement of the Robustness of a PCB Pad in a Lead-free Environment, ProQuest, 2007 ISBN:0-549-32110-1.
- Kraig Mitzner, Complete PCB Design Using OrCAD Capture and PCB Editor, Newnes, 2009 ISBN:0-08-094354-3.
- Deborah Lea, Fredirikus Jonck, Christopher Hunt, Solderability Measurements of PCB Pad Finishes and Geometries, National Physical Laboratory, 2001 OCLC 59500348.
This article does not cite any external source. HandWiki requires at least one external source. See citing external sources. (2021) (Learn how and when to remove this template message) |
![]() | Original source: https://en.wikipedia.org/wiki/Contact pad.
Read more |