Engineering:List of Intel Core M processors

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Intel Core M is a family of ultra low-voltage microprocessors belonging to the Intel Core series and designed specifically for ultra-thin notebooks, 2-in-1 detachables, and other mobile devices. The thermal design power (TDP) of all Core M microprocessors is 5 watts or lower. Intel Core M microprocessors are generally used in fanless devices due to their low TDP.

Broadwell microarchitecture (5th generation)

"Broadwell-Y" (SoC, dual-core, 14 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache.
  • All models except M-5Y10a and M-5Y70 support Configurable TDP.
  • M-5Y70 and M-5Y71 also support Intel vPro.
  • GPU and memory controller (up to 2 × DDR3-1600) are integrated onto the processor die.
  • Peripherals include 12 lanes of PCI Express 2.0, in x4, x2, and x1 configurations.
  • Package size: 30 mm × 16.5 mm
  • Transistors: 1.3 billion
  • Die size: 82 mm²


| Core M-5Y10

|

  • SR217 (E0)

| 2 | 800 MHz | 2 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 5300 | 100–800 MHz

|

4.5 W

| BGA-1234 | DMI 2.0 | style="text-align:right;" | September 2014

|

  • FH8065801879602

| $281 |-


| Core M-5Y10a

|

  • SR218 (E0)

| 2 | 800 MHz | 2 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 5300 | 100–800 MHz

|

4.5 W

| BGA-1234 | DMI 2.0 | style="text-align:right;" | September 2014

|

  • FH8065801988602

| $281 |-


| Core M-5Y10c

|

  • SR23C (F0)

| 2 | 800 MHz | 2 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 5300 | 300–800 MHz

|

4.5 W

| BGA-1234 | DMI 2.0 | style="text-align:right;" | October 2014

|

  • FH8065802062002

| $281 |-


| Core M-5Y31

|

  • SR23G (F0)

| 2 | 900 MHz | 2.4 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 5300 | 300–850 MHz

|

4.5 W

| BGA-1234 | DMI 2.0 | style="text-align:right;" | October 2014

|

  • FH8065802061902

| $281 |-


| Core M-5Y51

|

  • SR23L (F0)

| 2 | 1.1 GHz | 2.6 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 5300 | 300–900 MHz

|

4.5 W

| BGA-1234 | DMI 2.0 | style="text-align:right;" | October 2014

|

  • FH8065802061802

| $281 |-


| Core M-5Y70

|

  • SR216 (E0)

| 2 | 1.1 GHz | 2.6 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 5300 | 100–850 MHz

|

4.5 W

| BGA-1234 | DMI 2.0 | style="text-align:right;" | September 2014

|

  • FH8065801875604

| $281 |-


| Core M-5Y71

|

  • SR23Q (F0)

| 2 | 1.2 GHz | 2.9 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 5300 | 300–900 MHz

|

4.5 W

| BGA-1234 | DMI 2.0 | style="text-align:right;" | October 2014

|

  • FH8065802061602

| $281 |-


|}

Skylake microarchitecture (6th generation)

"Skylake-Y" (SoC, dual-core, 14 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, Configurable TDP.
  • m5-6Y57 and m7-6Y75 also support Intel vPro, Intel TXT.
  • GPU and memory controller (up to 2 × DDR3-1866) are integrated onto the processor die.
  • Peripherals include 10 lanes of PCI Express 3.0, in x4, x2, and x1 configurations.
  • Package size: 20 mm × 16.5 mm
  • Transistors: TBD
  • Die size: TBD


| Core m3-6Y30

|

  • SR2EN (D1)

| 2 (4) | 900 MHz | 2.2 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 515 | 300–850 MHz

|

4.5 W

| BGA 1515 | DMI 3.0 | style="text-align:right;" | September 2015

|

  • HE8066201930521

| $281 |-


| Core m5-6Y54

|

  • SR2EM (D1)

| 2 (4) | 1.1 GHz | 2.7 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 515 | 300–900 MHz

|

4.5 W

| BGA 1515 | DMI 3.0 | style="text-align:right;" | September 2015

|

  • HE8066201930524

| $281 |-


| Core m5-6Y57

|

  • SR2EG (D1)

| 2 (4) | 1.1 GHz | 2.8 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 515 | 300–900 MHz

|

4.5 W

| BGA 1515 | DMI 3.0 | style="text-align:right;" | September 2015

|

  • HE8066201922876

| $281 |-


| Core m7-6Y75

|

  • SR2EH (D1)

| 2 (4) | 1.2 GHz | 3.1 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 515 | 300–1000 MHz

|

4.5 W

| BGA 1515 | DMI 3.0 | style="text-align:right;" | September 2015

|

  • HE8066201922875

| $393 |-


|}

Kaby Lake microarchitecture (7th/8th generation)

"Kaby Lake-Y" (SoC, dual-core, 14 nm)

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, Configurable TDP.
  • GPU and memory controller (up to 2 × LPDDR3-1866) are integrated onto the processor die.
  • Peripherals include 10 lanes of PCI Express 3.0, in x4, x2, and x1 configurations.
  • Package size: 20 mm × 16.5 mm
  • Transistors: TBD
  • Die size: TBD


| Core m3-7Y30

|

  • SR2ZY (H0)
  • SR347 (H0)

| 2 (4) | 1 GHz | 2.6 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 615 | 300–900 MHz

|

4.5 W

| BGA 1515 | DMI 3.0 | style="text-align:right;" | September 2016

|

  • HE8067702739824

| $281 |-


| Core m3-7Y32

|

  • SR346 (H0)

| 2 (4) | 1.1 GHz | 3.0 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 615 | 300–900 MHz

|

4.5 W

| BGA 1515 | DMI 3.0 | style="text-align:right;" | April 2017

|

  • HE8067702739830

| $281 |-


|}

"Amber Lake-Y" (dual-core, 14 nm)

| Core m3-8100Y

|

  • SRD23 (H0)

| 2 (4) | 1.1 GHz | 3.4 GHz | 2 × 256 KiB | 4 MiB | HD Graphics 615 | 300–900 MHz

|

5 W

| BGA 1515 | DMI 3.0 | style="text-align:right;" | August 2018

|

  • HE8067702739859

| $281 |-


|}

See also

References

External links



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