Engineering:Zen 2

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Short description: 2019 AMD 7-nanometre processor microarchitecture
AMD Zen 2
AMD Zen 2 logo.png
General Info
Launched7 July 2019; 4 years ago (7 July 2019)[1]
Designed byAMD
Common manufacturer(s)
Cache
L1 cache64 KB per core
L2 cache512 KB per core
Architecture and classification
Min. feature sizeTSMC 7 nm[2][3]
TSMC 6 nm[4]
Instruction setAMD64 (x86_64)
Physical specifications
Cores
  • Up to 64
Socket(s)
Products, models, variants
Product code name(s)
  • Matisse (desktop)
  • Rome (server)[3]
  • Castle Peak (HEDT)
  • Renoir (Desktop APU, mobile and embedded)
  • Mendocino (mobile and embedded refresh)
History
PredecessorZen+
SuccessorZen 3

Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nanometer MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips (codename "Matisse"), Ryzen 4000U/H (codename "Renoir") and Ryzen 5000U (codename "Lucienne") for mobile applications, as Threadripper 3000 for high-end desktop systems,[5][6] and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019,[7][8] while the Zen 2-based Epyc server CPUs (codename "Rome") were released on 7 August 2019.[9] An additional chip, the Ryzen 9 3950X, was released in November 2019.[7]

At CES 2019, AMD showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads.[5] AMD CEO Lisa Su also said to expect more than eight cores in the final lineup.[10] At Computex 2019, AMD revealed that the Zen 2 "Matisse" processors would feature up to 12 cores, and a few weeks later a 16 core processor was also revealed at E3 2019, being the aforementioned Ryzen 9 3950X.[11][12]

Zen 2 includes hardware mitigations to the Spectre security vulnerability.[13] Zen 2-based EPYC server CPUs use a design in which multiple CPU dies (up to eight in total) manufactured on a 7 nm process ("chiplets") are combined with a 14 nm I/O die on each multi-chip module (MCM) package. Using this, up to 64 physical cores and 128 total compute threads (with simultaneous multithreading) are supported per socket. This architecture is nearly identical to the layout of the "pro-consumer" flagship processor Threadripper 3990X.[14] Zen 2 delivers about 15% more instructions per clock than Zen and Zen+,[15][16] the 14- and 12-nm microarchitectures utilized on first and second generation Ryzen respectively.

Both the PlayStation 5 and the Xbox Series X and Series S use chips based on the Zen 2 microarchitecture, with proprietary tweaks and different configurations in each system's implementation than AMD sells in its own commercially available APUs.[17][18]

Design

Two delidded Zen 2 processors designed with the multi-chip module approach. The CPU on the left/top (used for mainstream Ryzen CPUs) uses a smaller, less capable I/O die and up to two CCDs (only one is used on this particular example), while the one on the right/bottom (used for high-end desktop, HEDT, Ryzen Threadripper and server Epyc CPUs) uses a larger, more capable I/O die and up to eight CCDs.

Zen 2 is a significant departure from the physical design paradigm of AMD's previous Zen architectures, Zen and Zen+. Zen 2 moves to a multi-chip module design where the I/O components of the CPU are laid out on its own, separate die, which is also called a chiplet in this context. This separation has benefits in scalability and manufacturability. As physical interfaces don't scale very well with shrinks in process technology, their separation into a different die allows these components to be manufactured using a larger, more mature process node than the CPU dies. The CPU dies (referred to by AMD as core complex dies or CCDs), now more compact due to the move of I/O components onto another die, can be manufactured using a smaller process with fewer manufacturing defects than a larger die would exhibit (since the chances of a die having a defect increases with device (die) size) while also allowing for more dies per wafer. In addition, the central I/O die can service multiple chiplets, making it easier to construct processors with a large number of cores.[14][19][20]

Simplified illustration of the Zen 2 microarchitecture
On the left (top on mobile): Die shot of a Zen 2 Core Complex Die. On the right (bottom): Die shot of a Zen 2 EPYC I/O die.

With Zen 2, each CPU chiplet houses 8 CPU cores, arranged in 2 core complexes (CCXs), each of 4 CPU cores. These chiplets are manufactured using TSMC's 7 nanometer MOSFET node and are about 74 to 80 mm2 in size.[19] The chiplet has about 3.8 billion transistors, while the 12 nm I/O die (IOD) is ~125 mm2 and has 2.09 billion transistors.[21] The amount of L3 cache has been doubled to 32 MB, with each CCX in the chiplet now having access to 16 MB of L3 compared to the 8 MB of Zen and Zen+.[22] AVX2 performance is greatly improved by an increase in execution unit width from 128-bit to 256-bit.[23] There are multiple variants of the I/O die: one manufactured on GlobalFoundries 14 nanometer process, and another manufactured using the same company's 12 nanometer process. The 14 nanometer dies have more features and are used for the EPYC Rome processors, whereas the 12 nm versions are used for consumer processors.[19] Both processes have similar feature sizes, so their transistor density is also similar.[24]

AMD's Zen 2 architecture can deliver higher performance at a lower power consumption than Intel's Cascade Lake architecture, with an example being the AMD Ryzen Threadripper 3970X running with a TDP of 140 W in ECO mode delivering higher performance than the Intel Core i9-10980XE running with a TDP of 165 W.[25]

New features

  • Some new instruction set extensions: WBNOINVD, CLWB, RDPID, RDPRU, MCOMMIT. Each instruction uses its own CPUID bit.[26][27]
  • Hardware mitigations against the Spectre V4 speculative store bypass vulnerability.[28]
  • Zero-latency memory mirroring optimization (undocumented).[29]

Feature tables

CPUs

CPU features table

APUs

APU features table

Products

On 26 May 2019, AMD announced six Zen 2-based desktop Ryzen processors (codenamed "Matisse"). These included 6-core and 8-core variants in the Ryzen 5 and Ryzen 7 product lines, as well as a new Ryzen 9 line that includes the company's first 12-core and 16-core mainstream desktop processors. [30]

The Matisse I/O die is also used as the X570 chipset.

AMD's second generation of Epyc processors, codenamed "Rome", feature up to 64 cores, and were launched on 7 August 2019.[9]

Desktop CPUs

3000 series (Matisse)

4000 series (Renoir)

Based on the Ryzen 4000G series APUs which had the integrated graphics disabled.

Desktop APUs

Mobile processors

Renoir (4000 series)

Lucienne (5000 series)

Embedded processors

Server processors

Video game consoles and other embedded

Gallery

  • AMD Ryzen 7 3700X

  • Zen 2 I/O Die

  • Infrared die shot of the I/O Die

  • EPYC I/O Die

  • Zen 2 Core Complex Die (CCD)

  • AMD EPYC 7702 server processor.

  • A delidded AMD 7702 featuring 8 CCDs, with remains of the solder thermal interface material (TIM) on the chiplets.

See also

References

  1. ↑ "AMD Unleashes Ultimate PC Gaming Platform with Worldwide Availability of AMD Radeon RX 5700 Series Graphics Cards and AMD Ryzen 3000 Series Desktop Processors" (Press release). Santa Clara, California: Advanced Micro Devices, Inc. 2019-07-07. Retrieved 2020-11-07.
  2. ↑ Larabel, Michael (16 May 2017). "AMD Talks Up Vega Frontier Edition, Epyc, Zen 2, ThreadRipper". Phoronix. https://www.phoronix.com/scan.php?page=news_item&px=AMD-Financial-Day-2017. 
  3. ↑ 3.0 3.1 Cutress, Ian (20 June 2017). "AMD EPYC Launch Event Live Blog". AnandTech. http://www.anandtech.com/show/11562/amd-epyc-launch-event-live-blog-starts-4pm-et-. 
  4. ↑ Boshor, Gavin (20 September 2022). "AMD Launches Mendocino APUs: Zen 2-based Ryzen and Athlon 7020 Series with RDNA 2 Graphics". AnandTech. https://www.anandtech.com/show/17584/amd-launches-mendocino-apus-zen-2-ryzen-and-athlon-7020-series-with-rdna-2-graphics. 
  5. ↑ 5.0 5.1 Cutress, Ian (9 January 2019). "AMD Ryzen third Gen 'Matisse' Coming Mid 2019: Eight Core Zen 2 with PCIe 4.0 on Desktop". AnandTech. https://www.anandtech.com/show/13829/amd-ryzen-3rd-generation-zen-2-pcie-4-eight-core. 
  6. ↑ online, heise. "AMD Ryzen 3000: 12-Kernprozessoren für den Mainstream". https://www.heise.de/newsticker/meldung/AMD-Ryzen-3000-12-Kernprozessoren-fuer-den-Mainstream-4432392.html. 
  7. ↑ 7.0 7.1 Leather, Antony. "AMD Ryzen 9 3900X and Ryzen 7 3700X Review: Old Ryzen Owners Look Away Now" (in en). https://www.forbes.com/sites/antonyleather/2019/07/07/amd-ryzen-9-3900x-and-ryzen-7-3700x-review-old-ryzen-owners-look-away-now/. 
  8. ↑ "AMD Ryzen 3000 CPUs launching July 7 with up to 12 cores" (in en-GB). https://www.pcgamesn.com/amd/amd-ryzen-3000-announcement. 
  9. ↑ 9.0 9.1 "2nd Gen AMD EPYC Processors Set New Standard for the Modern Datacenter with Record-Breaking Performance and Significant TCO Savings". 7 August 2019. https://www.amd.com/en/press-releases/2019-08-07-2nd-gen-amd-epyc-processors-set-new-standard-for-the-modern-datacenter. 
  10. ↑ Hachman, Mark (9 January 2019). "AMD's CEO Lisa Su confirms ray tracing GPU development, hints at more 3rd-gen Ryzen cores". https://www.pcworld.com/article/3332205/amd/amd-ceo-lisa-su-interview-ryzen-raytracing-radeon.html. 
  11. ↑ Curtress, Ian (26 May 2019). "AMD Ryzen 3000 Announced: Five CPUs, 12 Cores for $499, Up to 4.6 GHz, PCIe 4.0, Coming 7/7". https://www.anandtech.com/show/14407/amd-ryzen-3000-announced-five-cpus-12-cores-for-499-up-to-46-ghz-pcie-40-coming-77.html. 
  12. ↑ Thomas, Bill (10 June 2019). "AMD announces the Ryzen 9 3950X, a 16-core mainstream processor". https://www.techradar.com/uk/news/amd-announced-the-ryzen-9-3950x-a-16-core-mainstream-processor. 
  13. ↑ Alcorn, Paul (31 January 2018). "AMD Predicts Double-Digit Revenue Growth In 2018, Ramps Up GPU Production". Tom's Hardware. http://www.tomshardware.com/news/amd-stock-financials-earnings-cpu,36430.html. 
  14. ↑ 14.0 14.1 Shilov, Anton (6 November 2018). "AMD Unveils 'Chiplet' Design Approach: 7nm Zen 2 Cores Meet 14 nm I/O Die". https://www.anandtech.com/show/13560/amd-unveils-chiplet-design-approach-7nm-zen-2-cores-meets-14-nm-io-die. 
  15. ↑ Cutress, Ian. "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". https://www.anandtech.com/show/14525/amd-zen-2-microarchitecture-analysis-ryzen-3000-and-epyc-rome. 
  16. ↑ Walton, Steven (16 November 2020). "AMD Ryzen 5000 IPC Performance Tested". https://www.techspot.com/article/2143-ryzen-5000-ipc-performance/. Retrieved 18 April 2021. 
  17. ↑ Warren, Tom (24 February 2020). "Microsoft reveals more Xbox Series X specs, confirms 12 teraflops GPU". The Verge. https://www.theverge.com/2020/2/24/21150578/microsoft-xbox-series-x-specs-performance-12-teraflops-gpu-details-features. 
  18. ↑ Leadbetter, Richard (18 March 2020). "Inside PlayStation 5: the specs and the tech that deliver Sony's next-gen vision". Eurogamer. https://www.eurogamer.net/articles/digitalfoundry-2020-playstation-5-specs-and-tech-that-deliver-sonys-next-gen-vision. 
  19. ↑ 19.0 19.1 19.2 Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". p. 1. https://www.anandtech.com/show/14525/amd-zen-2-microarchitecture-analysis-ryzen-3000-and-epyc-rome. 
  20. ↑ De Gelas, Johan (7 August 2019). "AMD Rome Second Generation EPYC Review: 2x 64-core Benchmarked". https://www.anandtech.com/show/14694/amd-rome-epyc-2nd-gen/2. 
  21. ↑ November 2019, Paul Alcorn 21 (21 November 2019). "AMD Ryzen 9 3900X and Ryzen 7 3700X Review: Zen 2 and 7nm Unleashed". https://www.tomshardware.com/reviews/ryzen-9-3900x-7-3700x-review,6214.html. 
  22. ↑ Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". https://www.anandtech.com/show/14525/amd-zen-2-microarchitecture-analysis-ryzen-3000-and-epyc-rome/2. 
  23. ↑ Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". https://www.anandtech.com/show/14525/amd-zen-2-microarchitecture-analysis-ryzen-3000-and-epyc-rome/9. 
  24. ↑ Schor, David (22 July 2018). "VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP". https://fuse.wikichip.org/news/1497/vlsi-2018-globalfoundries-12nm-leading-performance-12lp/. 
  25. ↑ Mujtaba, Hassan (24 December 2019). "AMD Ryzen Threadripper 3970X Is An Absolutely Efficient Monster CPU". https://wccftech.com/amd-ryzen-threadripper-3970x-32-core-efficient-monster-cpu-eco-mode-tests/. 
  26. ↑ "AMD Zen 2 CPUs Come With A Few New Instructions - At Least WBNOINVD, CLWB, RDPID - Phoronix". https://www.phoronix.com/scan.php?page=news_item&px=AMD-Zen-2-New-Instructions. 
  27. ↑ "GNU Binutils Adds Bits For AMD Zen 2's RDPRU + MCOMMIT Instructions - Phoronix". https://www.phoronix.com/scan.php?page=news_item&px=GNU-Binutils-Zen-2-Bits. 
  28. ↑ btarunr (12 June 2019). "AMD Zen 2 has Hardware Mitigation for Spectre V4". https://www.techpowerup.com/256478/amd-zen-2-has-hardware-mitigation-for-spectre-v4. 
  29. ↑ Agner, Fog. "Surprising new feature in AMD Ryzen 3000". https://www.agner.org/forum/viewtopic.php?f=1&t=41. 
  30. ↑ Cutress, Ian (26 May 2019). "AMD Ryzen 3000 Announced: Five CPUs, 12 Cores for $499, Up to 4.6 GHz, PCIe 4.0, Coming 7/7". https://www.anandtech.com/show/14407/amd-ryzen-3000-announced-five-cpus-12-cores-for-499-up-to-46-ghz-pcie-40-coming-77. 
  31. ↑ "AMD 4700S 8-Core Processor Desktop Kit". https://www.amd.com/en/desktop-kits/amd-4700s. 




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